TWI326274B - Scribing apparatus and method, and multi-breaking system - Google Patents

Description

1326274 21226pif.doc IX. Description of the invention: [Technical field to which the invention pertains]

The present invention relates to a scribing apparatus and method, and a multi-split system, and more particularly to a scribing apparatus and method, and a cleavage system that can be simultaneously performed on a substrate in a single device. The scribe line is formed and the substrate is split along the scribe line, thereby shortening the processing time, reducing the working space, splitting the substrate into a plurality of single sheets by one treatment, and forming a scribe line having a uniform depth on the substrate. [Prior Art] A scribing device is used to cut or split a substrate. The substrate refers to a relatively large and has a thickness of the plate' and it comprises a semiconductor, flat panel display, flat glass or acrylic sheet. Specifically, the use of a scribing apparatus is required because the substrate of, for example, a liquid crystal display (LCD), a plasma display panel (pDp), and an organic light-emitting diode (OLED) mainly formed of glass requires an accurate Mb.

In order to cut the substrate, a scribe line is formed in advance on the surface of the substrate, and the substrate is split by a scribe line. That is, as shown in Fig. ,, when a cutter formed of a material exhibiting a higher hardness (e.g., 'diamond) is swayed and pressed against the surface of the substrate G, the substrate w is extended in thickness.

3 crack if. In this state, as the cutter 1 is moved 2 along the surface of the substrate G, a continuous cutting line S is formed on the surface of the substrate G. Thereafter, the substrate G is split by applying a force along the scribe line 8. The substrate stack is loaded onto a predetermined table (Fig. 3') (S10). 7 21226pif.doc Completed or automatically completed the _plus (4) organization. Position (10)). Next, the scribing head having the accumulator 1 on the drawing is moved to the desired position, and the setting is set. / ^ cut (marking head setting step S3 〇). Through "===degree==(:):,: on the base. Upper form = time: the base G moves to the position where the split S performs the split, the bottom G (S50). In this step, you can enter a + The alignment step of the soil position. Then 'execute the crack along the cut (S60). #分线S to base G divided into eight In the above conventional technique, the step of forming the scribe line S, and the step of dicing the base G of the scribe line S are performed by a separate device, in addition, due to the movement through the appropriate device (4), The steps of loading and aligning are repeated, so the equipment becomes complicated, and the soil _ , : _ is added when processing. Especially when it is necessary to divide a single base: split; =: Since it is necessary to repeat the above steps of Fig. 3, there is no = In addition, since it is fixed on the surface of the substrate G to the work 3: scribing, it is difficult to cope with the workbench Or the base G itself: no; frank. Therefore, it is difficult (10) to form a cut line with a depth of branching. SUMMARY OF THE INVENTION In order to solve the above and/or other problems, the present invention provides a gas line device and a material to be placed on a wire to form a cut 21226pif.doc line and along the cut ship. Recording the bottom, so that the scribe line (10) can be shortened so that the working space can be reduced, the transmission is made into a plurality of single sheets, and a scribe line of J is formed on the substrate; and a multi-split system. According to an aspect of the invention, a multi-split system includes a shredded line that is loaded with a pure bottom; a mother-in-law; a split line to split the bottom; a configuration pool, such as a split configuration of the splitting module; Moving the pure group horizontally, the two modules are moved in the direction opposite to the direction of the sub-sakis; the upper surface and the lower surface of the substrate disposed on the table t include: a frame, Forming the outer side; a plurality of branches occluding the frame, supporting the substrate, having a predetermined rod shape separated from each other to form a predetermined sub-group path for the sub-group to pass through; and a m-shaped portion, Formed on each of the support portions to pass through the substrate a surface to fix the substrate. The support portion is coupled to the frame to be movable in at least one direction to adjust an interval between the support portions. σ The fixed portion is a plurality of vacuum suction holes along which Providing a longitudinal direction of the portion of the branch to provide a predetermined vacuum suction to the substrate. The splitting module includes: an upper splitting module that forms a scribe line on the upper surface of the substrate and a split substrate; and a lower splitting module that forms a scribe line on the lower surface of the substrate and splits the substrate, and wherein the upper and lower splitting modules are configured to facilitate the horizontal shifting group by 1326274 2I226pif. Doc The same moving path. Each of the unit and the lower splitting module includes: a scribing head: a scribing line is formed on the surface of the substrate; and a reverse head ((10) is more ea', for the purpose of inserting The substrate is split by the scribed line by pressing the substrate with the opposite side of the scribe line between the line head and the line head.

The multi-split system further includes a connecting material connecting the scribing head and the reverse head, and the shooting level (four) is homozygous, and the connecting portion is moved in a horizontal direction, thereby causing the scribing head and the reverse head Move in the horizontal direction. The reverse head includes a substrate contact portion that contacts a surface of the substrate, and a lands portion that presses the substrate contact portion toward the base. The substrate contact portion has a rotatable drum structure and is pressed while the other surface of the disc is rotated in contact with the substrate.

The substrate contact portion has a double roller structure, wherein the double roller structure has a central region separated by a pre-four interval, and a central portion of the secant head is disposed in the middle mail region corresponding to the center region. The reverse head advancement step includes a force adjustment portion located between the base portion and the portion, and adjusts the application to the substrate contact by absorbing pressure when the pressing portion applies a predetermined pressure to the substrate contact portion Part of the pressure. The pressure regulating portion includes a cylinder that applies pressure to the base surface portion by pressing the pressing portion, and a load meter that measures a pressure applied by pressing the portion 1326274 21226pif.doc. The reverse head advance step includes a stopper, a range of movement of the stopper contact portion in the up and down direction. . The soil - each of the upper and lower splitting module towels comprises: a scribing wheel 'which forms a scribe line on the substrate; and a press-cut portion that is pressed and supported during the scribe line forming step The other surface of the substrate, the scribing wheel and the pressing support portion, are aged by an additional driving device and face in the same direction.

