JP3192220B2 - 回路モジュール冗長性アーキテクチャ - Google Patents

回路モジュール冗長性アーキテクチャ

Info

Publication number
JP3192220B2
JP3192220B2 JP17349792A JP17349792A JP3192220B2 JP 3192220 B2 JP3192220 B2 JP 3192220B2 JP 17349792 A JP17349792 A JP 17349792A JP 17349792 A JP17349792 A JP 17349792A JP 3192220 B2 JP3192220 B2 JP 3192220B2
Authority
JP
Japan
Prior art keywords
circuit
interconnect
module
semiconductor device
segment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP17349792A
Other languages
English (en)
Japanese (ja)
Other versions
JPH06295958A (ja
Inventor
ツー フ−チー
リュン ウィンギュ
Original Assignee
ツー フ−チー
リュン ウィンギュ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ツー フ−チー, リュン ウィンギュ filed Critical ツー フ−チー
Publication of JPH06295958A publication Critical patent/JPH06295958A/ja
Application granted granted Critical
Publication of JP3192220B2 publication Critical patent/JP3192220B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP17349792A 1992-04-08 1992-06-30 回路モジュール冗長性アーキテクチャ Expired - Lifetime JP3192220B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86541092A 1992-04-08 1992-04-08
US865410 1992-04-08

Publications (2)

Publication Number Publication Date
JPH06295958A JPH06295958A (ja) 1994-10-21
JP3192220B2 true JP3192220B2 (ja) 2001-07-23

Family

ID=25345448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17349792A Expired - Lifetime JP3192220B2 (ja) 1992-04-08 1992-06-30 回路モジュール冗長性アーキテクチャ

Country Status (2)

Country Link
JP (1) JP3192220B2 (pt)
TW (1) TW223688B (pt)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7411412B2 (en) 2005-08-10 2008-08-12 Sony Corporation Semiconductor integrated circuit
US7646209B2 (en) 2005-07-12 2010-01-12 Sony Corporation Semiconductor integrated circuit and method of production of same
KR102400825B1 (ko) * 2017-09-28 2022-05-23 일루미나, 인코포레이티드 액체 샘플 로딩

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551844B1 (en) 1997-01-15 2003-04-22 Formfactor, Inc. Test assembly including a test die for testing a semiconductor product die
US6557020B1 (en) 1997-12-10 2003-04-29 Seiko Epson Corporation Information processing system, enciphering/deciphering system, system LSI, and electronic apparatus
JP3816034B2 (ja) 2002-07-16 2006-08-30 松下電器産業株式会社 メモリ混載半導体集積回路
JP2007101395A (ja) 2005-10-05 2007-04-19 Sony Corp 回路装置の検査装置、検査方法及び製造方法
KR102065288B1 (ko) * 2016-01-29 2020-01-10 바렉스 이미징 코포레이션 매트릭스 유형 집적 회로용 행 구동기 장애 분리 회로
CN117153817A (zh) * 2022-05-23 2023-12-01 华为技术有限公司 芯片和用于芯片互联的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6095641A (ja) * 1983-10-28 1985-05-29 Nec Corp ２重化装置
JPS63246843A (ja) * 1987-04-02 1988-10-13 Toshiba Corp 半導体集積回路装置
JPS6419745A (en) * 1987-07-15 1989-01-23 Hitachi Ltd Wafer scale integrated circuit device
JPH03201551A (ja) * 1989-12-28 1991-09-03 Hitachi Ltd 半導体集積回路装置
JP2660090B2 (ja) * 1990-08-31 1997-10-08 株式会社東芝 半導体集積回路

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7646209B2 (en) 2005-07-12 2010-01-12 Sony Corporation Semiconductor integrated circuit and method of production of same
US7411412B2 (en) 2005-08-10 2008-08-12 Sony Corporation Semiconductor integrated circuit
KR102400825B1 (ko) * 2017-09-28 2022-05-23 일루미나, 인코포레이티드 액체 샘플 로딩

Also Published As

Publication number Publication date
JPH06295958A (ja) 1994-10-21
TW223688B (pt) 1994-05-11

Similar Documents

Publication Publication Date Title
US5576554A (en) Wafer-scale integrated circuit interconnect structure architecture
US5843799A (en) Circuit module redundancy architecture process
US5128737A (en) Semiconductor integrated circuit fabrication yield improvements
US6717864B2 (en) Latched sense amplifiers as high speed memory in a memory system
US4007452A (en) Wafer scale integration system
KR100895073B1 (ko) 메모리 평면 및 메모리 장치
CA1236918A (en) Wafer level integration technique
US7626248B2 (en) Semiconductor package with a controlled impedance bus
US5404033A (en) Application specific integrated circuit and placement and routing software with non-customizable first metal layer and vias and customizable second metal grid pattern
EP0437081B1 (en) Redundancy for serial memory
JPH03502845A (ja) Ｉｃウェハ用の冗長および試験技術
JPH0320840B2 (pt)
JPH01501033A (ja) 素早い注文設計及び独特な試験能力の為の集積回路パッケージ形式
JP3192220B2 (ja) 回路モジュール冗長性アーキテクチャ
JP3592885B2 (ja) 半導体集積回路装置
JPH0517580B2 (pt)
US6067268A (en) Redundancy fuse box and method for arranging the same
JP3292191B2 (ja) 半導体記憶装置
JPS6025251A (ja) 半導体集積回路装置
JPS59119743A (ja) 集積回路の冗長構成方式
US20220037207A1 (en) Method for fabricating semiconductor memory and the semiconductor memory
GB2244826A (en) Linking circuit modules
US6985396B2 (en) Semiconductor integrated circuit
JPS6158254A (ja) 半導体集積回路装置
Singh ADTS: an array defect-tolerance scheme for wafer scale gate arrays

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080525

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090525

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090525

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100525

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110525

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120525

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130525

Year of fee payment: 12

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130525

Year of fee payment: 12