JP3718790B2 - 銀及び銀合金メッキ浴 - Google Patents

銀及び銀合金メッキ浴 Download PDF

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Publication number
JP3718790B2
JP3718790B2 JP36619298A JP36619298A JP3718790B2 JP 3718790 B2 JP3718790 B2 JP 3718790B2 JP 36619298 A JP36619298 A JP 36619298A JP 36619298 A JP36619298 A JP 36619298A JP 3718790 B2 JP3718790 B2 JP 3718790B2
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JP
Japan
Prior art keywords
silver
acid
plating bath
group
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP36619298A
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English (en)
Japanese (ja)
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JP2000192279A5 (https=
JP2000192279A (ja
Inventor
清貴 辻
哲治 西川
孝夫 武内
恵吾 小幡
秀美 繩舟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Chemical Co Ltd
Daiwa Fine Chemicals Co Ltd
Original Assignee
Ishihara Chemical Co Ltd
Daiwa Fine Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishihara Chemical Co Ltd, Daiwa Fine Chemicals Co Ltd filed Critical Ishihara Chemical Co Ltd
Priority to JP36619298A priority Critical patent/JP3718790B2/ja
Publication of JP2000192279A publication Critical patent/JP2000192279A/ja
Publication of JP2000192279A5 publication Critical patent/JP2000192279A5/ja
Application granted granted Critical
Publication of JP3718790B2 publication Critical patent/JP3718790B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)
JP36619298A 1998-12-24 1998-12-24 銀及び銀合金メッキ浴 Expired - Fee Related JP3718790B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36619298A JP3718790B2 (ja) 1998-12-24 1998-12-24 銀及び銀合金メッキ浴

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36619298A JP3718790B2 (ja) 1998-12-24 1998-12-24 銀及び銀合金メッキ浴

Publications (3)

Publication Number Publication Date
JP2000192279A JP2000192279A (ja) 2000-07-11
JP2000192279A5 JP2000192279A5 (https=) 2005-01-06
JP3718790B2 true JP3718790B2 (ja) 2005-11-24

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ID=18486154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36619298A Expired - Fee Related JP3718790B2 (ja) 1998-12-24 1998-12-24 銀及び銀合金メッキ浴

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JP (1) JP3718790B2 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10026680C1 (de) * 2000-05-30 2002-02-21 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten
BR0114600B1 (pt) * 2000-10-19 2011-04-05 banho de revestimento eletrolìtico de cobre e processo de eletroposição de uma camada fosca de cobre.
JP2002322595A (ja) * 2001-04-25 2002-11-08 Sekisui Chem Co Ltd 導電性微粒子及び微粒子のめっき方法及び接続構造体
DE10124002C1 (de) * 2001-05-17 2003-02-06 Ami Doduco Gmbh Saures Silberbad
JP4660806B2 (ja) * 2001-05-30 2011-03-30 石原薬品株式会社 無電解銀メッキ浴
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
WO2007010653A1 (ja) * 2005-07-19 2007-01-25 Konica Minolta Holding, Inc. 常温溶融塩および表示素子
EP2221396A1 (en) 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
JP5150016B2 (ja) * 2009-05-12 2013-02-20 石原薬品株式会社 スズ又はスズ合金メッキ浴、及び当該メッキ浴を用いたバレルメッキ方法
CN102071445B (zh) * 2011-02-28 2012-06-20 济南德锡科技有限公司 一种无氰镀银光亮剂及其电镀液
US8980077B2 (en) 2012-03-30 2015-03-17 Rohm And Haas Electronic Materials Llc Plating bath and method
US20180327922A1 (en) * 2015-11-06 2018-11-15 Jcu Corporation Nickel-plating additive and satin nickel-plating bath containing same
WO2018142776A1 (ja) 2017-01-31 2018-08-09 三菱マテリアル株式会社 錫合金めっき液
JP6432667B2 (ja) 2017-01-31 2018-12-05 三菱マテリアル株式会社 錫合金めっき液
HUE065816T2 (hu) * 2017-04-05 2024-06-28 Basf Se Heterogén katalizátorok nitroaromás vegyületek izocianátokká történõ közvetlen karbonilezésére
JP6645609B2 (ja) 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
JP7035883B2 (ja) * 2018-07-27 2022-03-15 三菱マテリアル株式会社 剥離液
CN112236548B (zh) * 2018-07-27 2022-03-04 三菱综合材料株式会社 锡合金镀液
US11434577B2 (en) * 2019-10-17 2022-09-06 Rohm And Haas Electronic Materials Llc Acid aqueous binary silver-bismuth alloy electroplating compositions and methods
US20210172082A1 (en) * 2019-12-10 2021-06-10 Rohm And Haas Electronic Materials Llc Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods
US20240116861A1 (en) * 2019-12-12 2024-04-11 Mitsubishi Materials Corporation Dithiapolyether diol, method for producing same, snag plating solution containing dithiapolyether diol, and method for forming plating film with use of snag plating solution
JP7455675B2 (ja) * 2020-06-04 2024-03-26 上村工業株式会社 錫または錫合金めっき浴
JP7740879B2 (ja) 2021-01-20 2025-09-17 株式会社Jcu 電解銀めっき浴およびこれを用いた電解銀めっき方法
CN114059112A (zh) * 2021-08-04 2022-02-18 中国科学院宁波材料技术与工程研究所 一种无氰镀银的电镀液及其应用

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Publication number Publication date
JP2000192279A (ja) 2000-07-11

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