JP4939206B2 - イメージセンサ及びその製造方法 - Google Patents
イメージセンサ及びその製造方法 Download PDFInfo
- Publication number
- JP4939206B2 JP4939206B2 JP2006350424A JP2006350424A JP4939206B2 JP 4939206 B2 JP4939206 B2 JP 4939206B2 JP 2006350424 A JP2006350424 A JP 2006350424A JP 2006350424 A JP2006350424 A JP 2006350424A JP 4939206 B2 JP4939206 B2 JP 4939206B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- image sensor
- medium layer
- film
- refractive index
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- 238000013459 approach Methods 0.000 claims 2
- 239000005380 borophosphosilicate glass Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 description 74
- 230000035945 sensitivity Effects 0.000 description 13
- 101000619488 Homo sapiens Protein LTO1 homolog Proteins 0.000 description 3
- 102100022152 Protein LTO1 homolog Human genes 0.000 description 3
- 239000005368 silicate glass Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
- H01L31/02165—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors using interference filters, e.g. multilayer dielectric filters
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/913—Material designed to be responsive to temperature, light, moisture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24851—Intermediate layer is discontinuous or differential
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
図4は、本発明の実施例1に係るイメージセンサを説明するための断面図である。
図6及び図7は、本発明の実施例2に係るイメージセンサを説明するための断面図である。
図11は、本発明の実施例3に係るイメージセンサを説明するための断面図である。
SUB 基板
CF カラーフィルタ
OCL1、OCL2 平坦化膜
PD フォトダイオード
Claims (20)
- カラーフィルタと、
該カラーフィルタ上に形成された平坦化膜と、
該平坦化膜上に互いに異なる屈折率を有する少なくとも2層以上積層された媒質層と、
を備え、
前記媒質層は、前記カラーフィルタに近づくほど高い屈折率を有することを特徴とするイメージセンサ。 - 前記媒質層の最上層が、空気層よりも高い屈折率を有することを特徴とする請求項1に記載のイメージセンサ。
- 前記最上層が、1.4〜1.45の範囲の屈折率を有する物質で形成されることを特徴とする請求項2に記載のイメージセンサ。
- 前記最上層が、シリコン酸化物系の物質で形成されることを特徴とする請求項3に記載のイメージセンサ。
- 前記媒質層の最下層が、1.5よりも大きい屈折率を有する物質で形成されることを特徴とする請求項2ないし4のいずれか一項に記載のイメージセンサ。
- 前記最上層と前記最下層との間に介在する中間層が、最下層より小さく、且つ、最上層より大きい屈折率を有する物質で形成されることを特徴とする請求項5に記載のイメージセンサ。
- 前記中間層が、BPSG膜又はUSG膜で形成されることを特徴とする請求項6に記載のイメージセンサ。
- 第1領域と、該第1領域よりも入射角の大きい光が入射する第2領域にそれぞれ形成されたカラーフィルタと、
該カラーフィルタ上に形成された平坦化膜と、
前記カラーフィルタにそれぞれ対応するように前記平坦化膜上に形成されたマイクロレンズと、
空気層よりも高い屈折率を有し、前記第2領域の前記マイクロレンズを覆うように形成された媒質層と、
該媒質層を含む全体構造の上を覆うように形成されたキャップ層と、
を備えることを特徴とするイメージセンサ。 - 前記媒質層が、少なくとも1.4以上の屈折率を有する物質で形成されることを特徴とする請求項8に記載のイメージセンサ。
- 前記媒質層が、SOG膜、FSG膜、HDP膜、およびCDO膜の中から選択されたいずれか1つの膜で形成されることを特徴とする請求項9に記載のイメージセンサ。
- 前記キャップ層が、LTO膜で形成されることを特徴とする請求項10に記載のイメージセンサ。
- 第1領域と、該第1領域よりも入射角の大きい光が入射する第2領域にそれぞれ形成されたカラーフィルタと、
該カラーフィルタ上に形成された平坦化膜と、
前記カラーフィルタにそれぞれ対応するように前記平坦化膜上に形成されたマイクロレンズと、
空気層よりも高い屈折率を有し、前記第2領域の前記マイクロレンズを覆うように形成された第1媒質層と、
該第1媒質層よりも低い屈折率を有し、前記第1媒質層を含む全体構造の上を覆うように形成された第2媒質層と、
該第2媒質層上に形成されたキャップ層と、
を備えることを特徴とするイメージセンサ。 - 前記第1媒質層が、少なくとも1.4以上の屈折率を有する物質で形成されることを特徴とする請求項12に記載のイメージセンサ。
- 前記キャップ層が、LTO膜で形成されることを特徴とする請求項13に記載のイメージセンサ。
- カラーフィルタと、
該カラーフィルタ上に形成された平坦化膜と、
前記カラーフィルタにそれぞれ対応するように前記平坦化膜上に形成されたマイクロレンズと、
前記カラーフィルタ上に互いに異なる屈折率を有する少なくとも2層以上積層された媒質層と、
を備え、
前記媒質層は、前記カラーフィルタに近づくほど高い屈折率を有することを特徴とするイメージセンサ。 - 前記媒質層の最上層が、空気層よりも高い屈折率を有することを特徴とする請求項15に記載のイメージセンサ。
- 前記最上層が、シリコン酸化物系の物質で形成されることを特徴とする請求項16に記載のイメージセンサ。
