JP3846482B2 - バンプ付ic並びにそれを用いた表示装置及び電子機器 - Google Patents
バンプ付ic並びにそれを用いた表示装置及び電子機器 Download PDFInfo
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- JP3846482B2 JP3846482B2 JP2004023029A JP2004023029A JP3846482B2 JP 3846482 B2 JP3846482 B2 JP 3846482B2 JP 2004023029 A JP2004023029 A JP 2004023029A JP 2004023029 A JP2004023029 A JP 2004023029A JP 3846482 B2 JP3846482 B2 JP 3846482B2
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Description
図1は、アクティブマトリクス型液晶表示装置の部分断面図である。このアクティブマトリクス型液晶表示装置は、アクティブマトリクス基板(ガラス基板)10と、その対向基板(ガラス基板)12、両基板10,12間に封入された液晶14とを有する。アクティブマトリクス基板10は対向基板12の一端よりも延長された延長部13を有する。その延長部13上にドライバIC20がCOG実装されている。対向基板12には共通電極18が形成されている。
基板接続用バンプ30及びダミーダンプ40は、既知のバンプ形成方法を適用して形成することができ、印刷法の他、例えば特開2001−135667、特開平9−237963などに記載のソルダペーストを用いたバンプ形成法を用いることができる。
図6は、ドライバIC20の内部回路の一例を示している。この内部回路はアナログ回路を含んでおり、特に、電源回路200と温度センサ220とが遮光対象となる。
Claims (5)
- MOSトランジスタを含み、かつ第1の温度勾配特性を有する第1の定電圧源を有する前記第1の電源回路と、
MOSトランジスタを含み、かつ第2の温度勾配特性を有する第2の定電圧源を有する前記第2の電源回路と、
前記第1,第2の定電源からの出力電圧に基づいて、所望の温度勾配を有する電圧特性に従った電圧を出力する温度勾配選択回路と、
を有する電源回路を含み、
前記第1の定電圧電源及び前記第2の定電圧電源と対向する位置であって、前記第1の定電圧電源及び前記第2の定電圧電源に光が入射することを防止する位置に、バンプが形成されていることを特徴とするバンプ付IC。 - 請求項1において、
入出力回路と、
前記入出力回路に接続される基板接続用バンプと、
をさらに有し、
前記バンプはダミーバンプであり、
前記ダミーバンプの高さは、前記基板接続用バンプの高さよりも低いことを特徴とするバンプ付IC。 - 請求項2において、
前記ダミーバンプに接続されるダミー電極をさらに有し、前記ダミー電極はフローティング電極であることを特徴とするバンプ付IC。 - 請求項2または3に記載されたバンプ付ICと、
前記バンプ付ICがCOG(Chip On Glass)実装される透明基板と、
を有し、
前記透明基板は複数の配線を有し、前記バンプ付ICの前記基板接続用バンプと前記複数の配線とが接続されていることを特徴とする表示装置。 - 請求項4に記載の表示装置を有することを特徴とする電子機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004023029A JP3846482B2 (ja) | 2004-01-30 | 2004-01-30 | バンプ付ic並びにそれを用いた表示装置及び電子機器 |
US11/046,642 US7098526B2 (en) | 2004-01-30 | 2005-01-28 | Bumped IC, display device and electronic device using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004023029A JP3846482B2 (ja) | 2004-01-30 | 2004-01-30 | バンプ付ic並びにそれを用いた表示装置及び電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005217252A JP2005217252A (ja) | 2005-08-11 |
JP3846482B2 true JP3846482B2 (ja) | 2006-11-15 |
Family
ID=34805694
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004023029A Expired - Fee Related JP3846482B2 (ja) | 2004-01-30 | 2004-01-30 | バンプ付ic並びにそれを用いた表示装置及び電子機器 |
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US (1) | US7098526B2 (ja) |
JP (1) | JP3846482B2 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006080333A (ja) * | 2004-09-10 | 2006-03-23 | Toshiba Corp | 半導体装置 |
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JP4577244B2 (ja) * | 2006-03-15 | 2010-11-10 | セイコーエプソン株式会社 | 発光装置及びその駆動方法並びに電子機器 |
KR100748558B1 (ko) * | 2006-06-19 | 2007-08-10 | 삼성전자주식회사 | 칩 사이즈 패키지 및 그 제조 방법 |
US8018176B1 (en) | 2007-06-28 | 2011-09-13 | National Semiconductor Corporation | Selectable power FET control for display power converter |
JP2009025535A (ja) * | 2007-07-19 | 2009-02-05 | Hitachi Displays Ltd | 表示装置 |
JP5938968B2 (ja) * | 2012-03-19 | 2016-06-22 | 富士通株式会社 | 情報処理装置、情報処理プログラム及び情報処理方法 |
USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
JP2015049435A (ja) * | 2013-09-03 | 2015-03-16 | 株式会社ジャパンディスプレイ | ドライバic、表示装置およびその検査システム |
USD780763S1 (en) * | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
JP7120520B2 (ja) * | 2018-11-16 | 2022-08-17 | ミネベアミツミ株式会社 | 湿度検出装置及び温度検出装置 |
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US6022792A (en) * | 1996-03-13 | 2000-02-08 | Seiko Instruments, Inc. | Semiconductor dicing and assembling method |
JPH1124605A (ja) | 1997-06-30 | 1999-01-29 | Optrex Corp | 液晶表示素子およびその製造方法 |
US6292248B1 (en) * | 1997-08-09 | 2001-09-18 | Lg. Philips Lcd Co., Ltd. | COG type liquid crystal panel and fabrication method thereof having first and second conductive bumps in different planes |
JP2000223653A (ja) * | 1999-02-02 | 2000-08-11 | Rohm Co Ltd | チップ・オン・チップ構造の半導体装置およびそれに用いる半導体チップ |
JP2001056478A (ja) | 1999-08-17 | 2001-02-27 | Nec Saitama Ltd | 液晶表示装置および半導体素子遮光方法 |
JP3695265B2 (ja) | 1999-11-30 | 2005-09-14 | セイコーエプソン株式会社 | 表示装置及び電子機器 |
JP2002083845A (ja) * | 2000-07-05 | 2002-03-22 | Sharp Corp | フレキシブル配線基板、icチップ実装フレキシブル配線基板およびこれを用いた表示装置並びにicチップ実装構造、icチップ実装フレキシブル配線基板のボンディング方法 |
JP3721999B2 (ja) * | 2001-03-14 | 2005-11-30 | セイコーエプソン株式会社 | 液晶装置及び電子機器 |
JP3744450B2 (ja) * | 2001-05-09 | 2006-02-08 | セイコーエプソン株式会社 | 電気光学装置、駆動用ic及び電子機器 |
JP3573150B2 (ja) * | 2002-01-25 | 2004-10-06 | セイコーエプソン株式会社 | 半導体装置及びこれを含む電気光学装置 |
US6919642B2 (en) * | 2002-07-05 | 2005-07-19 | Industrial Technology Research Institute | Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed |
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US7098526B2 (en) | 2006-08-29 |
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