JP3787489B2 - 脆性基板のブレイク方法及び装置 - Google Patents

脆性基板のブレイク方法及び装置 Download PDF

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Publication number
JP3787489B2
JP3787489B2 JP2000302059A JP2000302059A JP3787489B2 JP 3787489 B2 JP3787489 B2 JP 3787489B2 JP 2000302059 A JP2000302059 A JP 2000302059A JP 2000302059 A JP2000302059 A JP 2000302059A JP 3787489 B2 JP3787489 B2 JP 3787489B2
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JP
Japan
Prior art keywords
substrate
brittle substrate
brittle
break
scribe line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2000302059A
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English (en)
Japanese (ja)
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JP2002103295A5 (enrdf_load_stackoverflow
JP2002103295A (ja
Inventor
生芳 高松
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2000302059A priority Critical patent/JP3787489B2/ja
Priority to KR1020010059010A priority patent/KR100573207B1/ko
Priority to TW090123554A priority patent/TW527328B/zh
Priority to CNB011354437A priority patent/CN1238167C/zh
Publication of JP2002103295A publication Critical patent/JP2002103295A/ja
Priority to HK02108249.0A priority patent/HK1048280A1/zh
Publication of JP2002103295A5 publication Critical patent/JP2002103295A5/ja
Application granted granted Critical
Publication of JP3787489B2 publication Critical patent/JP3787489B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP2000302059A 2000-10-02 2000-10-02 脆性基板のブレイク方法及び装置 Expired - Fee Related JP3787489B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000302059A JP3787489B2 (ja) 2000-10-02 2000-10-02 脆性基板のブレイク方法及び装置
KR1020010059010A KR100573207B1 (ko) 2000-10-02 2001-09-24 취성기판의 절단방법 및 그 방법을 사용하는 브레이크 기구, 절단장치 및 절단 시스템
TW090123554A TW527328B (en) 2000-10-02 2001-09-25 Method and device for manufacturing brittle substrates
CNB011354437A CN1238167C (zh) 2000-10-02 2001-09-28 脆性基板的切断方法、使用该方法的断裂装置、切断装置及切断系统
HK02108249.0A HK1048280A1 (zh) 2000-10-02 2002-11-14 脆性基板的製造方法及其製造裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000302059A JP3787489B2 (ja) 2000-10-02 2000-10-02 脆性基板のブレイク方法及び装置

Publications (3)

Publication Number Publication Date
JP2002103295A JP2002103295A (ja) 2002-04-09
JP2002103295A5 JP2002103295A5 (enrdf_load_stackoverflow) 2005-02-03
JP3787489B2 true JP3787489B2 (ja) 2006-06-21

Family

ID=18783487

Family Applications (1)

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JP2000302059A Expired - Fee Related JP3787489B2 (ja) 2000-10-02 2000-10-02 脆性基板のブレイク方法及び装置

Country Status (5)

Country Link
JP (1) JP3787489B2 (enrdf_load_stackoverflow)
KR (1) KR100573207B1 (enrdf_load_stackoverflow)
CN (1) CN1238167C (enrdf_load_stackoverflow)
HK (1) HK1048280A1 (enrdf_load_stackoverflow)
TW (1) TW527328B (enrdf_load_stackoverflow)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012218246A (ja) * 2011-04-06 2012-11-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断装置
JP2012218245A (ja) * 2011-04-06 2012-11-12 Mitsuboshi Diamond Industrial Co Ltd ブレイク装置およびブレイク方法
KR20140138021A (ko) 2013-05-24 2014-12-03 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠 그리고 그의 제조 방법
KR20170003386A (ko) 2015-06-30 2017-01-09 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠 및 그 제조방법
KR20170015136A (ko) 2015-07-31 2017-02-08 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠
KR20170132665A (ko) 2016-05-24 2017-12-04 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠
KR20180077024A (ko) 2016-12-28 2018-07-06 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠
KR20180077025A (ko) 2016-12-28 2018-07-06 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠
KR20190024767A (ko) 2017-08-29 2019-03-08 미쓰보시 다이야몬도 고교 가부시키가이샤 분단 장치
KR20190024768A (ko) 2017-08-29 2019-03-08 미쓰보시 다이야몬도 고교 가부시키가이샤 분단 장치
KR20200057617A (ko) 2018-11-16 2020-05-26 미쓰보시 다이야몬도 고교 가부시키가이샤 유리프릿막 부착 유리 기판의 스크라이브 방법

