JP3775480B2 - 光モジュールの製造方法 - Google Patents

光モジュールの製造方法 Download PDF

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Publication number
JP3775480B2
JP3775480B2 JP2001070612A JP2001070612A JP3775480B2 JP 3775480 B2 JP3775480 B2 JP 3775480B2 JP 2001070612 A JP2001070612 A JP 2001070612A JP 2001070612 A JP2001070612 A JP 2001070612A JP 3775480 B2 JP3775480 B2 JP 3775480B2
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JP
Japan
Prior art keywords
optical
recess
platform
optical element
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001070612A
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English (en)
Japanese (ja)
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JP2002267893A (ja
JP2002267893A5 (enExample
Inventor
昭浩 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2001070612A priority Critical patent/JP3775480B2/ja
Publication of JP2002267893A publication Critical patent/JP2002267893A/ja
Publication of JP2002267893A5 publication Critical patent/JP2002267893A5/ja
Application granted granted Critical
Publication of JP3775480B2 publication Critical patent/JP3775480B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Semiconductor Lasers (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2001070612A 2001-03-13 2001-03-13 光モジュールの製造方法 Expired - Fee Related JP3775480B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001070612A JP3775480B2 (ja) 2001-03-13 2001-03-13 光モジュールの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001070612A JP3775480B2 (ja) 2001-03-13 2001-03-13 光モジュールの製造方法

Publications (3)

Publication Number Publication Date
JP2002267893A JP2002267893A (ja) 2002-09-18
JP2002267893A5 JP2002267893A5 (enExample) 2005-02-24
JP3775480B2 true JP3775480B2 (ja) 2006-05-17

Family

ID=18928454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001070612A Expired - Fee Related JP3775480B2 (ja) 2001-03-13 2001-03-13 光モジュールの製造方法

Country Status (1)

Country Link
JP (1) JP3775480B2 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005165165A (ja) * 2003-12-05 2005-06-23 Suzuka Fuji Xerox Co Ltd レセプタクル及びレセプタクルの製造方法
JP3935467B2 (ja) * 2003-12-26 2007-06-20 株式会社東芝 光半導体モジュールの製造方法
JP3991318B2 (ja) 2004-01-20 2007-10-17 セイコーエプソン株式会社 光モジュールの製造方法、光通信装置、電子機器
JP4572312B2 (ja) * 2004-02-23 2010-11-04 スタンレー電気株式会社 Ｌｅｄ及びその製造方法
JP2006162654A (ja) 2004-12-02 2006-06-22 Olympus Corp 光学デバイス及び照明装置
JP2006267501A (ja) * 2005-03-23 2006-10-05 Fuji Xerox Co Ltd サブマウントの製造方法、サブマウント、及び光送受信モジュール
JP4592628B2 (ja) * 2006-03-28 2010-12-01 株式会社豊田中央研究所 光モジュールの製造方法
JP2008147383A (ja) * 2006-12-08 2008-06-26 Matsushita Electric Works Ltd 光電変換モジュール
JP4850147B2 (ja) * 2007-08-23 2012-01-11 独立行政法人産業技術総合研究所 光モジュール
WO2010113911A1 (ja) * 2009-03-30 2010-10-07 株式会社オートネットワーク技術研究所 光通信モジュール及び光通信モジュールの製造方法
JP5338899B2 (ja) * 2009-03-30 2013-11-13 株式会社オートネットワーク技術研究所 光通信モジュール及び光通信モジュールの製造方法
JP5375535B2 (ja) * 2009-11-11 2013-12-25 住友電気工業株式会社 光電気変換モジュール
WO2011118398A1 (ja) * 2010-03-26 2011-09-29 株式会社村田製作所 テラヘルツ光受発光モジュール
WO2011118397A1 (ja) * 2010-03-26 2011-09-29 株式会社村田製作所 テラヘルツ光受発光モジュールおよびテラヘルツ光の偏光制御方法
US8260097B2 (en) * 2010-06-16 2012-09-04 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Opto-electronic alignment system and method
JP2012194401A (ja) 2011-03-16 2012-10-11 Nitto Denko Corp 光電気混載基板およびその製法
JP5919632B2 (ja) * 2011-03-29 2016-05-18 住友電気工業株式会社 光電変換モジュール用部品の製造方法
JP5710532B2 (ja) * 2012-03-26 2015-04-30 株式会社東芝 半導体発光装置及びその製造方法
JP5999417B2 (ja) * 2012-06-22 2016-09-28 矢崎総業株式会社 光通信モジュール
JP6321933B2 (ja) * 2013-09-26 2018-05-09 オリンパス株式会社 光伝送モジュール、及び内視鏡
JP6139427B2 (ja) * 2014-02-04 2017-05-31 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 発光装置及びその製造方法
KR101925476B1 (ko) * 2015-11-25 2018-12-05 주식회사 옵텔라 광학 모듈 및 이를 포함하는 광학 엔진
JPWO2017141369A1 (ja) * 2016-02-17 2018-12-06 オリンパス株式会社 光伝送モジュールおよび内視鏡
JP6665666B2 (ja) 2016-04-28 2020-03-13 日亜化学工業株式会社 発光装置の製造方法、レーザモジュールの製造方法及び発光装置
KR102646798B1 (ko) * 2018-10-16 2024-03-13 주식회사 루멘스 엘이디 디스플레이 패널 제조를 위한 마이크로 엘이디 칩 어레이 방법 및 이에 이용되는 멀티 칩 캐리어
JP6545889B1 (ja) * 2018-02-14 2019-07-17 ルーメンス カンパニー リミテッド Ｌｅｄディスプレイパネル製造のためのマイクロｌｅｄチップアレイ方法及びこれに用いられるマルチチップキャリア
JP7331508B2 (ja) * 2019-07-11 2023-08-23 日本電気株式会社 光モジュールおよび光モジュールの製造方法
JP2022050209A (ja) * 2020-09-17 2022-03-30 住友電気工業株式会社 光モジュール及び光コネクタケーブル
CN116609893A (zh) * 2022-02-16 2023-08-18 Tdk株式会社 光学装置、电子部件的安装方法
JP7722215B2 (ja) * 2022-02-17 2025-08-13 住友電気工業株式会社 モジュール、接続構造、接続構造の製造方法、及び基板

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