KR100934401B1 - 주석 도금액, 그 주석 도금액을 이용한 주석 도금 방법,주석 도금액 조정 방법 및 그 주석 도금액을 이용하여형성된 주석 도금층을 구비한 칩 부품 - Google Patents

주석 도금액, 그 주석 도금액을 이용한 주석 도금 방법,주석 도금액 조정 방법 및 그 주석 도금액을 이용하여형성된 주석 도금층을 구비한 칩 부품 Download PDF

Info

Publication number
KR100934401B1
KR100934401B1 KR1020077024412A KR20077024412A KR100934401B1 KR 100934401 B1 KR100934401 B1 KR 100934401B1 KR 1020077024412 A KR1020077024412 A KR 1020077024412A KR 20077024412 A KR20077024412 A KR 20077024412A KR 100934401 B1 KR100934401 B1 KR 100934401B1
Authority
KR
South Korea
Prior art keywords
tin plating
tin
plating liquid
solution
sulfonic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020077024412A
Other languages
English (en)
Korean (ko)
Other versions
KR20070116654A (ko
Inventor
사토시 가와시마
히로유키 타시로
시게노리 에무라
다카미츠 나시야마
히데유키 산페이
Original Assignee
멜텍스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 멜텍스 가부시키가이샤 filed Critical 멜텍스 가부시키가이샤
Publication of KR20070116654A publication Critical patent/KR20070116654A/ko
Application granted granted Critical
Publication of KR100934401B1 publication Critical patent/KR100934401B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020077024412A 2005-04-28 2006-02-22 주석 도금액, 그 주석 도금액을 이용한 주석 도금 방법,주석 도금액 조정 방법 및 그 주석 도금액을 이용하여형성된 주석 도금층을 구비한 칩 부품 Active KR100934401B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005132092 2005-04-28
JPJP-P-2005-00132092 2005-04-28
PCT/JP2006/303124 WO2006117920A1 (ja) 2005-04-28 2006-02-22 スズめっき液、そのスズめっき液を用いためっき方法、スズめっき液調整方法及びそのスズめっき液を用いてスズめっき層を形成したチップ部品

Publications (2)

Publication Number Publication Date
KR20070116654A KR20070116654A (ko) 2007-12-10
KR100934401B1 true KR100934401B1 (ko) 2009-12-29

Family

ID=37307726

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077024412A Active KR100934401B1 (ko) 2005-04-28 2006-02-22 주석 도금액, 그 주석 도금액을 이용한 주석 도금 방법,주석 도금액 조정 방법 및 그 주석 도금액을 이용하여형성된 주석 도금층을 구비한 칩 부품

Country Status (4)

Country Link
JP (1) JP3878959B2 (enExample)
KR (1) KR100934401B1 (enExample)
TW (1) TW200706707A (enExample)
WO (1) WO2006117920A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103014786A (zh) * 2013-01-22 2013-04-03 广州博泉环保材料科技有限公司 电镀液、其制备方法及应用此电镀液的镀锡工艺
KR20250124510A (ko) 2024-02-13 2025-08-20 한국생산기술연구원 솔더 범프용 주석 도금액

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632186B2 (ja) * 2007-08-01 2011-02-16 太陽化学工業株式会社 電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品
CN101748425B (zh) * 2008-12-05 2014-07-09 宜兴方晶科技有限公司 甲基磺酸亚锡制备方法
JP6127289B2 (ja) * 2012-03-02 2017-05-17 国立大学法人信州大学 リチウムイオン電池用負極材料およびその製造方法
CN104109885B (zh) * 2013-04-22 2017-02-01 广东致卓精密金属科技有限公司 一种弱碱性焦磷酸盐电镀光亮锡溶液及工艺
EP3077578A4 (en) 2013-12-05 2017-07-26 Honeywell International Inc. Stannous methansulfonate solution with adjusted ph
PL3166999T3 (pl) 2014-07-07 2023-07-03 Honeywell International Inc. Materiał termoprzewodzący ze zmiataczem jonów
CN112080258A (zh) 2014-12-05 2020-12-15 霍尼韦尔国际公司 具有低热阻的高性能热界面材料
CN104593835B (zh) * 2015-02-04 2017-10-24 广东羚光新材料股份有限公司 用于片式元器件端电极电镀的中性镀锡液
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
CN105525312B (zh) * 2015-12-11 2017-12-29 广州市精利表面处理技术有限公司 一种镀锡溶液及其制备方法
WO2017152353A1 (en) 2016-03-08 2017-09-14 Honeywell International Inc. Phase change material
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
JP6818520B2 (ja) * 2016-11-11 2021-01-20 ローム・アンド・ハース電子材料株式会社 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11686007B2 (en) * 2017-12-18 2023-06-27 New Mexico Tech University Research Park Corporation Tin-indium alloy electroplating solution
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
JP7598552B2 (ja) 2020-10-02 2024-12-12 メルテックス株式会社 バレルめっき用スズめっき液
CN113430592A (zh) * 2021-06-30 2021-09-24 广东德浩化工新材料有限公司 一种中性镀锡稳定剂及其制备方法
KR102664806B1 (ko) * 2021-11-18 2024-05-10 주식회사 에이엔씨코리아 적층세라믹 콘덴서용 주석도금액