And the pressing portion is formed on the pressing portion and is formed by the scribe line. The scribing wheel is located at the center, and both sides of the scribing wheel are symmetrical so as to be adjacent to both sides of the position. The scribing wheel is configured to be relatively closer to the substrate than the pressing portion. The pressing support portion has a feedable structure and is rotated while being in contact with the other surface of the substrate.

The pressing support portion has a double-dip structure having a central portion separated at a predetermined interval, and a central portion of the scribing wheel is disposed in the central region, corresponding to the central region. The configuration module includes: an upper configuration module, wherein the upper split module is separately disposed at a predetermined interval; and a lower configuration module, wherein the lower split module is separately disposed at a predetermined interval. The multi-split system further includes a split module moving unit, and the split module moving unit moves the upper and lower split modules in a horizontal direction on the configuration module. 1326274 21226pif.doc The multi-split system further includes an alignment unit that aligns the position of the substrate loaded on the upper portion of the table. The multi-split system further includes a camera module that obtains information of the position of the substrate loaded on the workbench and provides the information to the alignment unit. According to another aspect of the present invention, a scribing apparatus includes: a scribing head that forms a predetermined scribe line on a surface of a substrate; a reverse head that is located on a side opposite to the scribing head with respect to the substrate, and is pressed The substrate; and a horizontal moving portion that moves the scribing head and the reverse head in a horizontal direction. The scribe device further includes a connecting portion connecting the scribe head and the reverse head, wherein the horizontal moving portion is consuming to the connecting portion and moving the connecting portion in a horizontal direction, thereby causing The thread head and the reverse head move in the horizontal direction. The reverse head includes: a substrate contact portion that contacts the other surface of the substrate; and a pressing portion that pushes and presses the substrate portion toward the substrate. A base contact portion has a rotatable drum structure and is pressed while being rotated in contact with the other surface of the substrate. One of the substrate contact portions has a double roller structure having a central region separated at a predetermined interval, and a center of the scribing head is partially disposed in the central region, and the central region correspond. The reverse head further includes a pressure regulating portion located between the substrate contact portion and the pressing portion, and adjusting the application 12 21226 pif by absorbing pressure when the pressing portion applies a predetermined pressure to the substrate contact portion. Doc The pressure β applied to the contact portion of the substrate includes a pressure applied by pressing the ink according to the ink; and a ray meter that measures the pressure applied by the pressing portion. The splicing to the light-step includes a stop 11, which limits the extent of movement of the substrate in the up and down direction.

According to still another aspect of the present invention, the method of ageing includes: loading a substrate Δ at the substrate to perform a scribe line forming a scribe line) loading a scribe line on the work σ to move the line head to the surface of the substrate Positioning; using a fixed viewing, under the force _ force to the other surface of the base of the secant; and moving the scribe and the reverse at substantially the same speed in the same direction Perform a scribing job. At the same time, the movement of the scribing head and the pressing of the position on the other surface of the substrate are performed.

During the movement of the scribing head and the reverse head, the pressing member presses the position on the other surface of the base slammed by the scribing head to correspond to the position of the left and right sides, and the same day is on the substrate. The scribing work of the (four) line is formed, and the splitting work of the split base along the scribe line is performed. The above and other objects, advantages and advantages of the present invention will become more apparent <RTIgt; [Embodiment] The present invention, its advantages, and the objects achieved by the practice of the present invention are fully understood. 13 1326274 21226pif.doc, the invention will be described in detail below by explaining preferred embodiments of the invention with reference to the attached drawings. The same reference numerals in the drawings denote the same elements. In the following description, the substrate is considered to comprise a semiconductor, a flat panel display including a liquid crystal display (LCD), a plasma display panel (pDp), and an organic light emitting diode (OLED), or a flat glass and an acrylic plate. FIG. 4 is a diagram illustrating a multi-split system according to an embodiment of the present invention. Figure 5 is a front elevational view of the I of the multi-split system $ of Figure 4. Figure 6 is a simplified diagram of Figure 4 (4). Figure 7 is a diagram showing the structure of a splitting module in the multi-split system of Figure 4. Fig. 8 is an enlarged view of a main part of Fig. 7. 9A to 9C are diagrams showing a step of splitting a substrate. Referring to Figures 4, 5, 6, 7, 8 and 9A to 9C, but mainly referring to Figure 4, a multi-split system according to an embodiment of the present invention comprises: . a substrate G to be split; a plurality of split modules B, /, on the upper surface and the lower surface of the substrate g loaded on the I-stage 300, each forming a predetermined scribe line S and splitting the substrate G; 4〇〇, 1 = predetermined separation_configuration group B; and the horizontal movement module 5〇〇,, •,, and the configuration module 4〇〇 is moved along the scribe line S. The second stage 300 is a portion loaded with a substrate G. The substrate G is loaded on the upper surface of the working port 300 so that the position of the substrate G is fixed. When the scribe line S is formed on the base f G, and the base G is split along the (four) line S, the soil G cannot be arbitrarily moved on the upper surface of the table 300. When the position of the bottom G is moved, it is not only difficult to form a scribe line S ′ on the substrate in a miscellaneous form, and it is difficult to accurately split the substrate G. Therefore, once loaded on the table 3GG, the substrate G must be fixed thereto. 14 13262/4 21226pif.doc , for this purpose, as shown in FIG. 5, the table 3 includes a multi-solid 310, a split mode formed between the individual support portions 31〇 = a moving path 32〇, provided Each of the plurality of fixed portion knives 330' of the support portion 31G and the frame 340 to which the branch portion 310 is coupled. Brace. (5 knives 310 are formed in a long rod shape and the base G is loaded thereon and in contact with the upper surface. In the present embodiment, the 'branch # portion 310 is separated by a predetermined interval. Each of the support portions 3 is divided into 3 _ The way to the frame 34G is to enable it to move horizontally in one direction. Therefore, 'can be easily adjusted = π ί ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο Not shown). Because the support portion 310 allows and splits the split module movement path 320 between the plurality of (four) support portions 310 having different specifications and sizes, the space between the two branches and the points 310. As will be described later, In her example, the splitting module (4) approaches or retreats with respect to both the upper S surface and the lower surface of the table 3 due to the fact that not only on the upper surface of the substrate G but also on the lower surface. Therefore, at W, the split mode (10) is formed. The gate is slashed at the same time as the gate, the upper surface and the lower surface and the horizontal substrate. The split mode _ the path is sufficient for the split module B to be worn. The size of the passage (320) has a fixed portion 330 formed in the branch portion 31 Up to fix the substrate G loaded on the support portion 310 by sucking the lower surface of the base 15 21226pif.doc. That is, the fixing portion 330 fixes the substrate G so as to split the substrate G into a desired size. The positional movement of the substrate G is not allowed during the period. In the present embodiment, the fixed portion 330 is a plurality of vacuum suction holes that use vacuum suction to fix the substrate G. The vacuum suction holes 33 穿透 penetrate the support in the thickness direction of the support portion 3 (7) The floor portion 31 is uniformly formed along the longitudinal direction of the slab portion 31. Although not shown in the drawings, a connecting pipe (not shown) connected to an external vacuum pump (not shown) is coupled to the vacuum vent hole. Therefore, as the external air is absorbed through the hole 330 through the suction force of the vacuum pump, the base g can be sucked and fixed. The second-step is provided at work from 3〇〇± Alignment unit (not shown) of the position of the base G on the Δ 3 : : control the position of the table 300, the position of the table 3 and the alignment state. In the present embodiment, Manually or using an attached machine The base G is automatically loaded on the table 3 。. ♦ 〇 时) When loading in the correct position, the helmet Fabo ~ Although the soil bottom is not lowered, the alignment unit is used on the substrate to change the base position f ° transmission direction Move up - and cause the workbench ^ splitting module to lie on the upper surface S of the base G, and split the base scribe line by pressing the base along the scribe line s 'as shown in Fig. 6 'the split module 6 contains the upper split Module 2 1326274 21226pif.doc Partially split module B2. The upper splitting module Bi forms a cutting line s on the upper surface of the substrate G so as to split the substrate G. The lower splitting module B2 forms a scribe line S on the lower surface of the substrate G to split the substrate G. The horizontal movement module 5 moves the upper and lower partial dragon groups B1 and B2 in the horizontal direction (i.e., in the direction along the cutting line s). When moved by the horizontal movement module 5, the upper and lower split modules B1 and B2 are configured to pass along the same path. Initially, since the multi-split system face splitting according to the present embodiment is simultaneously formed on the upper and lower surfaces of the substrate G, only a very good splitting surface can be obtained, and the working time can be greatly shortened, so that significant Shorten the tact time. As shown in Fig. 7, each of the upper and lower split modules m and B2 is just thinner than the reverse head. The scribing head and the counter are connected by a connecting portion (not shown), and the splitting is performed when the connecting portion is passively moved (not shown) horizontally, which will be hereinafter referred to as = 划 100 forming a cut on the surface of the substrate G A scribe line s is formed on the scribe line s. The scribing head 1〇〇 includes a vibration generating portion: a reservoir-it portion 120, a shaft 130, a height adjusting unit 140, a preload supply early 150, a main board, and an upper/lower moving portion 17〇. 122 UG generates a predetermined vibration force to vibrate the cutting test 2 . The vibration generating portion UG includes an actuator necessary actuator bracket (1), 17 1326274 21226pif.doc, a dynamic plate 116 and an upper actuator plate ns. The applied power causes the actuator 112 to vibrate itself and provide a vibratory force. In this embodiment, the actuator is a parallel pre-stressed actuator. Actuator bracket 114 actuates actuator 112 and shaft 13 to the main board 160. The lower end of the actuator Π 2 is fixed to the actuator truss 114. The actuator holder 1H allows the shaft 13〇 to perform linear motion by the vibration of the actuator Π2. That is, the shaft 130 is embedded in the actuator bracket ι 4

The annular through hole (not shown) is coupled to the actuator bracket to perform linear motion along the through hole. The lower actuator plate 116 engages the lower end of the actuator 112 and actuates the crying bracket 114' to allow the actuator 112 to be detachable. The upper actuator plate is coupled to the upper end of the dynamics 112 and the shaft 13 〇 to allow the actuator to be detachable. The lower end of the dynamics 112 is fixed to the actuator bracket 114.

A bushing (not shown) may be provided at the portion of the actuator tray 1M contact #13. The bushing not only guides the linear movement of the shaft 13〇, but also prevents the treatment 130 from being degraded due to a corresponding increase in the straightness of the friction cutter 122 generated during the linear reciprocating motion of the shaft 130. Therefore, the bushing is preferably formed by recording a material having a higher friction resistance. In the present embodiment, a linear metal bushing is used as an outline. Although not shown in the drawings, the vibration generating portion 11 can further include an actuator cooling portion 'in order to increase the temperature of the actuator m during the vibration of the actuation n 112 . The system structure can be facilitated only by the S&amp; cooling section of the S&amp; The enthalpy cooling section may include instructions for adjusting the pressure or coolant supplied to the 18 1326274 21226 pif.doc actuator cooling section. The cutter portion 120 contains 122 touches and is on the (upper) surface of the base G. The tape is slit-C (see Fig.. Therefore/cut: two:

Formed by: material of the substrate G. In the present embodiment, the cutter 122 is formed of diamonds. The cutter handle 124 is fixedly coupled to the cutter 122 and at the same time allows the cutter m to be consuming to the shaft 130. A car having a cylindrical shape can be embedded in the cutter handle 124-closed recess 124a by one end of the 13 turns. Since the notch (not shown) facing the cutter 122 is formed at the (4) handle: the outer upper end, the cutter 122 can be fixedly coupled to the handle 124.

The amount of adjustment unit (not shown in the present embodiment, the _122 is already slightly offset from the center line of the cutter handle 4. When the cutter handle 124 is rotated, the cutter m is along the cutter handle 124 The path of the center line coincides slightly behind the center line of the cutter handle 124. Therefore, the linearity of the cut line S formed by the cutter 122 is improved. Also, in the present embodiment, the fixing bracket can be improved ( Not shown), it will engage the cutter 122 m of the cutter handle 124 so that it does not disengage from the cutter handle 124. The brake lever handle 124 can be pivoted in a state of being engaged to the shaft 13 〇 Turning, as described above, this is to allow the cutter 122 to always move along the same path as the centerline of the cutter handle 19 1326274 21226pif.doc 124 by the offset structure of the cutter 122 when moving horizontally. The money field cutter handle 124 secret 3, because it is difficult to cut the cutter 122, the handle 124 needs to be in the stomach # &amp; Α ώ 实施 实施 实施 , , , , , , , 。 。 。 。 。 。 。 。 (Fu III -, Department Divided into a cut, θ not.) In the portion of the side wall of the cutter handle 124 opposite the cut-out recess, a wedge (not shown) is embedded in the pick-up door at a thickness m. Through the hole (not shown). (4) i towel Gu ^ its towel, so that the wedge

The object &amp; contact cut _σ. The wedge-end 2 is such that the cutter handle 124 is positionable between the vibration generating portion U0 and the cutter portion 120 at a predetermined angle 2 and transmits the vibration of the vibration generating portion 110. "The height adjustment unit 140 is provided above the vibration generating portion 110 and adjusts the height of the cutter portion 12A along the unevenness of the substrate G. In general, the surface of the substrate G to be split is processed to be flat. However, the substrate

There may be many fine unevennesses on the surface of G and the surface may be flat but generally uneven. Therefore, it is necessary to improve the linearity of the scribe line s formed on the substrate G by adjusting the height of the cutter portion 120 along the uneven surface of the substrate G. Therefore, in the present embodiment, the height adjusting unit 14 is provided which detects the unevenness of the substrate G and immediately reflects the detected unevenness to adjust the height of the cutter portion 120. The height adjusting unit 14A may be a load meter 'when the load weight applied thereto is not larger than a predetermined value, its length is expanded' and its length 20 1326274 21226pifdoc is contracted when the load weight applied thereto is not less than a predetermined value. The preload supply unit 150 is provided above the height adjustment unit 140 and supplies a preload to the cutter portion 120. The preload refers to a force (pressure) in one direction for pressing the cutter portion 120 in the axial direction. Therefore, when the cutter 122 forms the scribe line s by contacting the substrate G, the pre-pressure supply unit 150 presses the cutter 122 in the axial direction to apply an impact to the base, G in the thickness direction. In the present embodiment, the preload supply unit 15 is a cylinder that generates pressure through air pressure, specifically, a micro speed cylinder. The main plate 160 is coupled to the cutter portion 12, the vibration generating portion, and the preload supply unit 5〇, and fixes the center line of the cutter portion 120, the vibration generating portion 110, the height adjusting unit 14〇, and the preloading supply unit 15〇. The order is on the straight line. Further, the domain_continuation unit 120 vibrates the portion m, the adjustment unit and the preload supply unit 150 so that they can move in the up and down direction and the horizontal direction. The up/down moving portion 170 is coupled to the main board 16A and drives the main board 160 upward/lower. The upper/lower moving portion 17A &amp; includes a side base 172, a motor 174 provided on the main board 160, a ball screw 6 and a movable block 178. ^Motor I74 &amp; The power required to move the main board 16 up/down. In the present embodiment, the feeding motor is used as the motor 174 to precisely control the up/down movement of the main board (10). Ball screw 176 is coupled to motor ι 74 and rotates on motor 174 and has a position on its outer surface. Roller_bar 176 engages to a movable block 178 that is fixed to the main, 16 turns. Therefore, an inner spiral hole (not shown) having a size for passing the ball screw 176 from the middle tooth is formed in the movable block 178. 1326274 21226pif.doc The inner helix of the helix g2) with the ball screw 176 is formed on the inner surface of the (four) screw hole. Therefore, when the motor 174 rotates the ball screw 176, the movable block 178 can move up and down. Although not shown in the drawings, the upper/lower moving portion 17 further includes linear blocks and linear guides for guiding the linear motion of the main board 160. The linear block is coupled to the motherboard 160 and directs linear motion of the motherboard 16A. A linear guide is coupled to the linear block and directs the direction of motion of the linear block. Referring to FIGS. 7 and 8, the reverse head 200 is disposed on the opposite side of the scribing head 100 with respect to the substrate G, and supports the other surface of the substrate G while the scribing head 1 is formed with the scribe line s. (lower surface). That is, when the scribing head 100 moves in the horizontal direction and continuously on the surface of the substrate crucible; when the scribing line S is formed, the reverse head 200 moves in the horizontal direction and supports the substrate G simultaneously with the scribing head 100. The lower surface is formed to form a constant scribe line S by applying the same force to the substrate G. The reverse head 200 includes a substrate contact portion 21A and a pressing portion 220. The substrate contact portion 210 contacts the other surface of the substrate G and presses the substrate G. In the present embodiment, the substrate contact portion 21A has a rotatable drum structure in which the drum 212 comes into contact with the other surface of the substrate G to rotate and press the substrate G. Specifically, in the present embodiment, as shown in Fig. 8, the base contact portion 210 has a double roller structure having a central portion 214 when the two rollers 212 are separated at predetermined intervals. The central region 214 is located at a position corresponding to the cutter 122 of the scribing head 1〇〇. Therefore, the portion pressed by the cutter 122 is not actually supported by the drum 212, and the central region 214 adjacent to the portion pressed by the drum 212 is pressed by the cutter 22 1326274 21226pif.doc 122. The pressing portion 220 presses the substrate contact portion 210 by pressing the substrate contact portion 210 toward the substrate g. The pressing portion 220 is coupled to the other end ' of the substrate contact portion 210 and pushes the substrate contact portion 210 toward the substrate G. The base contact portion 210 and the pressing portion 220 are coupled to a single guide 230 such that their centerlines are maintained to match each other. The substrate contact portion 21 is permeable to coupling and uses the guide 230, linear guide and linear block to ensure accurate linear motion. The reverse head 200 further includes a pressure regulating portion 24 that is provided between the substrate contact portion 210 and the pressing portion 22A, and absorbs when the pressing portion 220 applies a predetermined amount of force to the substrate contact portion 210. force.

Since the thickness of the substrate G to be split by the splitting system 1 according to the present invention is very thin and the hardness is very low', the base G may be destroyed when an excessive force is applied. Therefore, the pressure adjusting portion 24 controls the pressure applied to the substrate G so as not to exceed a predetermined level. Further, the pressure regulating portion 240 makes the pressure applied to the substrate G constant at all times, so that a scribed line S can be formed. In the present embodiment, a load cell is used as the pressure adjusting portion 240. The reverse head 200 further includes a stopper 250 that defines an upper limit of movement and a lower limit of movement of the substrate contact portion 210. The stopper 25 prevents the substrate contact portion 210 from excessively moving toward the substrate to bend or destroy the substrate G. The stopper 250 is disposed around the substrate contact portion 21A. Although not shown in the drawings, the connecting portion connects the scribing head 1 〇〇 and the reverse 23 1326274 21226 pif. doc to the head 200. In the present embodiment, the scribing head 100 and the reverse head 200 are connected to each other and simultaneously moved. Therefore, the reverse head 200 directly presses a portion of the substrate ,, wherein the scribe head 1 形成 forms a scribe line S at the portion. The horizontal moving portion moves the scribing head 1〇〇 and the reverse head 2〇〇 in the horizontal direction. In the present embodiment, since the connecting portion connects the scribing head 1〇〇 and the reverse head 200', it is preferable that the horizontal moving portion is stalked to the connecting portion' to horizontally move the connecting portion. When the horizontal moving portion moves the connecting portion horizontally, the scribe head 1 〇〇 and the reverse head 200 can move at the same speed in the same direction. Each of the upper and lower split modules B1 and B2 includes the above-described scribing head 100 and reverse head 200. However, the configurations of the scribe head 1 〇〇 and the reverse head 2 彼此 are different from each other. That is, as shown in FIG. 6, in the upper split module B1, the 'scribe head i〇〇a is disposed at the upper side of the base g and the reverse head 200a is disposed at the lower side, and in the lower split module B2. The scribing head 1 〇〇b is disposed at the lower side of the substrate G and the reverse head 200b is disposed at the upper side. Referring again to Figure 4, the configuration module 400 includes a plurality of splitting modules B arranged at constant intervals. Split module B is configured to move over configuration module 400. For reference, the number and size of split modules b vary depending on the desired design. The installation interval of the split module B can be adjusted so that the configuration module 400 can be adjusted accordingly.

Although not shown in the drawings, the configuration module 400 includes an upper configuration module and a lower configuration module. In the upper configuration module, the upper splitting module B1 is disposed at a predetermined interval. In the lower configuration module, the lower split module B2 is disposed at a predetermined interval. Moreover, since the splitting module B 24 1326274 21226pif.doc can be horizontally moved on the configuration module 400, it is preferable to further provide each split on each of the upper and lower splitting modules B1*B2. A module moving unit (not shown) that moves in the horizontal direction on the configuration module 4A. The horizontal movement module 500 causes the configuration module 400 to move in a direction perpendicular to the arrangement direction of the split module B (i.e., in the direction along the scribe line S). In the present embodiment, after the upper split module B1 and the lower portion f module B2 # are coupled to the configuration module 水平, the horizontal movement module 500 moves the configuration swap group 400 in the horizontal direction. Therefore, the finches module b that is consuming to the configuration die 400 has substantially the same speed and is movable in the direction of the direction. Further, according to the multi-split system 1 of the present embodiment, the camera module shown in Fig. 4 is further deleted. The camera module _ accurately measures 1 to provide the position of the base G on the ^^(9) and to form a mark on the predetermined position of the bottom G, when the information group base G on the position is shaped, and based on the mark Determine the position of the bottom G. This information is supplied to the aligning unit so that the position of the substrate G can be finely adjusted by the aligning unit. Set the required size and splitting specifications on the (4) set of the township (4), the rectification _ to set the work! To adjust; ^ group B position. The gauge and split specifications based on the base G are also used as the interval of the support portion 31G on the stage. Also adjust the interval of the split module B. Next, as shown in Fig. 9A, the substrate 〇 is positioned on the table 3A. 25 1326274 2l226pif.doc The camera module 600 uses the previous number on a particular portion of the substrate G to check the position of the substrate G. When the position of the substrate G = the alignment unit moves the substrate G to a precise position. In the present embodiment, the base G positioning frame is rotated by a predetermined distance due to the upper and lower split molds and bi and the flat arrangement in the front-rear direction. The separation distance can be entered via the module B.

Next, as shown in Fig. 9B, the splitting module B is moved to the starting position for the splitting of the lights and then the slave. That is to say, the splitting module B is moved to a position before the bottom position of the branch base G, and is performed: to maintain the height at which the splitting/contacting substrate can be contacted. : End, when the split dragon group B is set' As shown in Fig. 9C, the horizontal shift mode is operated, and 500 is used to horizontally move the split module B, and splitting is performed. The above operation will be described in detail with reference to FIG. First, load the substrate g

Bottom = H300 (SU〇). Correct the position of the substrate , so that the base is accurately positioned (S12G). The position of the substrate G is relative to the position of the scribing head 100 and the reverse head 200 which are not shown. Therefore, the position of the substrate G can be adjusted by moving the substrate G or moving the substrate G itself while the base G is solidifying the table. ... then '1GG moves the egg start position to perform the scribing step (S130) to prepare for the scribing/split work. In this step, after moving the scribing head 100 to the scribing start position, the height of the head of the book j line is lowered to contact the surface of the base G. 1 26 1326274 21226pif.do&lt; • Move to the bit corresponding to the start position of the scribing (S140). In this step, after moving to a position corresponding to the position at which the scribing head (10) is set, the reverse head presses a portion of the opposite surface of the cut surface of the base G corresponding to the start position of the scribing. Preferably, instead of pressing a single point corresponding to the start point of the scribe line, two points at both sides of the point where I should be at the start point of the scribe line are pressed. Therefore, the load applied to the substrate G is advantageously reduced, and the splitting is simultaneously performed by pressing both sides of the substrate G on which the scribe lines s are formed. During this time, steps si3 and 140 can be performed simultaneously. Next, while moving the scribing head 1〇〇 and the reverse head 2 (8), scribing and splitting are performed (S150). In this step, when the scribing head 1 〇〇 and the reverse head 200 are moved at the same speed in the same direction, the formation of the scribe line S and the splitting of the substrate G along the scribe line S are simultaneously performed. According to the present embodiment, since the formation of the scribe line S and the splitting of the scribe line S can be simultaneously performed in a single device, the processing time can be shortened, and since the structure of the device is simplified, the work space can be reduced. Also, the substrate (3 may be split into a plurality of single sheets by one treatment. Further, a scribe line S having a uniform depth may be formed on the substrate G. Fig. 10 is a view illustrating a multi-splitting system according to another embodiment of the present invention. Figure 11 is an enlarged view of a main portion of Figure 10. As shown in Figures 1 and 11, a multi-split system 2000 according to another embodiment of the present invention has the same structure and shape as the multi-split system 1000 described above. However, the upper splitting module 2100 and the lower splitting module 2200 are different from the upper and lower splitting modules of the multi-split system 1000 described above. Therefore, the description of the other components 27 1326274 21226pif.doc is not repeated 'and only The upper splitting module 2100 and the lower splitting module 2200 are described. In the present embodiment, the upper splitting module 2100 and the lower splitting module 2200 include scribing wheels 211 and 2210 that are configured to face the same direction, and a pressing support portion. 2120 and 2220. The scribing wheels 2110 and 2210 are for forming a scribe line S' on the substrate G and the pressing support wheels 2120 and 2220 are for pressing and supporting the substrate during the scribe line forming step. In the present embodiment, since the scribing wheels 2110 and 2210 and the pressing support portions 2120 and 2220 are disposed in the same direction, the scribing wheels 2110 and 2210 are provided at the center, and the pressing support portions 2120 and 2220 are symmetric. The ground portions are provided on both sides of the scribing wheels 2110 and 2210. Therefore, the pressing branch portions 2120 and 2220 press and support both sides of the position where the scribing wheels 2110 and 2210 form the scribe line S. In this embodiment, it is preferable The scribing wheels 2110 and 2210 and the pressing support portions 2120 and 2220 are operated upward/downward by an additional driving device. The scribing wheels 2110 and 2210 form a scribe line S on the base G, and the pressing support portion 2120 and 2220 supports the substrate G in the scribe line forming step, requiring different forces and different working heights. Preferably, the scribing wheels 2110 and 2210 and the pressing support portions 2120 and 2220 are separately operated by different driving devices and are Controlled independently, rather than simultaneously. Specifically, since the scribing wheels 2110 and 2210 penetrate the upper surface of the substrate G to form the scribe lines s, it is preferable to 'match the scribing wheels 2110 and 2210 To further protrude toward the base G. That is, when the press 28 1326274 21226pif.doc

When the pressing support portions 2120 and 2220 support the substrate G by contacting the surface of the substrate G, 'the scribing wheels 2110 and 2210 are configured because the scribing wheels 2110 and 2210 need to penetrate into the surface of the substrate G to form grooves on the substrate G. The ratio of the pressing support portions 2120 and 2220 is closer to the substrate G. The pressing support portions 2120 and 2220 have a rotatable roller structure to press the substrate g while rotating in contact with the other surface of the substrate G. The pressing support portions 2120 and 2220 have a double roller structure having a central region separated from both sides at a predetermined interval. The central region 位置 corresponds to the central portion of each of the s!l reels 2110 and 2210: therefore, due to the double drum structure, the base G can be pressed and supported more smoothly without hindering the scribing wheel 211〇 and 221〇 operations. Although the invention has been particularly shown and described with reference to the preferred embodiments of the present invention, it will be understood by those skilled in the art that the form and details can be carried out without departing from the spirit and scope of the present invention. Various inventions, wherein the spirit and scope of the present invention is defined by the scope of the patent application as described above, the invention can be shortened by the formation of the scribe line S and the division of the scribe line S in a single device. The processing is quite good and because the structure of the device is simplified, the workspace can be reduced. And the substrate G is split into a plurality of single sheets by one treatment. The invention has been implemented in the above-mentioned way, and the financials are not the same as the invention. Anyone who is familiar with this skill and scope can make this _: 2: not from the spirit of the invention 2 The above-mentioned and other features and advantages of the present invention will be more readily understood by the following description of the preferred embodiments of the invention. Medium: Figure 1 is a diagram illustrating a conventional splitting system. Figure 2 is a plan view of the substrate of Figure 1. • Figure 3 is a flow chart for explaining the splitting system of Figure 1. 4 is a diagram illustrating a multi-split system in accordance with an embodiment of the present invention. Figure 5 is a front elevational view of the table in the multi-split system of Figure 4. Figure 6 is a simplified diagram of the multi-split system of Figure 4. Figure 7 is a diagram showing the structure of a splitting module in the multi-split system of Figure 4. Fig. 8 is an enlarged view of a main part of Fig. 7. 9A to 9C are diagrams showing a step of splitting a substrate. 1A is an illustration of a multi-split system according to another embodiment of the present invention. FIG. 11 is an enlarged view of a main portion of FIG. Figure 12A is a flow chart for explaining a scribing method according to an embodiment of the present invention. [Description of main component symbols] 1: Cutter 100: Scriber head 100a: Scriber head l〇〇b: Scriber head 110: Vibration generating portion 112: Actuator 114: Actuator bracket 30 1326274 21226pif.doc 116 : 118 : 120 : 122 : ' 124 : 124a 130 140 • 150 160 170 172 174 176 178 200 • 200a 200b 210 212 . 214 . 220 230 240 Lower Actuator Plate Actuator Plate Cutter Part Vibration Cutter Cutter handle: coupling notch shaft height adjustment unit pre-pressure supply unit main board upper/lower moving part side base motor ball screw movable block reverse head: reverse head: reverse head base contact part roller center area pressing part guide Plate pressure adjusting portion 31 1326274 21226pif.doc 250: stopper 300: table 310: support portion 320: split module moving path 330: vacuum suction hole 340: frame 400: configuration module 500: horizontal moving module

600: Camera module 1000: Multi-split system 2000: Multi-split system 2100: Upper splitting module 2110: Scribing wheel 2120: Supporting part 2200: Lower splitting module 2210: Dashing wheel

2220: Support part B: Split module B1: Upper split module B2: Lower split module C: Crack G · Base S: Cut line 32

Claims (1)

/4 2l226pif is the Chinese patent scope of No. 95125518. There is no slash correction. The date of this amendment: Qiu Nian 1 〇月n ; fr'r tc. This year's 曰10, the scope of application for patent: 11.- Multi-split system, The method includes: a work station, loading a substrate to be split; and a split H splitting through a predetermined scribe line formed on each of the upper and lower surfaces of the substrate on the stage a base module; a configuration module 'configuring the split module at a predetermined separation interval; and a horizontal movement module 'moving the configuration module in a direction crossing a configuration direction of the split module, wherein the The workbench includes: a pivot forming an outer side; a plurality of support portions coupled to the frame and supporting the base, the support portions having a predetermined rod shape and separated from each other to form a split module for wearing The predetermined splitting module passes through the path; and a fixing portion is formed on each of the supporting portions to fix the substrate by sucking the lower surface of the substrate. 2. The multi-split system of claim 1, wherein the support portion is coupled to the frame so as to be movable in at least one direction to adjust an interval between the support portions. 3. The multi-split system of claim 1, wherein the fixed portion is a plurality of vacuum suction holes located in a longitudinal direction of the support portion to secure the substrate using a predetermined vacuum suction. 33 1326274 21226pif 4. The splitting module of claim 1, comprising: the multi-split system of the item, wherein the upper splitting module forms the scribe line on the upper surface of the substrate, And splitting the substrate; and a partial splitting module, forming the undercut on the lower surface of the substrate, and splitting the substrate, Wherein the upper and lower split modules are configured to traverse the same travel path using the horizontally moving module. 5. The multi-split system of claim 4, wherein each of the upper and lower split modules comprises: a scribing head forming the undercut on a surface of the substrate; and a reverse head, on a side opposite to the scribing head, with respect to the substrate inserted between the reverse head and the scribing head, a reverse head and by pressing the substrate to follow the The undercut is split to the substrate. 6. The multi-split system of claim 5, further comprising a connecting portion connecting the scribe head and the reverse head, Wherein the horizontal moving portion is hung to the connecting portion, and the connecting portion is moved in a horizontal direction, thereby moving the scribing head and the reverse head in the horizontal direction. 7. The multi-split system of claim 5, wherein the reverse head comprises: a substrate contact portion contacting another surface of the substrate; and a pressing portion 'promoting toward the substrate The substrate contact portion is pressed. The multi-split system of claim 7, wherein the substrate contact portion has a rotatable drum structure and is pressed while being in contact with the other surface of the substrate to rotate Said substrate. 9. The multi-split system of claim 8, wherein the base contact portion has a double drum structure 'the double drum structure has a central portion separated at a predetermined interval, and a central portion of the scribing head It is disposed in the central area and corresponds to the central area. 10. The multi-split system of claim 7, wherein the reverse head further comprises a pressure regulating portion between the substrate contact portion and the pressing portion, and when the pressing portion is The substrate contact portion adjusts the pressure applied to the substrate contact portion by absorption pressure when a predetermined pressure is applied. 11. The multi-split system of claim 10, wherein the pressure regulating portion comprises: an alpha cylinder that applies pressure to the substrate contact portion by pressing the pressing portion; and a load meter, measuring The pressure applied by the pressing portion. 12. The multi-split system of claim 1, wherein the reverse head further comprises a stopper that limits a range of movement of the substrate contact portion in the up and down direction. The multi-split system of claim 4, wherein each of the upper and lower split modules comprises: a scribing wheel forming the scribe line on the substrate; and a pressing support portion In the scribe line forming step, the other surface of the substrate is pressed and supported by 35 1326274 2l226pif. Wherein the scribing wheel and the button portion are operated by an additional drive device and face in the same direction. 14. The multi-split system of claim 13, wherein the scribing wheel is located at the center of the towel, and the secret material is symmetrical on both sides of the scribing wheel for pressing The lion is in the vicinity of the position with the sakura line. The multi-split system of claim 14, wherein the scribing wheel is disposed closer to the substrate than the pressing support portion. 16. The multi-split system of claim 15, wherein the press support portion has a rotatable drum structure and presses the substrate while rotating in contact with the other surface of the substrate. 17. The multi-split system of claim 16, wherein the press support portion has a double drum structure having a central region separated at predetermined intervals, and the scribing wheel The central portion is disposed in the central region and corresponds to the central region. The multi-split system of claim 5, wherein the configuration module comprises: an upper configuration module, wherein the upper split module is separated and disposed at a predetermined interval; and a lower configuration The module, the lower splitting module is disposed at a predetermined interval and disposed therein. 19. The multi-split system of claim 18, further comprising a splitting module moving unit, wherein the splitting module moving unit causes the upper portion 36 1326274 2l226pif and the lower splitting module to be in the Such as the scope of patent application! Hyperactivity as described in the item. The alignment unit 'the alignment unit scale loading&apos; further includes the location of the substrate. 21. The upper part of the working port 21. As described in the scope of the patent application, the multi-point-camera module obtains the poor information of the substrate loaded on the workbench and provides the information. Give the pair 22. A scribing apparatus comprising: forming a predetermined scribe line on a surface of a substrate at a premature scribe line; a reverse head positioned on an opposite side of the scribe line relative to the substrate And pressing the substrate; and a horizontal moving portion to move the scribe head and the reverse head in a horizontal direction, wherein the reverse head comprises: a substrate contact portion contacting another of the substrate a surface; a pressing portion that pushes and presses the substrate contact portion toward the substrate, wherein the substrate contact portion has a rotatable double roller structure and is pressed while being in contact with the other surface of the substrate to rotate The substrate, the double drum structure has a central area separated at a predetermined interval, and a central portion of the scribing head is disposed in the central area, corresponding to the central area. 23. The scribing apparatus of claim 22, further comprising 37 1326274 21226pif a connecting portion 'connecting the scribing head and the reverse head' wherein the horizontal moving portion is coupled to the connecting portion And moving the connecting portion in a horizontal direction to move the scribing head and the reverse head in the horizontal direction. 24. The scribing apparatus of claim 22, wherein the reverse head further comprises a pressure adjusting portion between the base contact portion and the pressing portion, and when the pressing portion is directed The substrate contact portion adjusts the pressure applied to the substrate contact portion by absorption pressure when a predetermined pressure is applied. The scribing apparatus of claim 24, wherein the pressure regulating portion comprises: an A-cylinder 'applying pressure to the base contact portion by pressing the pressing portion; and a load meter' measuring station The pressure applied by the pressing portion. 26. The scribing apparatus of claim 22, wherein The reverse head further includes a stopper that limits the range of movement of the substrate contact portion in the up and down direction. 38 1326274 For the Chinese pattern No. 95125518, there is no slash correction. This revision date: September 17, 1997, year A, the original version J - — »· -· ·» Λ I — r &lt; Tt—1 GCU _) _\_3_, § 1326274 1326274 S10—~- Loading substrate S20-—Aligning the substrate S30——Setting the scribing head S40—Perform a scribing line S50·一~- Move to split working position S60-^- Perform splitting 3 1326274 600 \xwx^ 400 Taiwan I 4 1326274 300 1326274 1000 1326274 1326274 8 1326274 Reference S 9A 1326274 Figure 9B 1326274 Figure 9C 1326274 2000 2100 2200 Figure 10 1326274 2100 2200 1326274 $110 One'—Loading the substrate S120 '^-Aligning the substrate S130 Setting the scribe head S140 one by one set reverse head S150 one ~ perform scribing / split Figure 12