JP3167668B2 - 基板の分割方法 - Google Patents
基板の分割方法Info
- Publication number
- JP3167668B2 JP3167668B2 JP2186298A JP2186298A JP3167668B2 JP 3167668 B2 JP3167668 B2 JP 3167668B2 JP 2186298 A JP2186298 A JP 2186298A JP 2186298 A JP2186298 A JP 2186298A JP 3167668 B2 JP3167668 B2 JP 3167668B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- substrate
- nitride
- layer
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 41
- 238000000034 method Methods 0.000 title claims description 33
- 239000011248 coating agent Substances 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 229910052594 sapphire Inorganic materials 0.000 claims description 12
- 239000010980 sapphire Substances 0.000 claims description 12
- 235000012239 silicon dioxide Nutrition 0.000 claims description 12
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 229910002601 GaN Inorganic materials 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 229910005540 GaP Inorganic materials 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- 239000010453 quartz Substances 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 238000003776 cleavage reaction Methods 0.000 claims description 4
- 230000007017 scission Effects 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229960001716 benzalkonium Drugs 0.000 description 1
- CYDRXTMLKJDRQH-UHFFFAOYSA-N benzododecinium Chemical compound CCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 CYDRXTMLKJDRQH-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Led Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US80873497A | 1997-02-28 | 1997-02-28 | |
| US808,734 | 1997-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10256193A JPH10256193A (ja) | 1998-09-25 |
| JP3167668B2 true JP3167668B2 (ja) | 2001-05-21 |
Family
ID=25199579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2186298A Expired - Fee Related JP3167668B2 (ja) | 1997-02-28 | 1998-02-03 | 基板の分割方法 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP3167668B2 (zh) |
| KR (1) | KR19980070042A (zh) |
| CN (1) | CN1192043A (zh) |
| DE (1) | DE19753492A1 (zh) |
| GB (1) | GB2322737A (zh) |
| TW (1) | TW353202B (zh) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2298491C (en) | 1997-07-25 | 2009-10-06 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
| JP3770014B2 (ja) | 1999-02-09 | 2006-04-26 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| US6711191B1 (en) | 1999-03-04 | 2004-03-23 | Nichia Corporation | Nitride semiconductor laser device |
| US6350664B1 (en) | 1999-09-02 | 2002-02-26 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method of manufacturing the same |
| JP2001110755A (ja) * | 1999-10-04 | 2001-04-20 | Tokyo Seimitsu Co Ltd | 半導体チップ製造方法 |
| JP3368876B2 (ja) | 1999-11-05 | 2003-01-20 | 株式会社東京精密 | 半導体チップ製造方法 |
| WO2001084640A1 (de) | 2000-04-26 | 2001-11-08 | Osram Opto Semiconductors Gmbh | LUMINESZENZDIODENCHIP AUF DER BASIS VON GaN UND VERFAHREN ZUM HERSTELLEN EINES LUMINESZENZDIODENBAUELEMENTS |
| DE10026255A1 (de) * | 2000-04-26 | 2001-11-08 | Osram Opto Semiconductors Gmbh | Lumineszenzdiosdenchip auf der Basis von GaN und Verfahren zum Herstellen eines Lumineszenzdiodenbauelements mit einem Lumineszenzdiodenchip auf der Basis von GaN |
| JP2003532298A (ja) | 2000-04-26 | 2003-10-28 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 発光半導体素子 |
| DE10051465A1 (de) | 2000-10-17 | 2002-05-02 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements auf GaN-Basis |
| TWI292227B (en) | 2000-05-26 | 2008-01-01 | Osram Opto Semiconductors Gmbh | Light-emitting-dioed-chip with a light-emitting-epitaxy-layer-series based on gan |
| JP4710148B2 (ja) * | 2001-02-23 | 2011-06-29 | パナソニック株式会社 | 窒化物半導体チップの製造方法 |
| TWI326274B (en) * | 2005-07-20 | 2010-06-21 | Sfa Engineering Corp | Scribing apparatus and method, and multi-breaking system |
| KR100681828B1 (ko) * | 2005-07-20 | 2007-02-12 | 주식회사 에스에프에이 | 멀티 절단 시스템 |
| TWI362769B (en) | 2008-05-09 | 2012-04-21 | Univ Nat Chiao Tung | Light emitting device and fabrication method therefor |
| CN101958383B (zh) * | 2010-10-07 | 2012-07-11 | 安徽三安光电有限公司 | 一种倒装磷化铝镓铟发光二极管的制作方法 |
| CN102837369B (zh) * | 2012-09-18 | 2015-06-03 | 广东工业大学 | 一种绿激光划片蓝宝石的工艺方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2121455A1 (de) * | 1971-04-30 | 1972-11-02 | Siemens AG, 1000 Berlin u. 8000 München | Verfahren zum Aufteilen von plattenförmigen Werkstücken |
| EP0613765B1 (de) * | 1993-03-02 | 1999-12-15 | CeramTec AG Innovative Ceramic Engineering | Verfahren zum Herstellen von unterteilbaren Platten aus sprödem Material mit hoher Genauigkeit |
| US5418190A (en) * | 1993-12-30 | 1995-05-23 | At&T Corp. | Method of fabrication for electro-optical devices |
-
1997
- 1997-10-22 TW TW086115595A patent/TW353202B/zh active
- 1997-10-27 KR KR1019970055213A patent/KR19980070042A/ko not_active Application Discontinuation
- 1997-12-02 DE DE19753492A patent/DE19753492A1/de not_active Withdrawn
- 1997-12-03 CN CN97125355A patent/CN1192043A/zh active Pending
-
1998
- 1998-02-03 JP JP2186298A patent/JP3167668B2/ja not_active Expired - Fee Related
- 1998-03-02 GB GB9804385A patent/GB2322737A/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| GB9804385D0 (en) | 1998-04-22 |
| DE19753492A1 (de) | 1998-09-03 |
| JPH10256193A (ja) | 1998-09-25 |
| TW353202B (en) | 1999-02-21 |
| CN1192043A (zh) | 1998-09-02 |
| GB2322737A (en) | 1998-09-02 |
| KR19980070042A (ko) | 1998-10-26 |
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