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4169565B2 (ja) * 2002-10-11 2008-10-22 三星ダイヤモンド工業株式会社 脆性材料基板のブレーク方法及びその装置並びに加工装置
KR100724474B1 (ko) 2002-10-22 2007-06-04 엘지.필립스 엘시디 주식회사 액정 표시패널의 절단 장치 및 이를 이용한 절단방법
AU2003268668A1 (en) * 2002-11-22 2004-06-18 Mitsuboshi Diamond Industrial Co., Ltd. Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method
CN100382941C (zh) * 2003-04-18 2008-04-23 鸿富锦精密工业（深圳）有限公司 光学元件的切割方法
US20070051769A1 (en) * 2003-04-28 2007-03-08 Mitsuboshi Diamond Industrial Co., Ltd. Brittle substrate cutting system and brittle substrate cutting method
JP4839007B2 (ja) * 2005-03-17 2011-12-14 株式会社尼崎工作所 合せガラス切断装置
JP2010232603A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 基板固定装置
JP5308892B2 (ja) * 2009-04-01 2013-10-09 三星ダイヤモンド工業株式会社 集積型薄膜太陽電池の製造装置
JP5583478B2 (ja) * 2010-05-25 2014-09-03 株式会社シライテック パネルの折割装置
JP5210409B2 (ja) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 ブレイク装置
KR101329819B1 (ko) * 2012-01-31 2013-11-15 주식회사 티이에스 기판 분단 시스템 및 기판 분단 방법
JP5981791B2 (ja) * 2012-07-18 2016-08-31 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
CN103586985A (zh) * 2012-08-17 2014-02-19 佳友科技有限公司 脆性材料加工方法与系统
JP6140012B2 (ja) 2013-07-08 2017-05-31 三星ダイヤモンド工業株式会社 貼り合わせ基板のブレイク方法
JP6115438B2 (ja) * 2013-10-16 2017-04-19 三星ダイヤモンド工業株式会社 破断装置及び分断方法
JP6213134B2 (ja) * 2013-10-16 2017-10-18 三星ダイヤモンド工業株式会社 弾性支持板、破断装置及び分断方法
JP2015140289A (ja) * 2014-01-29 2015-08-03 三星ダイヤモンド工業株式会社 ブレイク装置
JP6387695B2 (ja) 2014-06-13 2018-09-12 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
FR3024136B1 (fr) * 2014-07-24 2021-04-30 Saint Gobain Procede de rompage d'une feuille de verre
JP6005708B2 (ja) * 2014-10-23 2016-10-12 三星ダイヤモンド工業株式会社 イメージセンサ用ウエハ積層体の分断方法及び分断装置
JP3195489U (ja) * 2014-11-05 2015-01-22 株式会社シライテック パネルの折割装置
FR3031102B1 (fr) * 2014-12-31 2017-01-27 Saint Gobain Procede de rompage d'une forme interieure dans une feuille de verre
JP6716900B2 (ja) * 2015-12-04 2020-07-01 三星ダイヤモンド工業株式会社 分断装置
JP2017112265A (ja) * 2015-12-17 2017-06-22 株式会社ディスコ ウエーハの加工方法
CN108423981B (zh) * 2018-05-21 2020-12-25 武汉华星光电半导体显示技术有限公司 一种玻璃基板裂片的方法及装置
JP2024077175A (ja) * 2022-11-28 2024-06-07 日本電気硝子株式会社 ガラス物品の製造装置、及びガラス物品の製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012218246A (ja) * 2011-04-06 2012-11-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断装置
JP2012218245A (ja) * 2011-04-06 2012-11-12 Mitsuboshi Diamond Industrial Co Ltd ブレイク装置およびブレイク方法
KR101323671B1 (ko) * 2011-04-06 2013-10-30 미쓰보시 다이야몬도 고교 가부시키가이샤 브레이크 장치 및 브레이크 방법
KR20140138021A (ko) 2013-05-24 2014-12-03 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠 그리고 그의 제조 방법
KR20170003386A (ko) 2015-06-30 2017-01-09 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠 및 그 제조방법
KR20170015136A (ko) 2015-07-31 2017-02-08 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠
KR20170132665A (ko) 2016-05-24 2017-12-04 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠
KR20180077024A (ko) 2016-12-28 2018-07-06 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠
KR20180077025A (ko) 2016-12-28 2018-07-06 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠
KR20190024767A (ko) 2017-08-29 2019-03-08 미쓰보시 다이야몬도 고교 가부시키가이샤 분단 장치
KR20190024768A (ko) 2017-08-29 2019-03-08 미쓰보시 다이야몬도 고교 가부시키가이샤 분단 장치
KR20200057617A (ko) 2018-11-16 2020-05-26 미쓰보시 다이야몬도 고교 가부시키가이샤 유리프릿막 부착 유리 기판의 스크라이브 방법

Also Published As

Publication number Publication date
CN1348850A (zh) 2002-05-15
TW527328B (en) 2003-04-11
HK1048280A1 (zh) 2003-03-28
CN1238167C (zh) 2006-01-25
KR20020026815A (ko) 2002-04-12
KR100573207B1 (ko) 2006-04-24
JP2002103295A (ja) 2002-04-09

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