KR19990072218A - 소자 캐리어 테이프 - Google Patents
소자 캐리어 테이프 Download PDFInfo
- Publication number
- KR19990072218A KR19990072218A KR1019980704616A KR19980704616A KR19990072218A KR 19990072218 A KR19990072218 A KR 19990072218A KR 1019980704616 A KR1019980704616 A KR 1019980704616A KR 19980704616 A KR19980704616 A KR 19980704616A KR 19990072218 A KR19990072218 A KR 19990072218A
- Authority
- KR
- South Korea
- Prior art keywords
- carrier tape
- strip
- strip portion
- thermoplastic polymer
- device carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000006260 foam Substances 0.000 claims abstract description 53
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 21
- 239000010410 layer Substances 0.000 claims abstract description 20
- 239000002356 single layer Substances 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 27
- -1 polyethylene Polymers 0.000 claims description 23
- 239000004604 Blowing Agent Substances 0.000 claims description 17
- 239000004793 Polystyrene Substances 0.000 claims description 16
- 229920002223 polystyrene Polymers 0.000 claims description 16
- 239000004698 Polyethylene Substances 0.000 claims description 15
- 229920000573 polyethylene Polymers 0.000 claims description 15
- 238000001125 extrusion Methods 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 4
- 238000003860 storage Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 33
- 239000000853 adhesive Substances 0.000 description 19
- 230000001070 adhesive effect Effects 0.000 description 19
- 239000000126 substance Substances 0.000 description 18
- 239000010409 thin film Substances 0.000 description 17
- 239000002666 chemical blowing agent Substances 0.000 description 16
- 238000004080 punching Methods 0.000 description 14
- 238000005187 foaming Methods 0.000 description 12
- 239000000835 fiber Substances 0.000 description 11
- 210000004027 cell Anatomy 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 9
- 239000000428 dust Substances 0.000 description 6
- 229920001684 low density polyethylene Polymers 0.000 description 6
- 239000004702 low-density polyethylene Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229920002959 polymer blend Polymers 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002861 polymer material Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 239000004416 thermosoftening plastic Substances 0.000 description 5
- NBOCQTNZUPTTEI-UHFFFAOYSA-N 4-[4-(hydrazinesulfonyl)phenoxy]benzenesulfonohydrazide Chemical compound C1=CC(S(=O)(=O)NN)=CC=C1OC1=CC=C(S(=O)(=O)NN)C=C1 NBOCQTNZUPTTEI-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000006261 foam material Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004700 high-density polyethylene Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- 239000004156 Azodicarbonamide Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 235000019399 azodicarbonamide Nutrition 0.000 description 1
- 125000005603 azodicarboxylic group Chemical group 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 238000013012 foaming technology Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000004619 high density foam Substances 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229920004889 linear high-density polyethylene Polymers 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 239000004620 low density foam Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/003—Placing of components on belts holding the terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8/576405 | 1995-12-21 | ||
| US08/576,405 US5857572A (en) | 1995-12-21 | 1995-12-21 | Component carrier tape |
| PCT/US1996/018188 WO1997024022A1 (en) | 1995-12-21 | 1996-11-11 | Component carrier tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19990072218A true KR19990072218A (ko) | 1999-09-27 |
Family
ID=24304283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980704616A Ceased KR19990072218A (ko) | 1995-12-21 | 1996-11-11 | 소자 캐리어 테이프 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5857572A (enExample) |
| EP (1) | EP0868840A1 (enExample) |
| JP (1) | JP3898761B2 (enExample) |
| KR (1) | KR19990072218A (enExample) |
| IL (1) | IL124910A (enExample) |