- 第1領域と、該第1領域よりも入射角の大きい光が入射する第2領域にそれぞれカラーフィルタが形成された基板を提供するステップと、
該カラーフィルタ上に平坦化膜を形成するステップと、
前記カラーフィルタにそれぞれ対応するように前記平坦化膜上にマイクロレンズを形成するステップと、
空気層よりも高い屈折率を有し、前記マイクロレンズを覆うように第1媒質層を形成するステップと、
前記第2領域にのみ前記第1媒質層が残留するように前記第1領域に形成された前記第1媒質層を除去するステップと、
該第1媒質層よりも低い屈折率を有し、前記第1媒質層を含む全体構造の上を覆うように第2媒質層を形成するステップと、
該第2媒質層上にキャップ層を形成するステップと、
を含むことを特徴とするイメージセンサの製造方法。 - 前記第1媒質層が、少なくとも1.4以上の屈折率を有する物質で形成されることを特徴とする請求項18に記載のイメージセンサの製造方法。
- 前記第1媒質層が、シリコン酸化膜、BPSG膜、USG膜の中から選択されたいずれか1つの膜で形成されることを特徴とする請求項19に記載のイメージセンサの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2005-0129439 | 2005-12-26 | ||
KR1020050129439A KR100790225B1 (ko) | 2005-12-26 | 2005-12-26 | 이미지 센서 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007181209A JP2007181209A (ja) | 2007-07-12 |
JP4939206B2 true JP4939206B2 (ja) | 2012-05-23 |
Family
ID=38262297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006350424A Active JP4939206B2 (ja) | 2005-12-26 | 2006-12-26 | イメージセンサ及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (4) | US7892628B2 (ja) |
JP (1) | JP4939206B2 (ja) |
KR (1) | KR100790225B1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100771377B1 (ko) * | 2006-12-22 | 2007-10-30 | 동부일렉트로닉스 주식회사 | 이미지 센서 및 그 제조방법 |
KR100900682B1 (ko) * | 2007-06-22 | 2009-06-01 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
CN101588506B (zh) * | 2008-05-22 | 2012-05-30 | 索尼株式会社 | 固体摄像装置及其制造方法以及电子设备 |
JP4835719B2 (ja) | 2008-05-22 | 2011-12-14 | ソニー株式会社 | 固体撮像装置及び電子機器 |
JP4752892B2 (ja) * | 2008-09-30 | 2011-08-17 | セイコーエプソン株式会社 | 流体噴射装置および手術器具 |
KR101647779B1 (ko) * | 2009-09-09 | 2016-08-11 | 삼성전자 주식회사 | 이미지 센서, 그 제조 방법, 및 상기 이미지 센서를 포함하는 장치 |
US8922900B2 (en) * | 2013-01-22 | 2014-12-30 | Taiwan Semiconductor Manufacturing Company Ltd. | Optical element structure and optical element fabricating process for the same |
KR102097440B1 (ko) * | 2013-08-08 | 2020-04-07 | 에스케이하이닉스 주식회사 | 렌즈형 컬러필터를 구비한 이미지 센서 및 그 제조방법 |
JP6818468B2 (ja) * | 2016-08-25 | 2021-01-20 | キヤノン株式会社 | 光電変換装置及びカメラ |
US10050159B2 (en) * | 2016-12-12 | 2018-08-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Lens structure |
EP3343619A1 (en) * | 2016-12-29 | 2018-07-04 | Thomson Licensing | An image sensor comprising at least one sensing unit with light guiding means |
US10297627B1 (en) * | 2017-11-08 | 2019-05-21 | Omnivision Technologies, Inc. | Chip scale package for an image sensor |
KR102506837B1 (ko) * | 2017-11-20 | 2023-03-06 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
US10880467B2 (en) * | 2018-06-25 | 2020-12-29 | Omnivision Technologies, Inc. | Image sensors with phase detection auto-focus pixels |
US10955597B2 (en) * | 2019-01-04 | 2021-03-23 | Visera Technologies Company Limited | Optical devices |
US11621287B2 (en) * | 2020-04-16 | 2023-04-04 | Vanguard International Semiconductor Corporation | Optical sensor device with reduced thickness and method for forming the same |
CN113113454B (zh) * | 2021-03-26 | 2024-06-14 | 武汉华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100357178B1 (ko) * | 1999-05-14 | 2002-10-18 | 주식회사 하이닉스반도체 | 고체 촬상 소자 및 그의 제조 방법 |
JPH04223371A (ja) * | 1990-12-25 | 1992-08-13 | Sony Corp | マイクロレンズアレイ及びこれを用いた固体撮像装置 |
