JP3748779B2 - 半導体素子の実装方法、及び熱可塑性若しくは熱硬化性のシート - Google Patents

半導体素子の実装方法、及び熱可塑性若しくは熱硬化性のシート Download PDF

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Publication number
JP3748779B2
JP3748779B2 JP2001040357A JP2001040357A JP3748779B2 JP 3748779 B2 JP3748779 B2 JP 3748779B2 JP 2001040357 A JP2001040357 A JP 2001040357A JP 2001040357 A JP2001040357 A JP 2001040357A JP 3748779 B2 JP3748779 B2 JP 3748779B2
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Japan
Prior art keywords
semiconductor element
light emitting
sheet
emitting element
external electrode
Prior art date
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Expired - Fee Related
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JP2001040357A
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English (en)
Japanese (ja)
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JP2002246418A (ja
JP2002246418A5 (https=
Inventor
法人 塚原
和司 東
博之 大谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2001040357A priority Critical patent/JP3748779B2/ja
Publication of JP2002246418A publication Critical patent/JP2002246418A/ja
Publication of JP2002246418A5 publication Critical patent/JP2002246418A5/ja
Application granted granted Critical
Publication of JP3748779B2 publication Critical patent/JP3748779B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2001040357A 2001-02-16 2001-02-16 半導体素子の実装方法、及び熱可塑性若しくは熱硬化性のシート Expired - Fee Related JP3748779B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001040357A JP3748779B2 (ja) 2001-02-16 2001-02-16 半導体素子の実装方法、及び熱可塑性若しくは熱硬化性のシート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001040357A JP3748779B2 (ja) 2001-02-16 2001-02-16 半導体素子の実装方法、及び熱可塑性若しくは熱硬化性のシート

Publications (3)

Publication Number Publication Date
JP2002246418A JP2002246418A (ja) 2002-08-30
JP2002246418A5 JP2002246418A5 (https=) 2005-05-26
JP3748779B2 true JP3748779B2 (ja) 2006-02-22

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JP2001040357A Expired - Fee Related JP3748779B2 (ja) 2001-02-16 2001-02-16 半導体素子の実装方法、及び熱可塑性若しくは熱硬化性のシート

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JP (1) JP3748779B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11251328B2 (en) 2012-11-12 2022-02-15 Epistar Corporation Semiconductor light emitting device and method of fabricating the same

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6821878B2 (en) * 2003-02-27 2004-11-23 Freescale Semiconductor, Inc. Area-array device assembly with pre-applied underfill layers on printed wiring board
JP4649852B2 (ja) * 2004-03-08 2011-03-16 カシオ計算機株式会社 電子部品の接合方法および電子部品の接合構造
JP4670697B2 (ja) * 2006-03-24 2011-04-13 株式会社デンソー センサ装置の製造方法
JP5141545B2 (ja) * 2008-12-26 2013-02-13 株式会社デンソー 力学量センサ装置
JPWO2011093405A1 (ja) * 2010-02-01 2013-06-06 有限会社Ｍｔｅｃ チップサイズパッケージの光半導体装置
JP5998450B2 (ja) * 2011-10-19 2016-09-28 住友ベークライト株式会社 光導波路モジュール、光導波路モジュールの製造方法および電子機器
CN108922959B (zh) 2013-03-28 2022-07-29 日亚化学工业株式会社 发光装置、及使用发光装置的装置
JP5723497B2 (ja) 2013-03-28 2015-05-27 東芝ホクト電子株式会社 発光装置の製造方法
WO2015083365A1 (ja) 2013-12-02 2015-06-11 東芝ホクト電子株式会社 発光装置およびその製造方法
CN105518886A (zh) 2013-12-02 2016-04-20 东芝北斗电子株式会社 发光单元、发光装置及发光单元的制造方法
WO2015083364A1 (ja) 2013-12-02 2015-06-11 東芝ホクト電子株式会社 発光装置
JPWO2015146115A1 (ja) 2014-03-25 2017-04-13 東芝ホクト電子株式会社 発光装置
CN106030839B (zh) 2014-09-26 2018-09-28 东芝北斗电子株式会社 发光模块
WO2016047133A1 (ja) 2014-09-26 2016-03-31 東芝ホクト電子株式会社 発光モジュール
US11362060B2 (en) 2019-01-25 2022-06-14 Epistar Corporation Method and structure for die bonding using energy beam
CN112992757B (zh) * 2020-07-03 2022-04-29 重庆康佳光电技术研究院有限公司 微发光二极管芯片巨量转移方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11251328B2 (en) 2012-11-12 2022-02-15 Epistar Corporation Semiconductor light emitting device and method of fabricating the same
US11791436B2 (en) 2012-11-12 2023-10-17 Epistar Corporation Semiconductor light emitting device and method of fabricating the same
US12471412B2 (en) 2012-11-12 2025-11-11 Epistar Corporation Semiconductor light emitting device and method of fabricating the same

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JP2002246418A (ja) 2002-08-30

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