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003293186A (ja) * 2002-04-09 2003-10-15 Ishihara Chem Co Ltd 中性スズメッキ浴、当該浴を用いたバレルメッキ方法
JP2005126773A (ja) 2003-10-24 2005-05-19 Murata Mfg Co Ltd めっき浴の作製方法、めっき浴、めっき方法、及び電子部品の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003293186A (ja) * 2002-04-09 2003-10-15 Ishihara Chem Co Ltd 中性スズメッキ浴、当該浴を用いたバレルメッキ方法
JP2005126773A (ja) 2003-10-24 2005-05-19 Murata Mfg Co Ltd めっき浴の作製方法、めっき浴、めっき方法、及び電子部品の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103014786A (zh) * 2013-01-22 2013-04-03 广州博泉环保材料科技有限公司 电镀液、其制备方法及应用此电镀液的镀锡工艺
KR20250124510A (ko) 2024-02-13 2025-08-20 한국생산기술연구원 솔더 범프용 주석 도금액

Also Published As

Publication number Publication date
JP3878959B2 (ja) 2007-02-07
WO2006117920A1 (ja) 2006-11-09
TWI325022B (enExample) 2010-05-21
TW200706707A (en) 2007-02-16
JP2006328528A (ja) 2006-12-07
KR20070116654A (ko) 2007-12-10

Similar Documents

Publication Publication Date Title
KR100934401B1 (ko) 주석 도금액, 그 주석 도금액을 이용한 주석 도금 방법,주석 도금액 조정 방법 및 그 주석 도금액을 이용하여형성된 주석 도금층을 구비한 칩 부품
US6610191B2 (en) Electro deposition chemistry
KR101299114B1 (ko) 금속의 표면처리용 수용액 및 금속표면의 변색방지방법
JPS6254397B2 (enExample)
JP5452458B2 (ja) ニッケルめっき液及びニッケルめっき方法
JP2009500527A (ja) スズ・ウィスカ成長を最小化する特性又は特徴を有するスズの電着
EP2350355B1 (en) Zinc alloy electroplating baths and processes
JP4812365B2 (ja) 錫電気めっき液および錫電気めっき方法
CN113930812B (zh) 片式电子元器件镀锡液和锡电镀方法
EP0663460A1 (en) Tin-zinc alloy electroplating bath and method for electroplating using the same
KR100368127B1 (ko) Ｓｎ-Ｂｉ합금 도금욕 및 이것을 사용한 도금 방법
EP2511400A1 (en) Electrolytic hard gold plating solution and plating method using same
CN1314501A (zh) 锡－铟合金电镀液及其制备方法
US6852211B2 (en) Nickel electroplating solution
US5326453A (en) Method and solution for electrodeposition of a dense, reflective tin or tin-lead alloy
EP4269663A1 (en) Method and system for electroplating article with metal
CN115787005A (zh) 一种pcb生产过程中的甲基磺酸镀锡液及其制备方法
EP3842572A1 (en) Tin alloy electroplating bath and plating method using same
DE2943399A1 (de) Zusammensetzung und verfahren fuer die galvanische abscheidung von metallischem palladium bei im wesentlichen konstanter badleistung
US6022467A (en) Electrolytic tin plating process with reduced sludge production
CN118756270A (zh) 一种银铜合金镀层及其制备方法
JP7740879B2 (ja) 電解銀めっき浴およびこれを用いた電解銀めっき方法
KR20200142748A (ko) 철 전기도금용액 및 이를 이용하여 제조된 전기도금 강판
WO2010101212A1 (ja) 銅－亜鉛合金電気めっき浴およびこれを用いためっき方法
CN118256969A (zh) 一种连续环保型无氟雾状锡铜合金电镀工艺

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

Patent event date: 20071024

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20090330

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20091116

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20091221

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20091221

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20121123

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 20121123

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20131007

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20131007

Start annual number: 5

End annual number: 5

FPAY Annual fee payment

Payment date: 20140915

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20140915

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 20150910

Year of fee payment: 7

PR1001 Payment of annual fee

Payment date: 20150910

Start annual number: 7

End annual number: 7

FPAY Annual fee payment

Payment date: 20161102

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20161102

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20171030

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20171030

Start annual number: 9

End annual number: 9

FPAY Annual fee payment

Payment date: 20181107

Year of fee payment: 10

PR1001 Payment of annual fee

Payment date: 20181107

Start annual number: 10

End annual number: 10

PR1001 Payment of annual fee

Payment date: 20200922

Start annual number: 12

End annual number: 12

PR1001 Payment of annual fee

Payment date: 20221206

Start annual number: 14

End annual number: 14