JP3830272B2 - 基板のめっき装置 - Google Patents
基板のめっき装置 Download PDFInfo
- Publication number
- JP3830272B2 JP3830272B2 JP09697498A JP9697498A JP3830272B2 JP 3830272 B2 JP3830272 B2 JP 3830272B2 JP 09697498 A JP09697498 A JP 09697498A JP 9697498 A JP9697498 A JP 9697498A JP 3830272 B2 JP3830272 B2 JP 3830272B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- substrate
- zone
- contamination
- clean
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title claims description 164
- 239000000758 substrate Substances 0.000 title claims description 120
- 238000011109 contamination Methods 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 37
- 238000012546 transfer Methods 0.000 claims description 33
- 238000004140 cleaning Methods 0.000 claims description 32
- 238000005192 partition Methods 0.000 claims description 32
- 230000008569 process Effects 0.000 claims description 28
- 239000000126 substance Substances 0.000 claims description 28
- 239000003595 mist Substances 0.000 claims description 22
- 238000005406 washing Methods 0.000 claims description 14
- 238000001035 drying Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 238000000638 solvent extraction Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 23
- 229910052802 copper Inorganic materials 0.000 description 23
- 239000010949 copper Substances 0.000 description 23
- 239000000243 solution Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 12
- 230000032258 transport Effects 0.000 description 12
- 238000011068 loading method Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 238000012805 post-processing Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (13)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09697498A JP3830272B2 (ja) | 1998-03-05 | 1998-03-26 | 基板のめっき装置 |
| TW087115386A TW405158B (en) | 1997-09-17 | 1998-09-16 | Plating apparatus for semiconductor wafer processing |
| DE69839066T DE69839066T2 (de) | 1997-09-17 | 1998-09-17 | Vorrichtung zur Substratbeschichtung |
| KR1019980038368A KR100554855B1 (ko) | 1997-09-17 | 1998-09-17 | 기판도금장치 |
| US09/154,895 US6294059B1 (en) | 1997-09-17 | 1998-09-17 | Substrate plating apparatus |
| EP98117633A EP0903774B1 (en) | 1997-09-17 | 1998-09-17 | Substrate plating apparatus |
| TW088103121A TW589399B (en) | 1998-03-02 | 1999-03-02 | Apparatus for plating a substrate |
| PCT/JP1999/000994 WO1999045170A1 (fr) | 1998-03-02 | 1999-03-02 | Dispositif de placage de substrat |
| EP99905338A EP1061157A4 (en) | 1998-03-02 | 1999-03-02 | SUBSTRATE COATING DEVICE |
| US09/623,361 US6582580B1 (en) | 1998-03-02 | 1999-03-02 | Substrate plating apparatus |
| KR1020007009676A KR100597024B1 (ko) | 1998-03-02 | 1999-03-02 | 기판의 도금장치 |
| US09/945,711 US6929722B2 (en) | 1997-09-17 | 2001-09-05 | Substrate plating apparatus |
| US10/786,110 US20040163947A1 (en) | 1997-09-17 | 2004-02-26 | Substrate plating apparatus |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7137098 | 1998-03-05 | ||
| JP10-71370 | 1998-03-05 | ||
| JP09697498A JP3830272B2 (ja) | 1998-03-05 | 1998-03-26 | 基板のめっき装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11315383A JPH11315383A (ja) | 1999-11-16 |
| JPH11315383A5 JPH11315383A5 (enExample) | 2004-12-24 |
| JP3830272B2 true JP3830272B2 (ja) | 2006-10-04 |
Family
ID=26412475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09697498A Expired - Lifetime JP3830272B2 (ja) | 1997-09-17 | 1998-03-26 | 基板のめっき装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3830272B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4664320B2 (ja) * | 2000-03-17 | 2011-04-06 | 株式会社荏原製作所 | めっき方法 |
| US6824612B2 (en) * | 2001-12-26 | 2004-11-30 | Applied Materials, Inc. | Electroless plating system |
| DE102004032659B4 (de) | 2004-07-01 | 2008-10-30 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum chemischen oder elektrolytischen Behandeln von Behandlungsgut sowie die Verwendung der Vorrichtung |
| JP2008121062A (ja) * | 2006-11-10 | 2008-05-29 | Ebara Corp | めっき装置及びめっき方法 |
| JP2009263758A (ja) * | 2008-04-30 | 2009-11-12 | Ebara Corp | 電解めっき装置及び電解めっき方法 |
| US9388504B2 (en) | 2013-03-26 | 2016-07-12 | Ebara Corporation | Plating apparatus and plating method |
| JP2015018894A (ja) * | 2013-07-10 | 2015-01-29 | 株式会社荏原製作所 | めっき装置 |
| CN114981487B (zh) * | 2020-12-28 | 2023-05-02 | 株式会社荏原制作所 | 镀覆装置、以及镀覆装置的动作控制方法 |
| CN114808090B (zh) * | 2022-06-10 | 2023-06-27 | 江西勇骏实业有限公司 | 一种用电设备生产用铜板带双镀机组镀锡设备 |
| CN118843721B (zh) * | 2023-08-23 | 2025-10-31 | 株式会社荏原制作所 | 基板处理装置 |
-
1998
- 1998-03-26 JP JP09697498A patent/JP3830272B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11315383A (ja) | 1999-11-16 |
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