JP3898761B2 - キャリアテープ - Google Patents

キャリアテープ Download PDF

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Publication number
JP3898761B2
JP3898761B2 JP52363297A JP52363297A JP3898761B2 JP 3898761 B2 JP3898761 B2 JP 3898761B2 JP 52363297 A JP52363297 A JP 52363297A JP 52363297 A JP52363297 A JP 52363297A JP 3898761 B2 JP3898761 B2 JP 3898761B2
Authority
JP
Japan
Prior art keywords
carrier tape
strip
strip portion
weight percent
polyethylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP52363297A
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English (en)
Japanese (ja)
Other versions
JP2000502310A (ja
JP2000502310A5 (enExample
Inventor
バード，ジェラルド・シー
フリン，スティーブン・ジェイ
ボール，デイビッド・エル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
3M Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Co filed Critical 3M Co
Publication of JP2000502310A publication Critical patent/JP2000502310A/ja
Publication of JP2000502310A5 publication Critical patent/JP2000502310A5/ja
Application granted granted Critical
Publication of JP3898761B2 publication Critical patent/JP3898761B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
JP52363297A 1995-12-21 1996-11-11 キャリアテープ Expired - Fee Related JP3898761B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/576,405 1995-12-21
US08/576,405 US5857572A (en) 1995-12-21 1995-12-21 Component carrier tape
PCT/US1996/018188 WO1997024022A1 (en) 1995-12-21 1996-11-11 Component carrier tape

Publications (3)

Publication Number Publication Date
JP2000502310A JP2000502310A (ja) 2000-02-29
JP2000502310A5 JP2000502310A5 (enExample) 2004-10-28
JP3898761B2 true JP3898761B2 (ja) 2007-03-28

Family

ID=24304283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52363297A Expired - Fee Related JP3898761B2 (ja) 1995-12-21 1996-11-11 キャリアテープ

Country Status (8)

Country Link
US (1) US5857572A (enExample)
EP (1) EP0868840A1 (enExample)
JP (1) JP3898761B2 (enExample)
KR (1) KR19990072218A (enExample)
IL (1) IL124910A (enExample)
MY (1) MY115230A (enExample)
TW (1) TW374748B (enExample)
WO (1) WO1997024022A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6027802A (en) * 1997-10-23 2000-02-22 Four Piliars Enterprise Co., Ltd. Cover tape for packaging
DE29916398U1 (de) 1999-09-17 2000-01-05 Abb Patent Gmbh, 68309 Mannheim Gurtband zum Transport und Zuführung der Bauelemente zu einer Bestückungseinrichtung
US7014896B1 (en) * 1999-11-29 2006-03-21 Denki Kagaku Kogyo Kabushiki Kaisha Packaging container for electronic part
JP4424524B2 (ja) * 2000-04-12 2010-03-03 Ｏｋｉセミコンダクタ株式会社 チップトレイ
DE10032415A1 (de) * 2000-07-04 2001-10-18 Infineon Technologies Ag Vorrichtung zum Verpacken und zum Transport von elektrischen Bauteilen und Herstellungsverfahren
DE10044418C2 (de) * 2000-09-08 2002-09-19 Siemens Ag Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt
US7086526B2 (en) 2001-08-17 2006-08-08 Clearlab International Pte Ltd. Packaging for disposable soft contact lenses
CN1980582B (zh) 2001-08-17 2010-12-22 美你康株式会社 用于用后即弃式软隐形眼镜的包装
AU2002348875A1 (en) * 2001-12-05 2003-06-17 Koninklijke Philips Electronics N.V. Method of and device for packaging electronic components thus packaged
DE10222620A1 (de) * 2002-05-17 2003-12-04 Georg Rudolf Sillner Verfahren zum Verarbeiten von elektrischen Bauteilen, insbesondere zum Verarbeiten von Halbleiterchips sowie elektrischen Bauelementen, sowie Vorrichtung zum Durchführen des Verfahrens
US7832552B2 (en) 2002-08-17 2010-11-16 Menicon Co. Ltd. Duo packaging for disposable soft contact lenses using a substrate
US20040035747A1 (en) * 2002-08-21 2004-02-26 Butler Michael S. Temporary electronic component-carrying tape with weakened areas and related methods
US7127805B2 (en) * 2002-11-20 2006-10-31 Intel Corporation Electronic device carrier and manufacturing tape
JP2006117250A (ja) * 2004-10-19 2006-05-11 International Chemical:Kk 電子部品搬送体及びその製造方法
JP4517856B2 (ja) * 2004-12-27 2010-08-04 Ｔｄｋ株式会社 電子部品連
JP4832769B2 (ja) 2005-02-14 2011-12-07 メニコン シンガポール ピーティーイー． リミテッド 包装体
US10865028B2 (en) 2005-02-14 2020-12-15 Mentcon Singapore Pte Ltd. Heat sealable, retortable laminated foil
CN100447053C (zh) * 2005-12-05 2008-12-31 科研技术顾问有限公司 半导体载板的固定方法
US8132673B1 (en) * 2008-03-07 2012-03-13 Charles Gutentag Method and apparatus for retention of small components on adhesive backed carrier tape
KR20140044369A (ko) 2011-06-17 2014-04-14 베리 플라스틱스 코포레이션 컵용 단열 슬리브
JP5790633B2 (ja) * 2012-12-14 2015-10-07 株式会社村田製作所 キャリアテープ、包装用テープおよび電子部品連
MX388908B (es) 2013-03-14 2025-03-20 Berry Plastics Corp Contenedor.
WO2015006772A1 (en) * 2013-07-12 2015-01-15 Berry Plastics Corporation Polymeric material for container
US9562140B2 (en) 2013-08-16 2017-02-07 Berry Plastics Corporation Polymeric material for an insulated container
TW201521993A (zh) 2013-08-30 2015-06-16 Berry Plastics Corp 用於容器之聚合材料
JP6506525B2 (ja) * 2014-10-10 2019-04-24 デンカ株式会社 パンチキャリアテープ用シート
WO2016141179A1 (en) 2015-03-04 2016-09-09 Berry Plastics Corporation Polymeric material for container
DE102016103490A1 (de) * 2016-02-26 2017-08-31 Cqlt Saargummi Technologies S.À.R.L. Verfahren zur Herstellung eines Dichtungselements
US11452249B2 (en) * 2017-12-11 2022-09-20 Delphon Industries, Llc Carrier for reversibly immobilizing one or more objects
DE102018114071A1 (de) * 2018-06-13 2019-05-29 Infineon Technologies Ag Chip-blister-anordnungen und verfahren zum kontaktieren von halbleiter-chips
EP4585387A3 (en) * 2019-06-27 2025-10-08 Moxietec, LLC Polymer foam articles and methods of making polymer foams
US20210347958A1 (en) 2019-06-27 2021-11-11 Moxietec, Llc Polymer foam articles and methods of making polymer foams

