JP2930870B2 - 電子部品表面実装装置 - Google Patents

電子部品表面実装装置

Info

Publication number
JP2930870B2
JP2930870B2 JP6176175A JP17617594A JP2930870B2 JP 2930870 B2 JP2930870 B2 JP 2930870B2 JP 6176175 A JP6176175 A JP 6176175A JP 17617594 A JP17617594 A JP 17617594A JP 2930870 B2 JP2930870 B2 JP 2930870B2
Authority
JP
Japan
Prior art keywords
axis
mounting
suction
pressure source
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6176175A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0823194A (ja
Inventor
隆之 矢沢
信行 窪川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Instruments Corp
Original Assignee
Sankyo Seiki Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Seiki Manufacturing Co Ltd filed Critical Sankyo Seiki Manufacturing Co Ltd
Priority to JP6176175A priority Critical patent/JP2930870B2/ja
Priority to EP95110034A priority patent/EP0691804A1/en
Priority to CN95109012A priority patent/CN1070334C/zh
Priority to SG1995000799A priority patent/SG42759A1/en
Priority to KR1019950019610A priority patent/KR100226169B1/ko
Priority to TW084107682A priority patent/TW279300B/zh
Publication of JPH0823194A publication Critical patent/JPH0823194A/ja
Priority to US08/929,635 priority patent/US5960534A/en
Application granted granted Critical
Publication of JP2930870B2 publication Critical patent/JP2930870B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/044—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
JP6176175A 1994-07-06 1994-07-06 電子部品表面実装装置 Expired - Lifetime JP2930870B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP6176175A JP2930870B2 (ja) 1994-07-06 1994-07-06 電子部品表面実装装置
EP95110034A EP0691804A1 (en) 1994-07-06 1995-06-27 Electronic-part surface mounting apparatus
SG1995000799A SG42759A1 (en) 1994-07-06 1995-07-04 Electronic-part surface mounting apparatus
CN95109012A CN1070334C (zh) 1994-07-06 1995-07-04 电子元件表面安装装置
KR1019950019610A KR100226169B1 (ko) 1994-07-06 1995-07-05 전자부품 표면실장장치
TW084107682A TW279300B (en, 2012) 1994-07-06 1995-07-25
US08/929,635 US5960534A (en) 1994-07-06 1997-09-15 Electronic-part surface mounting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6176175A JP2930870B2 (ja) 1994-07-06 1994-07-06 電子部品表面実装装置

Publications (2)

Publication Number Publication Date
JPH0823194A JPH0823194A (ja) 1996-01-23
JP2930870B2 true JP2930870B2 (ja) 1999-08-09

Family

ID=16008980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6176175A Expired - Lifetime JP2930870B2 (ja) 1994-07-06 1994-07-06 電子部品表面実装装置

Country Status (7)

Country Link
US (1) US5960534A (en, 2012)
EP (1) EP0691804A1 (en, 2012)
JP (1) JP2930870B2 (en, 2012)
KR (1) KR100226169B1 (en, 2012)
CN (1) CN1070334C (en, 2012)
SG (1) SG42759A1 (en, 2012)
TW (1) TW279300B (en, 2012)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3802954B2 (ja) * 1996-11-27 2006-08-02 富士機械製造株式会社 回路部品搬送装置
US6895662B2 (en) * 1997-09-25 2005-05-24 Matsushita Electric Industrial Co., Ltd. Apparatus for holding and mounting a component
US6298547B1 (en) * 1997-09-25 2001-10-09 Matsushita Electric Industrial Co., Ltd. Apparatus for holding component, apparatus for mounting component, and method for mounting component
JPH11199043A (ja) * 1998-01-16 1999-07-27 Fuji Mach Mfg Co Ltd 回路基材搬送装置
US6276051B1 (en) * 1998-01-29 2001-08-21 Fuji Machine Mfg. Co., Ltd. Electric-component transferring apparatus
JPH11214897A (ja) * 1998-01-29 1999-08-06 Fuji Mach Mfg Co Ltd 電気部品搬送装置
US6101707A (en) * 1998-03-03 2000-08-15 Sanyo Electric Co., Ltd. Mounting head for electronic component-mounting apparatus
KR100515446B1 (ko) * 1998-08-07 2005-11-28 삼성전자주식회사 전자부품 실장장치 및 실장제어방법
JP4255162B2 (ja) 1999-04-01 2009-04-15 富士機械製造株式会社 電気部品の装着方法および電気部品装着システム
EP1319327A2 (en) * 2000-09-19 2003-06-18 Matsushita Electric Industrial Co., Ltd. Component suction device, component mounting apparatus and component mounting method
JP4517541B2 (ja) * 2001-06-13 2010-08-04 ソニー株式会社 部品装着装置における部品高さ測定方法及びその装置
US6625878B2 (en) * 2001-09-05 2003-09-30 Delaware Capital Formation Method and apparatus for improving component placement in a component pick up and place machine
JPWO2003088730A1 (ja) * 2002-04-01 2005-08-25 富士機械製造株式会社 対基板作業システム
JP4348052B2 (ja) * 2002-05-29 2009-10-21 山形カシオ株式会社 電子部品搭載装置
JP4384439B2 (ja) * 2002-11-21 2009-12-16 富士機械製造株式会社 対基板作業機、対基板作業システムおよび対基板作業機用作業ヘッド使用準備処理プログラム
JP4546857B2 (ja) 2005-03-16 2010-09-22 富士機械製造株式会社 電子部品保持装置および電子部品装着システム
JP4818860B2 (ja) * 2006-09-19 2011-11-16 Ｊｕｋｉ株式会社 部品実装機のパーツフィーダ位置決め装置
JP5094223B2 (ja) * 2007-06-15 2012-12-12 富士機械製造株式会社 装着部品装着ヘッドおよび装着部品装着装置
JP5094567B2 (ja) * 2008-06-02 2012-12-12 富士機械製造株式会社 電子部品装着ヘッド
JP5126177B2 (ja) * 2009-07-29 2013-01-23 パナソニック株式会社 部品実装装置
EP2566315B1 (en) 2010-04-29 2022-08-24 FUJI Corporation Integrated control device and integrated control method
JP5750235B2 (ja) 2010-04-29 2015-07-15 富士機械製造株式会社 製造作業機
JP5597158B2 (ja) 2011-04-11 2014-10-01 ヤマハ発動機株式会社 部品実装装置
CN105379448B (zh) * 2013-07-25 2018-11-09 株式会社富士 元件安装机
JP6574954B2 (ja) * 2014-10-27 2019-09-18 ハンファ精密機械株式会社 表面実装機の実装ヘッド
WO2017126031A1 (ja) * 2016-01-19 2017-07-27 富士機械製造株式会社 部品実装機
KR101736476B1 (ko) * 2017-03-23 2017-05-16 한화테크윈 주식회사 부품 유지 헤드
JP7348041B2 (ja) * 2019-11-21 2023-09-20 ファナック株式会社 ワーク取出装置
KR102134444B1 (ko) * 2019-12-18 2020-07-15 (주)멀티일렉텍 고정 지그 장치
KR102134449B1 (ko) * 2019-12-18 2020-07-15 박광원 픽업 모듈 장치
CN114334783A (zh) * 2021-12-31 2022-04-12 深圳新益昌科技股份有限公司 晶片安装装置
CN119767671A (zh) * 2025-03-06 2025-04-04 诸暨市赵家轻工原件厂 一种贴片机及其控制系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2537770B2 (ja) * 1984-08-31 1996-09-25 松下電器産業株式会社 電子部品の装着方法
US4979286A (en) * 1988-05-13 1990-12-25 Hitachi, Ltd. Electric parts mounting apparatus and electric parts mounting method
US4872258A (en) * 1988-09-22 1989-10-10 Universal Instruments Corporation Pick and place method and apparatus
US4951383A (en) * 1988-11-14 1990-08-28 Sanyo Electric Co., Ltd. Electronic parts automatic mounting apparatus
JPH0834359B2 (ja) * 1990-08-09 1996-03-29 松下電器産業株式会社 電子部品実装装置
JP2840426B2 (ja) * 1990-10-11 1998-12-24 三洋電機株式会社 部品装着装置
JP3050638B2 (ja) * 1991-05-22 2000-06-12 富士機械製造株式会社 電子部品吸着ノズルの回転装置

Also Published As

Publication number Publication date
KR960006740A (ko) 1996-02-23
KR100226169B1 (ko) 1999-10-15
US5960534A (en) 1999-10-05
CN1070334C (zh) 2001-08-29
SG42759A1 (en) 1997-10-17
EP0691804A1 (en) 1996-01-10
JPH0823194A (ja) 1996-01-23
CN1120801A (zh) 1996-04-17
TW279300B (en, 2012) 1996-06-21

Similar Documents

Publication Publication Date Title
JP2930870B2 (ja) 電子部品表面実装装置
JP3132353B2 (ja) チップの搭載装置および搭載方法
JP4498561B2 (ja) 配線板支持装置の段取替え装置
JPH11220294A (ja) 電気部品搬送装置ならびにそれにおける保持具交換方法および装置
JP4546663B2 (ja) プリント板保持装置および電気部品装着システム
JP2002057498A (ja) 配線板作業システム
KR20050092415A (ko) 전자부품 실장장치 및 전자부품 실장방법
CN1526524A (zh) 板状工件的开孔装置和开孔方法
JP3115958B2 (ja) 実装機におけるノズル交換装置
JP3255065B2 (ja) チップの搭載装置
JPH10209687A (ja) 表面実装機のノズル昇降用エアシリンダの構造
KR100328345B1 (ko) 표면실장장치 및 그 실장방법
JP4733324B2 (ja) 電子部品装着装置
CN1526523A (zh) 开孔装置
KR101166058B1 (ko) 전자 부품의 실장 장치 및 실장 방법
JPH11121990A (ja) 部品装着装置
JPH0777306B2 (ja) 部品装着装置
JP3613644B2 (ja) はんだボール搭載装置
KR100627062B1 (ko) 부품 실장기 및 이에 의한 전자부품 실장방법
KR20100059659A (ko) 전자부품 폐기박스와 전자부품 장착장치 및 전자부품 장착방법
JP4360538B2 (ja) 電子部品実装機、焦点距離切換レンズユニット、電子部品実装機のカメラ焦点距離切換方法及び撮像方法
JPH05206624A (ja) デバイスをプリント板にはんだ付けする方法および装置
JP2009032867A (ja) 分割装置
JP2000153484A (ja) 表面実装機
JPH0321119B2 (en, 2012)