JP3867768B2 - ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置 - Google Patents

ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置 Download PDF

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Publication number
JP3867768B2
JP3867768B2 JP2001075534A JP2001075534A JP3867768B2 JP 3867768 B2 JP3867768 B2 JP 3867768B2 JP 2001075534 A JP2001075534 A JP 2001075534A JP 2001075534 A JP2001075534 A JP 2001075534A JP 3867768 B2 JP3867768 B2 JP 3867768B2
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JP
Japan
Prior art keywords
soldering
wiring board
heater
soldering apparatus
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001075534A
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English (en)
Japanese (ja)
Other versions
JP2002280721A5 (enExample
JP2002280721A (ja
Inventor
郁也 宮沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2001075534A priority Critical patent/JP3867768B2/ja
Priority to US10/090,142 priority patent/US6732907B2/en
Priority to TW091104298A priority patent/TWI228952B/zh
Publication of JP2002280721A publication Critical patent/JP2002280721A/ja
Publication of JP2002280721A5 publication Critical patent/JP2002280721A5/ja
Application granted granted Critical
Publication of JP3867768B2 publication Critical patent/JP3867768B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
JP2001075534A 2001-03-16 2001-03-16 ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置 Expired - Fee Related JP3867768B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001075534A JP3867768B2 (ja) 2001-03-16 2001-03-16 ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置
US10/090,142 US6732907B2 (en) 2001-03-16 2002-03-05 Soldering method, soldering device, and method and device of fabricating electronic circuit module
TW091104298A TWI228952B (en) 2001-03-16 2002-03-07 Soldering method and soldering apparatus, manufacturing method and manufacturing apparatus of electronic circuit module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001075534A JP3867768B2 (ja) 2001-03-16 2001-03-16 ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置

Publications (3)

Publication Number Publication Date
JP2002280721A JP2002280721A (ja) 2002-09-27
JP2002280721A5 JP2002280721A5 (enExample) 2004-11-25
JP3867768B2 true JP3867768B2 (ja) 2007-01-10

Family

ID=18932597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001075534A Expired - Fee Related JP3867768B2 (ja) 2001-03-16 2001-03-16 ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置

Country Status (3)

Country Link
US (1) US6732907B2 (enExample)
JP (1) JP3867768B2 (enExample)
TW (1) TWI228952B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002290027A (ja) * 2001-03-28 2002-10-04 Seiko Epson Corp 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置
CN100488337C (zh) * 2001-04-10 2009-05-13 日本电气株式会社 电路基板及其安装方法、以及使用该电路基板的电子设备
JP2002329956A (ja) * 2001-04-27 2002-11-15 Ricoh Co Ltd はんだ付け方法および該はんだ付け方法を用いて製造した電子回路基板ならびに電子機器
JP2005026457A (ja) * 2003-07-02 2005-01-27 Toshiba Corp 電子部品実装方法、基板製造装置および回路基板
FI20125384A7 (fi) * 2012-04-04 2013-10-05 Tellabs Oy Juotosliitoksella varustettu järjestelmä
DE102012112503A1 (de) * 2012-12-18 2014-06-18 Endress + Hauser Gmbh + Co. Kg Verfahren zur Herstellung von mischbestückten Leiterplatten
FR3066937B1 (fr) * 2017-05-30 2019-07-12 Continental Automotive France Dispositif de chauffe
CN110856352B (zh) * 2019-11-23 2021-07-23 湖南东神自动化设备有限公司 一种电路板预加热装置
JP6989038B1 (ja) * 2021-01-12 2022-01-05 株式会社オートネットワーク技術研究所 給電制御装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4402448A (en) * 1978-10-12 1983-09-06 Cooper Industries, Inc. Mass soldering system
US4573105A (en) * 1983-02-16 1986-02-25 Rca Corporation Printed circuit board assembly and method for the manufacture thereof
US4477512A (en) * 1983-04-29 1984-10-16 Westinghouse Electric Corp. Flexibilized flame retardant B-staged epoxy resin prepregs and composite laminates made therefrom
US4600137A (en) * 1985-02-21 1986-07-15 Hollis Automation, Inc. Method and apparatus for mass soldering with subsequent reflow soldering
US4805828A (en) * 1987-01-23 1989-02-21 Rockwell International Corporation Thermally durable surface mounted device printed wiring assemblies and apparatus and method for manufacture and repair
US5209782A (en) * 1988-05-27 1993-05-11 Teledyne Industries, Inc. System for soldering printed circuits
US5230460A (en) * 1990-06-13 1993-07-27 Electrovert Ltd. High volume convection preheater for wave soldering
US5232562A (en) * 1991-12-16 1993-08-03 Electrovert Ltd. Electrochemical reduction treatment for soldering
JPH06292964A (ja) 1992-07-22 1994-10-21 A Tec Tekutoron Kk 自動半田付け装置
JP3390268B2 (ja) 1994-10-18 2003-03-24 日本電熱計器株式会社 はんだ付け装置
JPH09307221A (ja) * 1996-05-15 1997-11-28 Omron Corp フローハンダ装置及び実装基板のハンダ付け方法
JPH10125618A (ja) * 1996-10-23 1998-05-15 Fujitsu Ltd 半導体装置の製造方法
US6257480B1 (en) * 1998-07-07 2001-07-10 Denso Corporation Jet soldering method and apparatus
KR100398716B1 (ko) * 2000-06-12 2003-09-19 가부시키가이샤 히타치세이사쿠쇼 반도체 모듈 및 반도체 장치를 접속한 회로 기판
JP2002204060A (ja) 2001-01-04 2002-07-19 Matsushita Electric Ind Co Ltd はんだ付け方法およびフローはんだ付け装置
JP2002290027A (ja) * 2001-03-28 2002-10-04 Seiko Epson Corp 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置
JP4073183B2 (ja) * 2001-08-01 2008-04-09 株式会社日立製作所 Ｐｂフリーはんだを用いた混載実装方法及び実装品

Also Published As

Publication number Publication date
TWI228952B (en) 2005-03-01
US20020130163A1 (en) 2002-09-19
JP2002280721A (ja) 2002-09-27
US6732907B2 (en) 2004-05-11

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