| MY (1) | MY115230A (enExample) |
| TW (1) | TW374748B (enExample) |
| WO (1) | WO1997024022A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6027802A (en) * | 1997-10-23 | 2000-02-22 | Four Piliars Enterprise Co., Ltd. | Cover tape for packaging |
| DE29916398U1 (de) | 1999-09-17 | 2000-01-05 | Abb Patent Gmbh, 68309 Mannheim | Gurtband zum Transport und Zuführung der Bauelemente zu einer Bestückungseinrichtung |
| US7014896B1 (en) * | 1999-11-29 | 2006-03-21 | Denki Kagaku Kogyo Kabushiki Kaisha | Packaging container for electronic part |
| JP4424524B2 (ja) * | 2000-04-12 | 2010-03-03 | Ｏｋｉセミコンダクタ株式会社 | チップトレイ |
| DE10032415A1 (de) * | 2000-07-04 | 2001-10-18 | Infineon Technologies Ag | Vorrichtung zum Verpacken und zum Transport von elektrischen Bauteilen und Herstellungsverfahren |
| DE10044418C2 (de) * | 2000-09-08 | 2002-09-19 | Siemens Ag | Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt |
| US7086526B2 (en) | 2001-08-17 | 2006-08-08 | Clearlab International Pte Ltd. | Packaging for disposable soft contact lenses |
| CN1980582B (zh) | 2001-08-17 | 2010-12-22 | 美你康株式会社 | 用于用后即弃式软隐形眼镜的包装 |
| AU2002348875A1 (en) * | 2001-12-05 | 2003-06-17 | Koninklijke Philips Electronics N.V. | Method of and device for packaging electronic components thus packaged |
| DE10222620A1 (de) * | 2002-05-17 | 2003-12-04 | Georg Rudolf Sillner | Verfahren zum Verarbeiten von elektrischen Bauteilen, insbesondere zum Verarbeiten von Halbleiterchips sowie elektrischen Bauelementen, sowie Vorrichtung zum Durchführen des Verfahrens |
| US7832552B2 (en) | 2002-08-17 | 2010-11-16 | Menicon Co. Ltd. | Duo packaging for disposable soft contact lenses using a substrate |
| US20040035747A1 (en) * | 2002-08-21 | 2004-02-26 | Butler Michael S. | Temporary electronic component-carrying tape with weakened areas and related methods |
| US7127805B2 (en) * | 2002-11-20 | 2006-10-31 | Intel Corporation | Electronic device carrier and manufacturing tape |
| JP2006117250A (ja) * | 2004-10-19 | 2006-05-11 | International Chemical:Kk | 電子部品搬送体及びその製造方法 |
| JP4517856B2 (ja) * | 2004-12-27 | 2010-08-04 | Ｔｄｋ株式会社 | 電子部品連 |
| JP4832769B2 (ja) | 2005-02-14 | 2011-12-07 | メニコン シンガポール ピーティーイー． リミテッド | 包装体 |
| US10865028B2 (en) | 2005-02-14 | 2020-12-15 | Mentcon Singapore Pte Ltd. | Heat sealable, retortable laminated foil |
| CN100447053C (zh) * | 2005-12-05 | 2008-12-31 | 科研技术顾问有限公司 | 半导体载板的固定方法 |
| US8132673B1 (en) * | 2008-03-07 | 2012-03-13 | Charles Gutentag | Method and apparatus for retention of small components on adhesive backed carrier tape |
| KR20140044369A (ko) | 2011-06-17 | 2014-04-14 | 베리 플라스틱스 코포레이션 | 컵용 단열 슬리브 |
| JP5790633B2 (ja) * | 2012-12-14 | 2015-10-07 | 株式会社村田製作所 | キャリアテープ、包装用テープおよび電子部品連 |
| MX388908B (es) | 2013-03-14 | 2025-03-20 | Berry Plastics Corp | Contenedor. |
| WO2015006772A1 (en) * | 2013-07-12 | 2015-01-15 | Berry Plastics Corporation | Polymeric material for container |
| US9562140B2 (en) | 2013-08-16 | 2017-02-07 | Berry Plastics Corporation | Polymeric material for an insulated container |
| TW201521993A (zh) | 2013-08-30 | 2015-06-16 | Berry Plastics Corp | 用於容器之聚合材料 |
| JP6506525B2 (ja) * | 2014-10-10 | 2019-04-24 | デンカ株式会社 | パンチキャリアテープ用シート |
| WO2016141179A1 (en) | 2015-03-04 | 2016-09-09 | Berry Plastics Corporation | Polymeric material for container |
| DE102016103490A1 (de) * | 2016-02-26 | 2017-08-31 | Cqlt Saargummi Technologies S.À.R.L. | Verfahren zur Herstellung eines Dichtungselements |
| US11452249B2 (en) * | 2017-12-11 | 2022-09-20 | Delphon Industries, Llc | Carrier for reversibly immobilizing one or more objects |
| DE102018114071A1 (de) * | 2018-06-13 | 2019-05-29 | Infineon Technologies Ag | Chip-blister-anordnungen und verfahren zum kontaktieren von halbleiter-chips |
| EP4585387A3 (en) * | 2019-06-27 | 2025-10-08 | Moxietec, LLC | Polymer foam articles and methods of making polymer foams |
| US20210347958A1 (en) | 2019-06-27 | 2021-11-11 | Moxietec, Llc | Polymer foam articles and methods of making polymer foams |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4231901A (en) * | 1978-06-23 | 1980-11-04 | Charleswater Products, Inc. | Electrically conductive foam and method of preparation and use |
