JP3930486B2 - 半導体装置およびその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 94
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 49
- 229920005591 polysilicon Polymers 0.000 claims description 49
- 229910021332 silicide Inorganic materials 0.000 claims description 46
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 14
- 239000003870 refractory metal Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000007772 electrode material Substances 0.000 claims 5
- 239000010410 layer Substances 0.000 description 90
- 238000009792 diffusion process Methods 0.000 description 40
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 11
- 229910008484 TiSi Inorganic materials 0.000 description 7
- 239000012535 impurity Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000605 extraction Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
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- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
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- H01L29/4975—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2 being a silicide layer, e.g. TiSi2
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
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Description
本発明の第1実施形態による半導体装置を図1および図2を参照して説明する。図1は、第1実施形態による半導体装置の構成を示す断面図であり、図2は、第1実施形態による半導体装置の後述するソース電極を形成する前の平面図である。なお、図1は、図2に示す切断線A−A’に沿って切断したときの断面図に相当する。
次に、本発明の第2実施形態による半導体装置の構成を、図12(a)乃至図12(d)を参照して説明する。図12(a)乃至図12(d)は、本実施形態による半導体装置のゲート電極の形成方法を説明する製造工程断面図である。この実施形態による半導体装置は、図1に示す第1実施形態による半導体装置に比べて、ゲート電極20のシリサイドからなる電極層20bの膜厚を厚くした構成となっている。ゲート電極20のシリサイドからなる電極層20bの膜厚を厚くする以外は、第1実施形態の半導体装置と同じ構成となっている。
次に、本発明の第3実施形態による半導体装置を、図13を参照して説明する。図13は、本実施形態による半導体装置の構成を示す断面図である。この実施形態による半導体装置は、図1に示す第1実施形態による半導体装置において、ゲート電極20のポリシリコンからなる電極膜20aをシリサイド層とした構成となっている。すなわち、ゲート電極20はシリサイドのみからなっている。ゲート電極20がシリサイドのみからなっている以外は、第1実施形態の半導体装置と同じ構成となっている。
2 N+型の拡散層(ドレイン)
4 N−型の拡散層
6 P型の拡散層
8 N+型の拡散層(ソース)
10 SiO2からなる第2パターン
12 トレンチ
14 ゲート絶縁膜
20 ゲート電極
20a ポリシリコンからなる電極膜
20b シリサイドからなる電極膜
21 Ti/TiNの積層膜
22 ポリシリコン膜
22a シリサイド層
23 ポリシリコン膜
24 空洞
25 ゲート引き出し電極
27 ゲートパッド
30 絶縁膜
32 P+型拡散層
40 ソース電極
Claims (5)
- 第1導電型の第1半導体層と、
前記第1半導体層上に形成された第1導電型と異なる第2導電型の第2半導体層と、
前記第2半導体層上に選択的に形成された第1導電型の第3半導体層と、
前記第3半導体層および第2半導体層を貫通し前記第1半導体層に達するトレンチと、
前記トレンチ内の側面および底面に沿って形成されたゲート絶縁膜と、
前記トレンチの側面の前記ゲート絶縁膜に接するように形成され、前記ゲート絶縁膜に接する面と反対側の面が前記トレンチの底部の前記ゲート絶縁膜とともに、前記トレンチの前記底部から開口部側に延在する空洞を形成するゲート電極と、
を備えたことを特徴とする半導体装置。 - 前記ゲート電極は、前記ゲート絶縁膜に接する第1電極材料からなる第1電極膜と、前記第1電極膜に接する第2電極材料からなる第2電極膜とを備えていることを特徴とする請求項1記載の半導体装置。
- 前記第2電極材料は前記第1電極材料より抵抗が低いことを特徴とする請求項2記載の半導体装置。
- 前記第2電極材料は、シリサイドから構成されていることを特徴とする請求項2記載の半導体装置。
- 第1導電型の第1半導体層と、前記第1半導体層上に形成された第1導電型と異なる第2導電型の第2半導体層と、前記第2半導体層上に選択的に形成された第1導電型の第3半導体層と、を有する半導体基板に、前記第3半導体層および第2半導体層を貫通し前記第1半導体層に達するトレンチを形成する工程と、
前記トレンチ内の側面および底面に沿ってゲート絶縁膜を形成する工程と、
前記トレンチ内の前記ゲート絶縁膜に沿ってポリシリコンからなる第1電極膜を形成する工程と、
前記トレンチの底部の前記第1電極膜を除去し、前記トレンチ内の側面に前記第1電極膜を残存させる工程と、
前記トレンチ内に側面に残存している前記第1電極膜を覆う高融点金属膜を形成する工程と、
熱処理を行うことにより、前記第1電極膜のシリコンと前記高融点金属とを反応させ高融点金属シリサイド層を形成する工程と、
未反応の高融点金属を除去することにより、前記トレンチの底部の前記ゲート絶縁膜と前記高融点金属シリサイド層の表面とによって、前記トレンチの前記底部から開口部側に延在する空洞を形成する工程と、
を備えたことを特徴とする半導体装置の製造方法。
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Application Number | Priority Date | Filing Date | Title |
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JP2004051900A JP3930486B2 (ja) | 2004-02-26 | 2004-02-26 | 半導体装置およびその製造方法 |
US10/820,792 US7045858B2 (en) | 2004-02-26 | 2004-04-09 | Semiconductor device and method of manufacturing the same |
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JP2004051900A JP3930486B2 (ja) | 2004-02-26 | 2004-02-26 | 半導体装置およびその製造方法 |
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JP2005243932A JP2005243932A (ja) | 2005-09-08 |
JP3930486B2 true JP3930486B2 (ja) | 2007-06-13 |
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Cited By (2)
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US11251278B2 (en) | 2019-12-27 | 2022-02-15 | Kabushiki Kaisha Toshiba | Trench-gate MOS transistor and method for manufacturing |
US11876132B2 (en) | 2021-03-19 | 2024-01-16 | Kabushiki Kaisha Toshiba | Semiconductor device |
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EP1536480A1 (en) * | 2003-11-28 | 2005-06-01 | STMicroelectronics S.r.l. | Semiconductor power device with insulated gate, trenchgate structure and corresponding manufacturing method |
US7671441B2 (en) * | 2005-04-05 | 2010-03-02 | International Rectifier Corporation | Trench MOSFET with sidewall spacer gates |
JP2007035841A (ja) * | 2005-07-26 | 2007-02-08 | Toshiba Corp | 半導体装置 |
JP2007180310A (ja) * | 2005-12-28 | 2007-07-12 | Toshiba Corp | 半導体装置 |
JP4486103B2 (ja) | 2007-03-19 | 2010-06-23 | Okiセミコンダクタ株式会社 | 加速度センサ、及び加速度センサの製造方法 |
JP5583315B2 (ja) | 2007-07-19 | 2014-09-03 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置及びその製造方法 |
JP5221976B2 (ja) * | 2008-02-19 | 2013-06-26 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
US8664713B2 (en) | 2008-12-31 | 2014-03-04 | Stmicroelectronics S.R.L. | Integrated power device on a semiconductor substrate having an improved trench gate structure |
IT1396561B1 (it) | 2009-03-13 | 2012-12-14 | St Microelectronics Srl | Metodo per realizzare un dispositivo di potenza con struttura trench-gate e relativo dispositivo |
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CN103035498A (zh) * | 2012-05-11 | 2013-04-10 | 上海华虹Nec电子有限公司 | 成长低应力igbt沟槽型栅极的方法 |
CN103050388A (zh) * | 2012-07-27 | 2013-04-17 | 上海华虹Nec电子有限公司 | Igbt沟槽型栅极的制造方法 |
JP5935948B2 (ja) * | 2013-08-06 | 2016-06-15 | 富士電機株式会社 | トレンチゲートmos型半導体装置およびその製造方法 |
JP2017050331A (ja) * | 2015-08-31 | 2017-03-09 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
CN112951981A (zh) * | 2019-12-11 | 2021-06-11 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
US20240030156A1 (en) * | 2021-08-11 | 2024-01-25 | Innoscience (suzhou) Semiconductor Co., Ltd. | Semiconductor device and method for manufacturing the same |
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JPH0750411A (ja) | 1993-08-06 | 1995-02-21 | Kawasaki Steel Corp | 半導体装置の製造方法 |
JP3197134B2 (ja) * | 1994-01-18 | 2001-08-13 | 株式会社東芝 | 半導体装置 |
US5937296A (en) * | 1996-12-20 | 1999-08-10 | Siemens Aktiengesellschaft | Memory cell that includes a vertical transistor and a trench capacitor |
US6127712A (en) * | 1998-05-22 | 2000-10-03 | Texas Instruments--Acer Incorporated | Mosfet with buried contact and air-gap gate structure |
DE69806484D1 (de) * | 1998-11-17 | 2002-08-14 | St Microelectronics Srl | Methode zur Herstellung von einem MOSFET mit einem vertikalen Kanal |
JP3773755B2 (ja) | 2000-06-02 | 2006-05-10 | セイコーインスツル株式会社 | 縦形mosトランジスタ及びその製造方法 |
-
2004
- 2004-02-26 JP JP2004051900A patent/JP3930486B2/ja not_active Expired - Fee Related
- 2004-04-09 US US10/820,792 patent/US7045858B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11251278B2 (en) | 2019-12-27 | 2022-02-15 | Kabushiki Kaisha Toshiba | Trench-gate MOS transistor and method for manufacturing |
US11996458B2 (en) | 2019-12-27 | 2024-05-28 | Kabushiki Kaisha Toshiba | Trench-gate MOS transistor and method for manufacturing the same |
US11876132B2 (en) | 2021-03-19 | 2024-01-16 | Kabushiki Kaisha Toshiba | Semiconductor device |
Also Published As
Publication number | Publication date |
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JP2005243932A (ja) | 2005-09-08 |
US7045858B2 (en) | 2006-05-16 |
US20050191810A1 (en) | 2005-09-01 |
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