KR0186067B1 (ko) * | 1993-08-06 | 1999-05-15 | 기타지마 요시토시 | 계조 마스크 및 그의 제조방법 |
JP3405620B2 (ja) * | 1995-05-22 | 2003-05-12 | 松下電器産業株式会社 | 固体撮像装置 |
JPH10125887A (ja) * | 1996-10-21 | 1998-05-15 | Toshiba Corp | 固体撮像素子 |
JPH10270672A (ja) * | 1997-03-25 | 1998-10-09 | Sony Corp | 固体撮像素子 |
JP3620237B2 (ja) * | 1997-09-29 | 2005-02-16 | ソニー株式会社 | 固体撮像素子 |
JP3372216B2 (ja) * | 1998-11-11 | 2003-01-27 | 株式会社東芝 | 増幅型固体撮像装置 |
US6171883B1 (en) * | 1999-02-18 | 2001-01-09 | Taiwan Semiconductor Manufacturing Company | Image array optoelectronic microelectronic fabrication with enhanced optical stability and method for fabrication thereof |
US6307243B1 (en) * | 1999-07-19 | 2001-10-23 | Micron Technology, Inc. | Microlens array with improved fill factor |
US6518640B2 (en) * | 1999-12-02 | 2003-02-11 | Nikon Corporation | Solid-state image sensor, production method of the same, and digital camera |
US6221687B1 (en) * | 1999-12-23 | 2001-04-24 | Tower Semiconductor Ltd. | Color image sensor with embedded microlens array |
KR100540557B1 (ko) * | 1999-12-28 | 2006-01-10 | 매그나칩 반도체 유한회사 | 광전송률 개선을 위한 이미지센서 제조 방법 |
US6661581B1 (en) * | 2000-09-29 | 2003-12-09 | Rockwell Scientific Company | Graded index microlenses and methods of design and formation |
KR20020048706A (ko) * | 2000-12-18 | 2002-06-24 | 박종섭 | 마이크로 렌즈 상부에 평탄화층을 구비하는 이미지 센서및 그 제조방법 |
US20040071969A1 (en) * | 2001-05-11 | 2004-04-15 | Hideki Okamoto | Bent glass sheet equipped with optical instrument for vehicle |
KR100410669B1 (ko) * | 2001-06-30 | 2003-12-12 | 주식회사 하이닉스반도체 | 이미지센서 및 그 제조 방법 |
JP4882182B2 (ja) * | 2001-08-08 | 2012-02-22 | 凸版印刷株式会社 | 固体撮像素子 |
JP4136374B2 (ja) * | 2002-01-11 | 2008-08-20 | キヤノン株式会社 | 固体撮像装置および撮像システム |
TW513809B (en) * | 2002-02-07 | 2002-12-11 | United Microelectronics Corp | Method of fabricating an image sensor |
KR100551375B1 (ko) * | 2002-06-29 | 2006-02-09 | 동부아남반도체 주식회사 | 반사 방지막을 이용한 씨모스 이미지 센서 |
US6638786B2 (en) * | 2002-10-25 | 2003-10-28 | Hua Wei Semiconductor (Shanghai ) Co., Ltd. | Image sensor having large micro-lenses at the peripheral regions |
US7126099B2 (en) * | 2003-08-26 | 2006-10-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Image sensor with improved uniformity of effective incident light |
KR100505894B1 (ko) * | 2003-10-24 | 2005-08-01 | 매그나칩 반도체 유한회사 | 저온산화막의 박리현상을 개선한 시모스 이미지센서의제조방법 |
US7239448B2 (en) * | 2003-10-27 | 2007-07-03 | Matsushita Electric Industrial Co., Ltd | Light quantity distribution control element and optical apparatus using the same |
US7492027B2 (en) * | 2004-02-20 | 2009-02-17 | Micron Technology, Inc. | Reduced crosstalk sensor and method of formation |
US7667174B2 (en) * | 2004-10-15 | 2010-02-23 | Konica Minolta Holdings, Inc. | Solid state imaging device in which each photoelectric transducer of plural unit pixels being located axisymmetrically with a symmetrical axis of a centerline passing through an approximate center of the device |
JP4510613B2 (ja) * | 2004-12-28 | 2010-07-28 | パナソニック株式会社 | 固体撮像装置の製造方法 |
US7968888B2 (en) * | 2005-06-08 | 2011-06-28 | Panasonic Corporation | Solid-state image sensor and manufacturing method thereof |