| GB2040569B (en) * | 1978-12-26 | 1983-09-01 | Murata Manufacturing Co | Chip-like electronic component series and method for supplying chip-like electronic components |
| US4657137A (en) * | 1981-05-22 | 1987-04-14 | North American Philips Corporation | Multi-chip packaging system |
| EP0066339A2 (en) * | 1981-05-22 | 1982-12-08 | North American Philips Corporation | Polyfoam chip carrier tape |
| JPS59158596A (ja) * | 1983-02-28 | 1984-09-08 | 奥井 徳次郎 | 小型電子部品の収納方法 |
| US4581262A (en) * | 1985-01-14 | 1986-04-08 | Owens-Illinois, Inc. | Coextruded multilayer sheet and sleeve label made therefrom |
| JPH0741595B2 (ja) * | 1988-06-11 | 1995-05-10 | 武士 山本 | 紙製キャリアテープの製造方法およびその製造方法に使用する金型 |
| JPH04128147A (ja) * | 1990-09-11 | 1992-04-28 | Toyo Chem Co Ltd | チップキャリヤ―テープ |
| US5150787A (en) * | 1991-02-21 | 1992-09-29 | Minnesota Mining And Manufacturing Company | Component carrier tape |
| US5132160A (en) * | 1991-02-21 | 1992-07-21 | Minnesota Mining And Manufacturing Company | Component carrier tape |
| US5203143A (en) * | 1992-03-28 | 1993-04-20 | Tempo G | Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system |
| US5396988A (en) * | 1992-04-30 | 1995-03-14 | Minnesota Mining And Manufacturing Company | Electronic component carrier tape with generic pockets |
| US5325654A (en) * | 1992-06-19 | 1994-07-05 | Minnesota Mining And Manufacturing Company | Carrier tape with cover strip |
-
1995
- 1995-12-21 US US08/576,405 patent/US5857572A/en not_active Expired - Lifetime
-
1996
- 1996-11-11 KR KR1019980704616A patent/KR19990072218A/ko not_active Ceased
- 1996-11-11 IL IL12491096A patent/IL124910A/xx not_active IP Right Cessation
- 1996-11-11 JP JP52363297A patent/JP3898761B2/ja not_active Expired - Fee Related
- 1996-11-11 WO PCT/US1996/018188 patent/WO1997024022A1/en not_active Ceased
- 1996-11-11 EP EP96940412A patent/EP0868840A1/en not_active Withdrawn
- 1996-11-26 TW TW085114559A patent/TW374748B/zh active
- 1996-12-13 MY MYPI96005262A patent/MY115230A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP3898761B2 (ja) | 2007-03-28 |
| WO1997024022A1 (en) | 1997-07-03 |
| MY115230A (en) | 2003-04-30 |
| IL124910A (en) | 2003-03-12 |
| JP2000502310A (ja) | 2000-02-29 |
| TW374748B (en) | 1999-11-21 |
| EP0868840A1 (en) | 1998-10-07 |
| IL124910A0 (en) | 1999-01-26 |
| US5857572A (en) | 1999-01-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 19980618 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20011109 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20031107 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20040326 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20031107 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
| J201 | Request for trial against refusal decision | ||
| PJ0201 | Trial against decision of rejection |
Patent event date: 20040428 Comment text: Request for Trial against Decision on Refusal Patent event code: PJ02012R01D Patent event date: 20040326 Comment text: Decision to Refuse Application Patent event code: PJ02011S01I Appeal kind category: Appeal against decision to decline refusal Decision date: 20050929 Appeal identifier: 2004101001845 Request date: 20040428 |
|
| J301 | Trial decision |
Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20040428 Effective date: 20050929 |
|
| PJ1301 | Trial decision |
Patent event code: PJ13011S01D Patent event date: 20050929 Comment text: Trial Decision on Objection to Decision on Refusal Appeal kind category: Appeal against decision to decline refusal Request date: 20040428 Decision date: 20050929 Appeal identifier: 2004101001845 |
|
| J2X1 | Appeal (before the patent court) |
Free format text: APPEAL AGAINST DECISION TO DECLINE REFUSAL |
|
| PJ2001 | Appeal |
Patent event date: 20050929 Comment text: Trial Decision on Objection to Decision on Refusal Patent event code: PJ20011S01I Appeal kind category: Appeal against decision to decline refusal Decision date: 20061123 Appeal identifier: 2005201009404 Request date: 20051105 |
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| J302 | Written judgement (patent court) |
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