TW200706707A - Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution - Google Patents

Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution

Info

Publication number
TW200706707A
TW200706707A TW095108414A TW95108414A TW200706707A TW 200706707 A TW200706707 A TW 200706707A TW 095108414 A TW095108414 A TW 095108414A TW 95108414 A TW95108414 A TW 95108414A TW 200706707 A TW200706707 A TW 200706707A
Authority
TW
Taiwan
Prior art keywords
tin plating
plating solution
tin
solution
preparing
Prior art date
Application number
TW095108414A
Other languages
Chinese (zh)
Other versions
TWI325022B (en
Inventor
Satoshi Kawashima
Hiroyuki Tashiro
Shigenori Emura
Takamitsu Nashiyama
Hideyuki Sampei
Original Assignee
Meltex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meltex Inc filed Critical Meltex Inc
Publication of TW200706707A publication Critical patent/TW200706707A/en
Application granted granted Critical
Publication of TWI325022B publication Critical patent/TWI325022B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin

Abstract

Provided is a tin plating solution which is less susceptible to forming a sludge even after the storage for a long time and has a markedly long life as a plating solution. A tin plating solution for carrying out an electrolytic tin plating, characterized in that it contains a tin salt as a supply source of a tin ion in an amount of 5 to 30 g/L in terms of tin, a chelating agent for chelating and stabilizing the tin ion and a pH adjusting agent; and a method for preparing the tin plating solution, characterized in that it comprises adding tin methanesulfonate into a solution being neutral to alkaline, to thereby form a tin chelate complex.
TW095108414A 2005-04-28 2006-03-13 Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution TW200706707A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005132092 2005-04-28

Publications (2)

Publication Number Publication Date
TW200706707A true TW200706707A (en) 2007-02-16
TWI325022B TWI325022B (en) 2010-05-21

Family

ID=37307726

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095108414A TW200706707A (en) 2005-04-28 2006-03-13 Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution

Country Status (4)

Country Link
JP (1) JP3878959B2 (en)
KR (1) KR100934401B1 (en)
TW (1) TW200706707A (en)
WO (1) WO2006117920A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104593835A (en) * 2015-02-04 2015-05-06 广东羚光新材料股份有限公司 Neutral tin plating solution used in electroplating terminal electrodes of chip component
CN105525312A (en) * 2015-12-11 2016-04-27 广州市精利表面处理技术有限公司 Tin plating solution and preparation method thereof

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632186B2 (en) * 2007-08-01 2011-02-16 太陽化学工業株式会社 Tin electrolytic plating solution for electronic parts, tin electrolytic plating method for electronic parts and tin electrolytic plated electronic parts
CN101748425B (en) * 2008-12-05 2014-07-09 宜兴方晶科技有限公司 Preparation method of stannous methanesulfonate
JP6127289B2 (en) * 2012-03-02 2017-05-17 国立大学法人信州大学 Negative electrode material for lithium ion battery and method for producing the same
CN103014786B (en) * 2013-01-22 2016-01-20 广州博泉环保材料科技有限公司 Electroplate liquid, its preparation method and apply the tin plating technique of this electroplate liquid
CN104109885B (en) * 2013-04-22 2017-02-01 广东致卓精密金属科技有限公司 Weak-alkalinity pyrophosphate solution and technology for electroplating bright tin
JP2017504715A (en) 2013-12-05 2017-02-09 ハネウェル・インターナショナル・インコーポレーテッド Stannous methanesulfonate solution with controlled pH
HUE061592T2 (en) 2014-07-07 2023-07-28 Honeywell Int Inc Thermal interface material with ion scavenger
CN107250317A (en) 2014-12-05 2017-10-13 霍尼韦尔国际公司 High-performance thermal interfacial material with low thermal resistance
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
US10781349B2 (en) 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
JP2022059731A (en) 2020-10-02 2022-04-14 メルテックス株式会社 Tin plating solution for barrel plating
CN113430592A (en) * 2021-06-30 2021-09-24 广东德浩化工新材料有限公司 Neutral tin plating stabilizer and preparation method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3858241B2 (en) * 2002-04-09 2006-12-13 石原薬品株式会社 Barrel plating method using neutral tin plating bath
JP4224698B2 (en) 2003-10-24 2009-02-18 株式会社村田製作所 Plating bath preparation method, plating bath, plating method, and electronic component manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104593835A (en) * 2015-02-04 2015-05-06 广东羚光新材料股份有限公司 Neutral tin plating solution used in electroplating terminal electrodes of chip component
CN105525312A (en) * 2015-12-11 2016-04-27 广州市精利表面处理技术有限公司 Tin plating solution and preparation method thereof
CN105525312B (en) * 2015-12-11 2017-12-29 广州市精利表面处理技术有限公司 A kind of tin plating solution and preparation method thereof

Also Published As

Publication number Publication date
KR20070116654A (en) 2007-12-10
JP3878959B2 (en) 2007-02-07
WO2006117920A1 (en) 2006-11-09
TWI325022B (en) 2010-05-21
KR100934401B1 (en) 2009-12-29
JP2006328528A (en) 2006-12-07

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