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4231901A (en) * 1978-06-23 1980-11-04 Charleswater Products, Inc. Electrically conductive foam and method of preparation and use
GB2040569B (en) * 1978-12-26 1983-09-01 Murata Manufacturing Co Chip-like electronic component series and method for supplying chip-like electronic components
US4657137A (en) * 1981-05-22 1987-04-14 North American Philips Corporation Multi-chip packaging system
EP0066339A2 (en) * 1981-05-22 1982-12-08 North American Philips Corporation Polyfoam chip carrier tape
JPS59158596A (ja) * 1983-02-28 1984-09-08 奥井　徳次郎 小型電子部品の収納方法
US4581262A (en) * 1985-01-14 1986-04-08 Owens-Illinois, Inc. Coextruded multilayer sheet and sleeve label made therefrom
JPH0741595B2 (ja) * 1988-06-11 1995-05-10 武士 山本 紙製キャリアテープの製造方法およびその製造方法に使用する金型
JPH04128147A (ja) * 1990-09-11 1992-04-28 Toyo Chem Co Ltd チップキャリヤ―テープ
US5150787A (en) * 1991-02-21 1992-09-29 Minnesota Mining And Manufacturing Company Component carrier tape
US5132160A (en) * 1991-02-21 1992-07-21 Minnesota Mining And Manufacturing Company Component carrier tape
US5203143A (en) * 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5396988A (en) * 1992-04-30 1995-03-14 Minnesota Mining And Manufacturing Company Electronic component carrier tape with generic pockets
US5325654A (en) * 1992-06-19 1994-07-05 Minnesota Mining And Manufacturing Company Carrier tape with cover strip

Also Published As

Publication number Publication date
WO1997024022A1 (en) 1997-07-03
MY115230A (en) 2003-04-30
IL124910A (en) 2003-03-12
JP2000502310A (ja) 2000-02-29
TW374748B (en) 1999-11-21
EP0868840A1 (en) 1998-10-07
IL124910A0 (en) 1999-01-26
KR19990072218A (ko) 1999-09-27
US5857572A (en) 1999-01-12

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