TW200706506A - Scribing apparatus and method, and multi-breaking system - Google Patents

Scribing apparatus and method, and multi-breaking system

Info

Publication number
TW200706506A
TW200706506A TW095125018A TW95125018A TW200706506A TW 200706506 A TW200706506 A TW 200706506A TW 095125018 A TW095125018 A TW 095125018A TW 95125018 A TW95125018 A TW 95125018A TW 200706506 A TW200706506 A TW 200706506A
Authority
TW
Taiwan
Prior art keywords
breaking
substrate
scribe line
modules
breaking system
Prior art date
Application number
TW095125018A
Other languages
Chinese (zh)
Other versions
TWI326274B (en
Inventor
Sang-Kyong Kim
Gang-Hee Lee
Sang-Tae Park
Byeong-Chang Park
Original Assignee
Sfa Engineering Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050065812A external-priority patent/KR100681828B1/en
Priority claimed from KR1020050065816A external-priority patent/KR100674017B1/en
Application filed by Sfa Engineering Corp filed Critical Sfa Engineering Corp
Publication of TW200706506A publication Critical patent/TW200706506A/en
Application granted granted Critical
Publication of TWI326274B publication Critical patent/TWI326274B/en

Links

Landscapes

  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

A scribing apparatus and method, and a multi-breaking system, are disclosed. The multi-breaking system includes a work table where a substrate subject to breaking is loaded, a plurality of breaking modules breaking the substrate by forming a predetermined scribe line on each of upper and lower surfaces of the substrate loaded on the work table, an arrangement module arranging the breaking modules at a predetermined separation interval, and a horizontal movement module moving the arrangement module in a direction to cross a direction in which the breaking modules are arranged. Since the forming of the scribe line and the breaking of the scribe line both can be simultaneously performed within a single apparatus, the process time can be reduced and the work space can be reduced because the structure of the apparatus is simplified. Also, the substrate can be broken into a plurality of unit pieces by a one-time process.
TW95125018A 2005-07-20 2006-07-10 Scribing apparatus and method, and multi-breaking system TWI326274B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050065812A KR100681828B1 (en) 2005-07-20 2005-07-20 Multi braking system
KR1020050065816A KR100674017B1 (en) 2005-07-20 2005-07-20 Apparatus for scribing

Publications (2)

Publication Number Publication Date
TW200706506A true TW200706506A (en) 2007-02-16
TWI326274B TWI326274B (en) 2010-06-21

Family

ID=42140998

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95125018A TWI326274B (en) 2005-07-20 2006-07-10 Scribing apparatus and method, and multi-breaking system

Country Status (2)

Country Link
CN (1) CN101695854B (en)
TW (1) TWI326274B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024000332A1 (en) * 2022-06-29 2024-01-04 超能高新材料股份有限公司 Plate cut-off machine capable of synchronously cutting off and detecting strength of plate, and cut-off method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785225A (en) * 1991-12-06 1998-07-28 Loomis Industries, Inc. Frangible semiconductor wafer dicing apparatus which employs scribing and breaking
TW353202B (en) * 1997-02-28 1999-02-21 Hewlett Packard Co Scribe and break of hard-to-scribe materials
JP2001235733A (en) * 2000-02-22 2001-08-31 Matsushita Electric Ind Co Ltd Method for cutting liquid crystal display panel
KR20050019815A (en) * 2002-07-02 2005-03-03 미쓰보시 다이야몬도 고교 가부시키가이샤 Pasted base board cutting system and base board cutting method
JP4319520B2 (en) * 2003-10-31 2009-08-26 シチズンセイミツ株式会社 Automatic glass scriber

Also Published As

Publication number Publication date
TWI326274B (en) 2010-06-21
CN101695854B (en) 2013-03-06
CN101695854A (en) 2010-04-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees