JP3853256B2 - 基板ベーク装置、基板ベーク方法及び塗布膜形成装置 - Google Patents

基板ベーク装置、基板ベーク方法及び塗布膜形成装置 Download PDF

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JP3853256B2
JP3853256B2 JP2002154242A JP2002154242A JP3853256B2 JP 3853256 B2 JP3853256 B2 JP 3853256B2 JP 2002154242 A JP2002154242 A JP 2002154242A JP 2002154242 A JP2002154242 A JP 2002154242A JP 3853256 B2 JP3853256 B2 JP 3853256B2
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光広 田上
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Tokyo Electron Ltd
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JP2002154242A 2002-05-28 2002-05-28 基板ベーク装置、基板ベーク方法及び塗布膜形成装置 Expired - Fee Related JP3853256B2 (ja)

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JP2003347198A JP2003347198A (ja) 2003-12-05
JP2003347198A5 JP2003347198A5 (https=) 2005-05-26
JP3853256B2 true JP3853256B2 (ja) 2006-12-06

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Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006175411A (ja) * 2004-12-24 2006-07-06 Seiko Epson Corp 膜形成装置及び電気光学装置並びに電子機器
JP4502921B2 (ja) * 2005-10-04 2010-07-14 東京エレクトロン株式会社 基板処理における排気装置
JP2008135440A (ja) 2006-11-27 2008-06-12 Toshiba Corp 半導体製造装置および半導体製造方法
JP4859229B2 (ja) * 2006-12-08 2012-01-25 東京エレクトロン株式会社 熱処理装置
JP4737083B2 (ja) * 2006-12-28 2011-07-27 東京エレクトロン株式会社 加熱装置及び塗布、現像装置並びに加熱方法
CN101008547B (zh) * 2007-01-30 2010-04-14 友达光电股份有限公司 适用于烘烤—基板的装置
JP4833140B2 (ja) * 2007-04-05 2011-12-07 東京エレクトロン株式会社 昇華物除去装置
JP2009099671A (ja) * 2007-10-15 2009-05-07 Renesas Technology Corp 塗布装置およびそれを用いた半導体装置の製造方法
JP5194209B2 (ja) * 2007-10-18 2013-05-08 日本フェンオール株式会社 半導体処理ユニット及び半導体製造装置
JP2009130308A (ja) * 2007-11-28 2009-06-11 Renesas Technology Corp 表面処理装置
JP2009212295A (ja) * 2008-03-04 2009-09-17 Tokyo Electron Ltd 薬液の塗布固化装置及び塗布固化方法
JP2009218430A (ja) * 2008-03-11 2009-09-24 Seiko Epson Corp 成膜方法、半導体装置の製造方法および電子機器の製造方法
JP2009218429A (ja) * 2008-03-11 2009-09-24 Seiko Epson Corp 成膜方法、半導体装置の製造方法および電子機器の製造方法
JP4897019B2 (ja) * 2009-08-24 2012-03-14 東京エレクトロン株式会社 加熱処理装置
JP5522144B2 (ja) * 2011-10-25 2014-06-18 東京エレクトロン株式会社 加熱装置、加熱方法及び記憶媒体
JP6307764B2 (ja) * 2013-09-30 2018-04-11 住友電工デバイス・イノベーション株式会社 半導体装置の製造方法
JP6811059B2 (ja) * 2016-09-05 2021-01-13 東京エレクトロン株式会社 基板処理装置
CN111383944A (zh) * 2018-12-29 2020-07-07 东京应化工业株式会社 基板加热装置、基板处理系统以及基板加热方法
JP7261675B2 (ja) * 2019-07-01 2023-04-20 東京エレクトロン株式会社 加熱処理装置及び加熱処理方法
TWI724845B (zh) * 2020-03-30 2021-04-11 群翊工業股份有限公司 氮氣密閉烘烤機台及基板進出烘烤裝置的方法
TW202324499A (zh) * 2021-11-05 2023-06-16 日商東京威力科創股份有限公司 加熱處理裝置、加熱處理方法及電腦記憶媒體
CN117724295A (zh) * 2023-12-14 2024-03-19 江苏卓胜微电子股份有限公司 加热盘排气结构和涂胶显影设备

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