JP3809708B2 - 固体撮像素子並びにその製造方法 - Google Patents

固体撮像素子並びにその製造方法 Download PDF

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Publication number
JP3809708B2
JP3809708B2 JP18935397A JP18935397A JP3809708B2 JP 3809708 B2 JP3809708 B2 JP 3809708B2 JP 18935397 A JP18935397 A JP 18935397A JP 18935397 A JP18935397 A JP 18935397A JP 3809708 B2 JP3809708 B2 JP 3809708B2
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Japan
Prior art keywords
film
lens
silicon nitride
light receiving
nitride film
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Expired - Fee Related
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JP18935397A
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English (en)
Japanese (ja)
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JPH1140787A5 (enExample
JPH1140787A (ja
Inventor
健 松田
祥哲 東宮
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Sony Corp
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Sony Corp
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Application filed by Sony Corp filed Critical Sony Corp
Priority to JP18935397A priority Critical patent/JP3809708B2/ja
Publication of JPH1140787A publication Critical patent/JPH1140787A/ja
Publication of JPH1140787A5 publication Critical patent/JPH1140787A5/ja
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Publication of JP3809708B2 publication Critical patent/JP3809708B2/ja
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  • Solid State Image Pick-Up Elements (AREA)
JP18935397A 1997-07-15 1997-07-15 固体撮像素子並びにその製造方法 Expired - Fee Related JP3809708B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18935397A JP3809708B2 (ja) 1997-07-15 1997-07-15 固体撮像素子並びにその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18935397A JP3809708B2 (ja) 1997-07-15 1997-07-15 固体撮像素子並びにその製造方法

Publications (3)

Publication Number Publication Date
JPH1140787A JPH1140787A (ja) 1999-02-12
JPH1140787A5 JPH1140787A5 (enExample) 2005-04-07
JP3809708B2 true JP3809708B2 (ja) 2006-08-16

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JP18935397A Expired - Fee Related JP3809708B2 (ja) 1997-07-15 1997-07-15 固体撮像素子並びにその製造方法

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JP (1) JP3809708B2 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4562875B2 (ja) * 2000-07-17 2010-10-13 浜松ホトニクス株式会社 半導体装置
JP2002064193A (ja) 2000-08-22 2002-02-28 Sony Corp 固体撮像装置および製造方法
JP3789365B2 (ja) 2002-01-31 2006-06-21 シャープ株式会社 層内レンズ付き半導体装置およびその製造方法
JP2003229553A (ja) * 2002-02-05 2003-08-15 Sharp Corp 半導体装置及びその製造方法
CN1685514A (zh) * 2002-09-27 2005-10-19 索尼株式会社 固态成像装置及其制造方法
JP2004253573A (ja) 2003-02-19 2004-09-09 Sharp Corp 半導体装置およびその製造方法
JP4383959B2 (ja) 2003-05-28 2009-12-16 キヤノン株式会社 光電変換装置およびその製造方法
CN101290942B (zh) * 2003-05-28 2013-03-27 佳能株式会社 光电转换器件
JP2004363356A (ja) * 2003-06-05 2004-12-24 Matsushita Electric Ind Co Ltd 固体撮像装置およびその製造方法
US7474350B2 (en) 2003-09-08 2009-01-06 Sanyo Electric Co., Ltd. Solid state image pickup device comprising lenses for condensing light on photodetection parts
US6903391B2 (en) 2003-09-10 2005-06-07 Fuji Photo Film Co., Ltd. Solid state image pickup device
JP2005086186A (ja) * 2003-09-11 2005-03-31 Matsushita Electric Ind Co Ltd 固体撮像装置とその製造方法
JP4208072B2 (ja) 2003-12-05 2009-01-14 シャープ株式会社 半導体素子およびその製造方法
KR20050057968A (ko) * 2003-12-11 2005-06-16 매그나칩 반도체 유한회사 무기물의 마이크로렌즈를 갖는 이미지센서 제조 방법
JP4595405B2 (ja) * 2004-07-02 2010-12-08 ソニー株式会社 固体撮像装置及びその製造方法
DE602005025834D1 (de) 2004-08-13 2011-02-24 St Microelectronics Sa Bildsensor
JP4546797B2 (ja) 2004-09-24 2010-09-15 パナソニック株式会社 固体撮像装置、その製造方法およびカメラ
JP4761505B2 (ja) 2005-03-01 2011-08-31 キヤノン株式会社 撮像装置、ならびに撮像システム
JP4900228B2 (ja) * 2007-12-18 2012-03-21 ソニー株式会社 固体撮像素子の製造方法
JP2009218341A (ja) 2008-03-10 2009-09-24 Panasonic Corp 固体撮像装置とその製造方法
JP5086877B2 (ja) 2008-04-11 2012-11-28 シャープ株式会社 固体撮像素子およびその製造方法、電子情報機器
JP2010010331A (ja) * 2008-06-26 2010-01-14 Sharp Corp 固体撮像装置およびその製造方法
JP4930539B2 (ja) * 2009-04-13 2012-05-16 ソニー株式会社 固体撮像素子の製造方法
JP5421207B2 (ja) 2010-08-25 2014-02-19 株式会社東芝 固体撮像装置
JP6685653B2 (ja) 2015-05-14 2020-04-22 キヤノン株式会社 固体撮像装置の製造方法
KR20180107145A (ko) 2016-01-29 2018-10-01 타워재즈 파나소닉 세미컨덕터 컴퍼니 리미티드 고체 촬상 장치

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JPH1140787A (ja) 1999-02-12

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