MY115230A - Component carrier tape - Google Patents

Component carrier tape

Info

Publication number
MY115230A
MY115230A MYPI96005262A MYPI9605262A MY115230A MY 115230 A MY115230 A MY 115230A MY PI96005262 A MYPI96005262 A MY PI96005262A MY PI9605262 A MYPI9605262 A MY PI9605262A MY 115230 A MY115230 A MY 115230A
Authority
MY
Malaysia
Prior art keywords
strip portion
carrier tape
strip
components
component carrier
Prior art date
Application number
MYPI96005262A
Other languages
English (en)
Inventor
David L Vall
Gerald C Bird
Steven J Flynn
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of MY115230A publication Critical patent/MY115230A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
MYPI96005262A 1995-12-21 1996-12-13 Component carrier tape MY115230A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/576,405 US5857572A (en) 1995-12-21 1995-12-21 Component carrier tape

Publications (1)

Publication Number Publication Date
MY115230A true MY115230A (en) 2003-04-30

Family

ID=24304283

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI96005262A MY115230A (en) 1995-12-21 1996-12-13 Component carrier tape

Country Status (8)

Country Link
US (1) US5857572A (enExample)
EP (1) EP0868840A1 (enExample)
JP (1) JP3898761B2 (enExample)
KR (1) KR19990072218A (enExample)
IL (1) IL124910A (enExample)
MY (1) MY115230A (enExample)
TW (1) TW374748B (enExample)
WO (1) WO1997024022A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6027802A (en) * 1997-10-23 2000-02-22 Four Piliars Enterprise Co., Ltd. Cover tape for packaging
DE29916398U1 (de) 1999-09-17 2000-01-05 Abb Patent Gmbh, 68309 Mannheim Gurtband zum Transport und Zuführung der Bauelemente zu einer Bestückungseinrichtung
HK1054213B (en) * 1999-11-29 2011-07-29 Denki Kagaku Kogyo Kabushiki Kaisha Packaging container for electronic part
JP4424524B2 (ja) * 2000-04-12 2010-03-03 Ｏｋｉセミコンダクタ株式会社 チップトレイ
DE10032415A1 (de) * 2000-07-04 2001-10-18 Infineon Technologies Ag Vorrichtung zum Verpacken und zum Transport von elektrischen Bauteilen und Herstellungsverfahren
DE10044418C2 (de) * 2000-09-08 2002-09-19 Siemens Ag Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt
US7086526B2 (en) 2001-08-17 2006-08-08 Clearlab International Pte Ltd. Packaging for disposable soft contact lenses
CN1980582B (zh) 2001-08-17 2010-12-22 美你康株式会社 用于用后即弃式软隐形眼镜的包装
CN1299555C (zh) * 2001-12-05 2007-02-07 皇家飞利浦电子股份有限公司 对由此包装的电子器件进行包装的方法和装置
DE10222620A1 (de) * 2002-05-17 2003-12-04 Georg Rudolf Sillner Verfahren zum Verarbeiten von elektrischen Bauteilen, insbesondere zum Verarbeiten von Halbleiterchips sowie elektrischen Bauelementen, sowie Vorrichtung zum Durchführen des Verfahrens
US7832552B2 (en) 2002-08-17 2010-11-16 Menicon Co. Ltd. Duo packaging for disposable soft contact lenses using a substrate
US20040035747A1 (en) * 2002-08-21 2004-02-26 Butler Michael S. Temporary electronic component-carrying tape with weakened areas and related methods
US7127805B2 (en) * 2002-11-20 2006-10-31 Intel Corporation Electronic device carrier and manufacturing tape
JP2006117250A (ja) * 2004-10-19 2006-05-11 International Chemical:Kk 電子部品搬送体及びその製造方法
JP4517856B2 (ja) * 2004-12-27 2010-08-04 Ｔｄｋ株式会社 電子部品連
US10865028B2 (en) 2005-02-14 2020-12-15 Mentcon Singapore Pte Ltd. Heat sealable, retortable laminated foil
