JP3707481B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP3707481B2
JP3707481B2 JP2003271768A JP2003271768A JP3707481B2 JP 3707481 B2 JP3707481 B2 JP 3707481B2 JP 2003271768 A JP2003271768 A JP 2003271768A JP 2003271768 A JP2003271768 A JP 2003271768A JP 3707481 B2 JP3707481 B2 JP 3707481B2
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Prior art keywords
resin layer
layer
semiconductor device
resin
manufacturing
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Expired - Fee Related
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JP2003271768A
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English (en)
Japanese (ja)
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JP2004158827A5 (enExample
JP2004158827A (ja
Inventor
輝直 花岡
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2003271768A priority Critical patent/JP3707481B2/ja
Priority to US10/679,467 priority patent/US7176572B2/en
Publication of JP2004158827A publication Critical patent/JP2004158827A/ja
Publication of JP2004158827A5 publication Critical patent/JP2004158827A5/ja
Application granted granted Critical
Publication of JP3707481B2 publication Critical patent/JP3707481B2/ja
Priority to US11/649,871 priority patent/US7294933B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2003271768A 2002-10-15 2003-07-08 半導体装置の製造方法 Expired - Fee Related JP3707481B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003271768A JP3707481B2 (ja) 2002-10-15 2003-07-08 半導体装置の製造方法
US10/679,467 US7176572B2 (en) 2002-10-15 2003-10-07 Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
US11/649,871 US7294933B2 (en) 2002-10-15 2007-01-05 Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002300261 2002-10-15
JP2003271768A JP3707481B2 (ja) 2002-10-15 2003-07-08 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2004158827A JP2004158827A (ja) 2004-06-03
JP2004158827A5 JP2004158827A5 (enExample) 2005-07-07
JP3707481B2 true JP3707481B2 (ja) 2005-10-19

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US (2) US7176572B2 (enExample)
JP (1) JP3707481B2 (enExample)

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JP2007115957A (ja) 2005-10-21 2007-05-10 Seiko Epson Corp 半導体装置及びその製造方法
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JP4995551B2 (ja) * 2006-12-01 2012-08-08 ローム株式会社 半導体装置及び半導体装置の製造方法
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US7875972B2 (en) * 2009-06-25 2011-01-25 International Business Machines Corporation Semiconductor device assembly having a stress-relieving buffer layer
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US8264089B2 (en) 2010-03-17 2012-09-11 Maxim Integrated Products, Inc. Enhanced WLP for superior temp cycling, drop test and high current applications
US9202714B2 (en) * 2012-04-24 2015-12-01 Micron Technology, Inc. Methods for forming semiconductor device packages
JP5968711B2 (ja) * 2012-07-25 2016-08-10 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
US10008413B2 (en) * 2013-08-27 2018-06-26 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer level dicing method
US9875913B2 (en) * 2013-10-30 2018-01-23 Taiwan Semiconductor Manufacturing Company, Ltd. Method for singulating packaged integrated circuits and resulting structures

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US20070120251A1 (en) 2007-05-31
US7294933B2 (en) 2007-11-13
US20050040523A1 (en) 2005-02-24
US7176572B2 (en) 2007-02-13

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