JP3878959B2 - スズめっき液、そのスズめっき液を用いたスズめっき方法及びスズめっき液調整方法 - Google Patents

スズめっき液、そのスズめっき液を用いたスズめっき方法及びスズめっき液調整方法 Download PDF

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Publication number
JP3878959B2
JP3878959B2 JP2006044722A JP2006044722A JP3878959B2 JP 3878959 B2 JP3878959 B2 JP 3878959B2 JP 2006044722 A JP2006044722 A JP 2006044722A JP 2006044722 A JP2006044722 A JP 2006044722A JP 3878959 B2 JP3878959 B2 JP 3878959B2
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Prior art keywords
tin plating
plating solution
tin
adjuster
solution
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JP2006044722A
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Japanese (ja)
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JP2006328528A (ja
Inventor
敏 川島
浩幸 田代
繁則 江村
貴光 梨山
英之 三瓶
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Meltex Inc
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Meltex Inc
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2006044722A 2005-04-28 2006-02-22 スズめっき液、そのスズめっき液を用いたスズめっき方法及びスズめっき液調整方法 Active JP3878959B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006044722A JP3878959B2 (ja) 2005-04-28 2006-02-22 スズめっき液、そのスズめっき液を用いたスズめっき方法及びスズめっき液調整方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005132092 2005-04-28
JP2005132092 2005-04-28
JP2006044722A JP3878959B2 (ja) 2005-04-28 2006-02-22 スズめっき液、そのスズめっき液を用いたスズめっき方法及びスズめっき液調整方法

Publications (2)

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JP2006328528A JP2006328528A (ja) 2006-12-07
JP3878959B2 true JP3878959B2 (ja) 2007-02-07

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JP2006044722A Active JP3878959B2 (ja) 2005-04-28 2006-02-22 スズめっき液、そのスズめっき液を用いたスズめっき方法及びスズめっき液調整方法

Country Status (4)

Country Link
JP (1) JP3878959B2 (enExample)
KR (1) KR100934401B1 (enExample)
TW (1) TW200706707A (enExample)
WO (1) WO2006117920A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632186B2 (ja) * 2007-08-01 2011-02-16 太陽化学工業株式会社 電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品
CN101748425B (zh) * 2008-12-05 2014-07-09 宜兴方晶科技有限公司 甲基磺酸亚锡制备方法
JP6127289B2 (ja) * 2012-03-02 2017-05-17 国立大学法人信州大学 リチウムイオン電池用負極材料およびその製造方法
CN103014786B (zh) * 2013-01-22 2016-01-20 广州博泉环保材料科技有限公司 电镀液、其制备方法及应用此电镀液的镀锡工艺
CN104109885B (zh) * 2013-04-22 2017-02-01 广东致卓精密金属科技有限公司 一种弱碱性焦磷酸盐电镀光亮锡溶液及工艺
CN105899714B (zh) 2013-12-05 2018-09-21 霍尼韦尔国际公司 具有经调节的pH的甲基磺酸亚锡溶液
HUE061592T2 (hu) 2014-07-07 2023-07-28 Honeywell Int Inc Ionmegkötõt tartalmazó termális interfész
ES2886846T3 (es) 2014-12-05 2021-12-21 Honeywell Int Inc Materiales de interfaz térmica de alto rendimiento con baja impedancia térmica
CN104593835B (zh) * 2015-02-04 2017-10-24 广东羚光新材料股份有限公司 用于片式元器件端电极电镀的中性镀锡液
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
CN105525312B (zh) * 2015-12-11 2017-12-29 广州市精利表面处理技术有限公司 一种镀锡溶液及其制备方法
KR102554661B1 (ko) 2016-03-08 2023-07-13 허니웰 인터내셔널 인코포레이티드 상 변화 물질
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
JP6818520B2 (ja) * 2016-11-11 2021-01-20 ローム・アンド・ハース電子材料株式会社 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11686007B2 (en) * 2017-12-18 2023-06-27 New Mexico Tech University Research Park Corporation Tin-indium alloy electroplating solution
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
JP7598552B2 (ja) 2020-10-02 2024-12-12 メルテックス株式会社 バレルめっき用スズめっき液
CN113430592A (zh) * 2021-06-30 2021-09-24 广东德浩化工新材料有限公司 一种中性镀锡稳定剂及其制备方法
KR102664806B1 (ko) * 2021-11-18 2024-05-10 주식회사 에이엔씨코리아 적층세라믹 콘덴서용 주석도금액
KR20250124510A (ko) 2024-02-13 2025-08-20 한국생산기술연구원 솔더 범프용 주석 도금액

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3858241B2 (ja) * 2002-04-09 2006-12-13 石原薬品株式会社 中性スズメッキ浴を用いたバレルメッキ方法
JP4224698B2 (ja) 2003-10-24 2009-02-18 株式会社村田製作所 めっき浴の作製方法、めっき浴、めっき方法、及び電子部品の製造方法

Also Published As

Publication number Publication date
TW200706707A (en) 2007-02-16
JP2006328528A (ja) 2006-12-07
TWI325022B (enExample) 2010-05-21
WO2006117920A1 (ja) 2006-11-09
KR20070116654A (ko) 2007-12-10
KR100934401B1 (ko) 2009-12-29

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