JP4832769B2 (ja) 2005-02-14 2011-12-07 メニコン シンガポール ピーティーイー． リミテッド 包装体
CN100447053C (zh) * 2005-12-05 2008-12-31 科研技术顾问有限公司 半导体载板的固定方法
US8132673B1 (en) * 2008-03-07 2012-03-13 Charles Gutentag Method and apparatus for retention of small components on adhesive backed carrier tape
EP2720582A4 (en) 2011-06-17 2014-12-24 Berry Plastics Corp INSULATED SLEEVE FOR A MUG
JP5790633B2 (ja) * 2012-12-14 2015-10-07 株式会社村田製作所 キャリアテープ、包装用テープおよび電子部品連
HK1213530A1 (zh) 2013-03-14 2016-07-08 比瑞塑料公司 容器
EP3019552A4 (en) 2013-07-12 2017-02-22 Berry Plastics Corp. Polymeric material for container
WO2015024018A1 (en) 2013-08-16 2015-02-19 Berry Plastics Corporation Polymeric material for an insulated container
TW201521993A (zh) 2013-08-30 2015-06-16 Berry Plastics Corp 用於容器之聚合材料
JP6506525B2 (ja) * 2014-10-10 2019-04-24 デンカ株式会社 パンチキャリアテープ用シート
WO2016141179A1 (en) 2015-03-04 2016-09-09 Berry Plastics Corporation Polymeric material for container
DE102016103490A1 (de) * 2016-02-26 2017-08-31 Cqlt Saargummi Technologies S.À.R.L. Verfahren zur Herstellung eines Dichtungselements
US11452249B2 (en) * 2017-12-11 2022-09-20 Delphon Industries, Llc Carrier for reversibly immobilizing one or more objects
DE102018114071A1 (de) * 2018-06-13 2019-05-29 Infineon Technologies Ag Chip-blister-anordnungen und verfahren zum kontaktieren von halbleiter-chips
US20210347958A1 (en) 2019-06-27 2021-11-11 Moxietec, Llc Polymer foam articles and methods of making polymer foams
KR20220030265A (ko) * 2019-06-27 2022-03-10 모시에텍, 엘엘씨 고분자 발포체 물품 및 고분자 발포체의 제조 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4231901A (en) * 1978-06-23 1980-11-04 Charleswater Products, Inc. Electrically conductive foam and method of preparation and use
GB2040569B (en) * 1978-12-26 1983-09-01 Murata Manufacturing Co Chip-like electronic component series and method for supplying chip-like electronic components
US4657137A (en) * 1981-05-22 1987-04-14 North American Philips Corporation Multi-chip packaging system
EP0066339A2 (en) * 1981-05-22 1982-12-08 North American Philips Corporation Polyfoam chip carrier tape
JPS59158596A (ja) * 1983-02-28 1984-09-08 奥井　徳次郎 小型電子部品の収納方法
US4581262A (en) * 1985-01-14 1986-04-08 Owens-Illinois, Inc. Coextruded multilayer sheet and sleeve label made therefrom
JPH0741595B2 (ja) * 1988-06-11 1995-05-10 武士 山本 紙製キャリアテープの製造方法およびその製造方法に使用する金型
JPH04128147A (ja) * 1990-09-11 1992-04-28 Toyo Chem Co Ltd チップキャリヤ―テープ
US5150787A (en) * 1991-02-21 1992-09-29 Minnesota Mining And Manufacturing Company Component carrier tape
US5132160A (en) * 1991-02-21 1992-07-21 Minnesota Mining And Manufacturing Company Component carrier tape
US5203143A (en) * 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5396988A (en) * 1992-04-30 1995-03-14 Minnesota Mining And Manufacturing Company Electronic component carrier tape with generic pockets
US5325654A (en) * 1992-06-19 1994-07-05 Minnesota Mining And Manufacturing Company Carrier tape with cover strip

Also Published As

Publication number Publication date
JP2000502310A (ja) 2000-02-29
KR19990072218A (ko) 1999-09-27
TW374748B (en) 1999-11-21
EP0868840A1 (en) 1998-10-07
JP3898761B2 (ja) 2007-03-28
IL124910A0 (en) 1999-01-26
US5857572A (en) 1999-01-12
IL124910A (en) 2003-03-12
WO1997024022A1 (en) 1997-07-03

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