TWI228952B - Soldering method and soldering apparatus, manufacturing method and manufacturing apparatus of electronic circuit module - Google Patents
Soldering method and soldering apparatus, manufacturing method and manufacturing apparatus of electronic circuit module Download PDFInfo
- Publication number
- TWI228952B TWI228952B TW091104298A TW91104298A TWI228952B TW I228952 B TWI228952 B TW I228952B TW 091104298 A TW091104298 A TW 091104298A TW 91104298 A TW91104298 A TW 91104298A TW I228952 B TWI228952 B TW I228952B
- Authority
- TW
- Taiwan
- Prior art keywords
- lead
- soldering
- patent application
- scope
- electronic component
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 229910000679 solder Inorganic materials 0.000 claims abstract description 63
- 239000000463 material Substances 0.000 claims abstract description 22
- 238000003466 welding Methods 0.000 claims description 51
- 238000010438 heat treatment Methods 0.000 claims description 25
- 239000011135 tin Substances 0.000 claims description 10
- 239000000155 melt Substances 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 230000002079 cooperative effect Effects 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 238000005304 joining Methods 0.000 claims description 2
- 238000004898 kneading Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 26
- 229910052751 metal Inorganic materials 0.000 description 26
- 239000010410 layer Substances 0.000 description 25
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001075534A JP3867768B2 (ja) | 2001-03-16 | 2001-03-16 | ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI228952B true TWI228952B (en) | 2005-03-01 |
Family
ID=18932597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091104298A TWI228952B (en) | 2001-03-16 | 2002-03-07 | Soldering method and soldering apparatus, manufacturing method and manufacturing apparatus of electronic circuit module |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6732907B2 (enExample) |
| JP (1) | JP3867768B2 (enExample) |
| TW (1) | TWI228952B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856352A (zh) * | 2019-11-23 | 2020-02-28 | 湖南东神自动化设备有限公司 | 一种电路板预加热装置 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002290027A (ja) * | 2001-03-28 | 2002-10-04 | Seiko Epson Corp | 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置 |
| CN100488337C (zh) * | 2001-04-10 | 2009-05-13 | 日本电气株式会社 | 电路基板及其安装方法、以及使用该电路基板的电子设备 |
| JP2002329956A (ja) * | 2001-04-27 | 2002-11-15 | Ricoh Co Ltd | はんだ付け方法および該はんだ付け方法を用いて製造した電子回路基板ならびに電子機器 |
| JP2005026457A (ja) * | 2003-07-02 | 2005-01-27 | Toshiba Corp | 電子部品実装方法、基板製造装置および回路基板 |
| FI20125384A7 (fi) * | 2012-04-04 | 2013-10-05 | Tellabs Oy | Juotosliitoksella varustettu järjestelmä |
| DE102012112503A1 (de) * | 2012-12-18 | 2014-06-18 | Endress + Hauser Gmbh + Co. Kg | Verfahren zur Herstellung von mischbestückten Leiterplatten |
| FR3066937B1 (fr) * | 2017-05-30 | 2019-07-12 | Continental Automotive France | Dispositif de chauffe |
| JP6989038B1 (ja) * | 2021-01-12 | 2022-01-05 | 株式会社オートネットワーク技術研究所 | 給電制御装置 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4402448A (en) * | 1978-10-12 | 1983-09-06 | Cooper Industries, Inc. | Mass soldering system |
| US4573105A (en) * | 1983-02-16 | 1986-02-25 | Rca Corporation | Printed circuit board assembly and method for the manufacture thereof |
| US4477512A (en) * | 1983-04-29 | 1984-10-16 | Westinghouse Electric Corp. | Flexibilized flame retardant B-staged epoxy resin prepregs and composite laminates made therefrom |
| US4600137A (en) * | 1985-02-21 | 1986-07-15 | Hollis Automation, Inc. | Method and apparatus for mass soldering with subsequent reflow soldering |
| US4805828A (en) * | 1987-01-23 | 1989-02-21 | Rockwell International Corporation | Thermally durable surface mounted device printed wiring assemblies and apparatus and method for manufacture and repair |
| US5209782A (en) * | 1988-05-27 | 1993-05-11 | Teledyne Industries, Inc. | System for soldering printed circuits |
| US5230460A (en) * | 1990-06-13 | 1993-07-27 | Electrovert Ltd. | High volume convection preheater for wave soldering |
| US5232562A (en) * | 1991-12-16 | 1993-08-03 | Electrovert Ltd. | Electrochemical reduction treatment for soldering |
| JPH06292964A (ja) | 1992-07-22 | 1994-10-21 | A Tec Tekutoron Kk | 自動半田付け装置 |
| JP3390268B2 (ja) | 1994-10-18 | 2003-03-24 | 日本電熱計器株式会社 | はんだ付け装置 |
| JPH09307221A (ja) * | 1996-05-15 | 1997-11-28 | Omron Corp | フローハンダ装置及び実装基板のハンダ付け方法 |
| JPH10125618A (ja) * | 1996-10-23 | 1998-05-15 | Fujitsu Ltd | 半導体装置の製造方法 |
| US6257480B1 (en) * | 1998-07-07 | 2001-07-10 | Denso Corporation | Jet soldering method and apparatus |
| KR100398716B1 (ko) * | 2000-06-12 | 2003-09-19 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 모듈 및 반도체 장치를 접속한 회로 기판 |
| JP2002204060A (ja) | 2001-01-04 | 2002-07-19 | Matsushita Electric Ind Co Ltd | はんだ付け方法およびフローはんだ付け装置 |
| JP2002290027A (ja) * | 2001-03-28 | 2002-10-04 | Seiko Epson Corp | 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置 |
| JP4073183B2 (ja) * | 2001-08-01 | 2008-04-09 | 株式会社日立製作所 | Ｐｂフリーはんだを用いた混載実装方法及び実装品 |
-
2001
- 2001-03-16 JP JP2001075534A patent/JP3867768B2/ja not_active Expired - Fee Related
-
2002
- 2002-03-05 US US10/090,142 patent/US6732907B2/en not_active Expired - Fee Related
- 2002-03-07 TW TW091104298A patent/TWI228952B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856352A (zh) * | 2019-11-23 | 2020-02-28 | 湖南东神自动化设备有限公司 | 一种电路板预加热装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3867768B2 (ja) | 2007-01-10 |
| US20020130163A1 (en) | 2002-09-19 |
| JP2002280721A (ja) | 2002-09-27 |
| US6732907B2 (en) | 2004-05-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |