JP3931454B2 - 半導体装置の電極の製造方法 - Google Patents

半導体装置の電極の製造方法 Download PDF

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Publication number
JP3931454B2
JP3931454B2 JP31896598A JP31896598A JP3931454B2 JP 3931454 B2 JP3931454 B2 JP 3931454B2 JP 31896598 A JP31896598 A JP 31896598A JP 31896598 A JP31896598 A JP 31896598A JP 3931454 B2 JP3931454 B2 JP 3931454B2
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Japan
Prior art keywords
electrode
semiconductor device
manufacturing
electroless plating
light
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Expired - Fee Related
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Japanese (ja)
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JP2000150422A (ja
JP2000150422A5 (enExample
Inventor
夏也 石川
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Sony Corp
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Sony Corp
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Priority to JP31896598A priority Critical patent/JP3931454B2/ja
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Publication of JP2000150422A5 publication Critical patent/JP2000150422A5/ja
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  • Electrodes Of Semiconductors (AREA)
JP31896598A 1998-11-10 1998-11-10 半導体装置の電極の製造方法 Expired - Fee Related JP3931454B2 (ja)

Priority Applications (1)

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JP31896598A JP3931454B2 (ja) 1998-11-10 1998-11-10 半導体装置の電極の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31896598A JP3931454B2 (ja) 1998-11-10 1998-11-10 半導体装置の電極の製造方法

Publications (3)

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JP2000150422A JP2000150422A (ja) 2000-05-30
JP2000150422A5 JP2000150422A5 (enExample) 2005-10-27
JP3931454B2 true JP3931454B2 (ja) 2007-06-13

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JP31896598A Expired - Fee Related JP3931454B2 (ja) 1998-11-10 1998-11-10 半導体装置の電極の製造方法

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JP (1) JP3931454B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3483490B2 (ja) 1999-02-16 2004-01-06 シャープ株式会社 半導体装置の製造方法
JP4549636B2 (ja) * 2003-04-22 2010-09-22 株式会社荏原製作所 基板処理装置
JP4998763B2 (ja) * 2005-03-31 2012-08-15 地方独立行政法人青森県産業技術センター 配線付基板およびその製造方法並びに表示装置
JP4775369B2 (ja) * 2007-12-17 2011-09-21 富士電機株式会社 半導体チップ、半導体装置および製造方法
JP2011026680A (ja) * 2009-07-28 2011-02-10 Renesas Electronics Corp 半導体装置の製造方法及び半導体装置の製造装置
JP5528938B2 (ja) * 2010-07-29 2014-06-25 シャープ株式会社 無電解メッキ処理装置および無電解メッキ処理方法

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