JP3848442B2 - ヒータ支持装置及び半導体製造装置及び半導体装置の製造方法 - Google Patents

ヒータ支持装置及び半導体製造装置及び半導体装置の製造方法 Download PDF

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Publication number
JP3848442B2
JP3848442B2 JP23884997A JP23884997A JP3848442B2 JP 3848442 B2 JP3848442 B2 JP 3848442B2 JP 23884997 A JP23884997 A JP 23884997A JP 23884997 A JP23884997 A JP 23884997A JP 3848442 B2 JP3848442 B2 JP 3848442B2
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Japan
Prior art keywords
piece
holding
piece holder
recess
furnace
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Expired - Lifetime
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JP23884997A
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English (en)
Japanese (ja)
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JPH1167424A (ja
JPH1167424A5 (enExample
Inventor
芳勝 金盛
康憲 高桑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Application filed by Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP23884997A priority Critical patent/JP3848442B2/ja
Publication of JPH1167424A publication Critical patent/JPH1167424A/ja
Publication of JPH1167424A5 publication Critical patent/JPH1167424A5/ja
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Publication of JP3848442B2 publication Critical patent/JP3848442B2/ja
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Expired - Lifetime legal-status Critical Current

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JP23884997A 1997-08-20 1997-08-20 ヒータ支持装置及び半導体製造装置及び半導体装置の製造方法 Expired - Lifetime JP3848442B2 (ja)

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Application Number Priority Date Filing Date Title
JP23884997A JP3848442B2 (ja) 1997-08-20 1997-08-20 ヒータ支持装置及び半導体製造装置及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23884997A JP3848442B2 (ja) 1997-08-20 1997-08-20 ヒータ支持装置及び半導体製造装置及び半導体装置の製造方法

Related Child Applications (1)

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JP2006104351A Division JP4145328B2 (ja) 2006-04-05 2006-04-05 ヒータ支持装置及び加熱装置及び半導体製造装置及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPH1167424A JPH1167424A (ja) 1999-03-09
JPH1167424A5 JPH1167424A5 (enExample) 2005-02-24
JP3848442B2 true JP3848442B2 (ja) 2006-11-22

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JP23884997A Expired - Lifetime JP3848442B2 (ja) 1997-08-20 1997-08-20 ヒータ支持装置及び半導体製造装置及び半導体装置の製造方法

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100643661B1 (ko) 2005-04-11 2006-11-10 (주)비에이치티 열처리 장치의 히터 어셈블리 및 그 제조 방법
US7863204B2 (en) 2005-08-24 2011-01-04 Hitachi Kokusai Electric Inc. Substrate processing apparatus, heating apparatus for use in the same, method of manufacturing semiconductors with those apparatuses, and heating element supporting structure
KR100808766B1 (ko) 2007-01-09 2008-02-29 홍진혁 절연내화 애자 및 이를 이용한 원통형 전기가열로
JP5114449B2 (ja) * 2009-03-31 2013-01-09 株式会社ハナガタ ヒートトンネル用加熱装置
JP5787563B2 (ja) * 2010-05-11 2015-09-30 株式会社日立国際電気 ヒータ支持装置及び加熱装置及び基板処理装置及び半導体装置の製造方法及び基板の製造方法及び保持用ピース
JP5565188B2 (ja) * 2010-08-10 2014-08-06 東京エレクトロン株式会社 ヒータ装置
BR112021018026A2 (pt) * 2019-03-11 2021-11-23 Nicoventures Trading Ltd Dispositivo de fornecimento de aerossol, componente aquecedor, suporte para um componente aquecedor, método de fabricação, sistema de fornecimento de aerossol e membro de extremidade
CN111650237B (zh) * 2020-07-01 2024-07-12 西安交通大学 一种利用纳米力学测试仪测试微小试样热膨胀系数的装置
CN120313356A (zh) * 2024-01-12 2025-07-15 北京北方华创微电子装备有限公司 炉体结构和半导体工艺设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623675Y2 (enExample) * 1977-03-16 1981-06-03
JPH0110921Y2 (enExample) * 1984-11-05 1989-03-29
JPH047598Y2 (enExample) * 1987-03-16 1992-02-27
JPH086237Y2 (ja) * 1990-03-13 1996-02-21 株式会社リケン 縦型環状炉の発熱体保持具
JPH079036Y2 (ja) * 1990-11-13 1995-03-06 東京エレクトロン東北株式会社 縦型熱処理炉
US5506389A (en) * 1993-11-10 1996-04-09 Tokyo Electron Kabushiki Kaisha Thermal processing furnace and fabrication method thereof
JPH0963963A (ja) * 1995-08-23 1997-03-07 Hitachi Ltd 半導体基板処理装置及び半導体基板処理方法

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Publication number Publication date
JPH1167424A (ja) 1999-03-09

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