JP4469781B2 (ja) * | 2005-07-20 | 2010-05-26 | パナソニック株式会社 | 固体撮像装置及びその製造方法 |
US7612319B2 (en) * | 2006-06-09 | 2009-11-03 | Aptina Imaging Corporation | Method and apparatus providing a microlens for an image sensor |
-
2005
- 2005-12-26 KR KR1020050129439A patent/KR100790225B1/ko active IP Right Grant
-
2006
- 2006-12-26 JP JP2006350424A patent/JP4939206B2/ja active Active
- 2006-12-26 US US11/645,185 patent/US7892628B2/en not_active Expired - Fee Related
-
2011
- 2011-02-17 US US13/029,238 patent/US8344469B2/en active Active
- 2011-02-17 US US13/029,279 patent/US8287948B2/en active Active
-
2012
- 2012-12-31 US US13/731,682 patent/US8846433B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8344469B2 (en) | 2013-01-01 |
US20130119239A1 (en) | 2013-05-16 |
US20110198486A1 (en) | 2011-08-18 |
US7892628B2 (en) | 2011-02-22 |
US20110198716A1 (en) | 2011-08-18 |
KR100790225B1 (ko) | 2008-01-02 |
US8846433B2 (en) | 2014-09-30 |
US20070164193A1 (en) | 2007-07-19 |
JP2007181209A (ja) | 2007-07-12 |
KR20070067915A (ko) | 2007-06-29 |
US8287948B2 (en) | 2012-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4939206B2 (ja) | イメージセンサ及びその製造方法 | |
JP5639748B2 (ja) | 固体撮像装置とその製造方法 | |
US9087761B2 (en) | Solid-state imaging device including an on-chip lens with two inorganic films thereon | |
US7112511B2 (en) | CMOS image sensor having prism and method for fabricating the same | |
JP6060851B2 (ja) | 固体撮像装置の製造方法 | |
US20080159658A1 (en) | Image Sensor and Method for Manufacturing The Same | |
KR20100109401A (ko) | 고체 촬상 장치, 고체 촬상 장치의 제조 방법, 및 전자 기기 | |
US20200348455A1 (en) | Imaging systems with improved microlenses | |
US20100015748A1 (en) | Image Sensor and Method for Manufacturing the Same | |
JP2004047682A (ja) | 固体撮像装置 | |
JP2005109490A (ja) | イメージセンサー及びその製造方法 | |
JP2011243885A (ja) | 固体撮像装置及びその製造方法 | |
JP2009146957A (ja) | 固体撮像装置及び固体撮像装置の製造方法 | |
JP2008066409A (ja) | 固体撮像装置及びその製造方法 | |
JP2005033074A (ja) | 固体撮像装置およびその製造方法 | |
KR100449951B1 (ko) | 이미지센서 및 그 제조 방법 | |
US20230402476A1 (en) | Image sensor | |
KR20070071016A (ko) | 이미지 센서 및 그 제조방법 | |
KR100682248B1 (ko) | 시모스 이미지센서의 제조방법 | |
KR20100080135A (ko) | 이미지 센서 및 그 제조방법 | |
KR100932132B1 (ko) | 이미지 센서의 제조 방법 | |
KR20070036529A (ko) | 이미지 센서 및 그 제조방법 | |
KR20070044626A (ko) | 이미지센서 및 그 제조방법 | |
KR20070071046A (ko) | 이미지 센서 및 그 제조 방법 | |
KR20070055865A (ko) | 이미지 센서 및 그 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20090624 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20090713 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091202 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110708 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110712 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20110928 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111005 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120127 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120224 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150302 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4939206 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |