JP2561813B2 - エラストマ部材をボンディングしたフレキシブル回路を備える回路構造及びその製作方法 - Google Patents

エラストマ部材をボンディングしたフレキシブル回路を備える回路構造及びその製作方法

Info

Publication number
JP2561813B2
JP2561813B2 JP6326233A JP32623394A JP2561813B2 JP 2561813 B2 JP2561813 B2 JP 2561813B2 JP 6326233 A JP6326233 A JP 6326233A JP 32623394 A JP32623394 A JP 32623394A JP 2561813 B2 JP2561813 B2 JP 2561813B2
Authority
JP
Japan
Prior art keywords
metal pad
bonding
elastomer
elastomeric
circuit structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6326233A
Other languages
English (en)
Japanese (ja)
Other versions
JPH07273446A (ja
Inventor
ウィリアム・ルイス・ブロドスキ
ジェームズ・ダニエル・ヘラード
トマス・ジョージ・マセク
ティモシー・リー・シャープ
ジョージ・ジョーゼフ・ショヴロフスキ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPH07273446A publication Critical patent/JPH07273446A/ja
Application granted granted Critical
Publication of JP2561813B2 publication Critical patent/JP2561813B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP6326233A 1994-03-23 1994-12-27 エラストマ部材をボンディングしたフレキシブル回路を備える回路構造及びその製作方法 Expired - Lifetime JP2561813B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/217,141 US5468917A (en) 1994-03-23 1994-03-23 Circuitized structure including flexible circuit with elastomeric member bonded thereto
US217141 1998-12-21

Publications (2)

Publication Number Publication Date
JPH07273446A JPH07273446A (ja) 1995-10-20
JP2561813B2 true JP2561813B2 (ja) 1996-12-11

Family

ID=22809822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6326233A Expired - Lifetime JP2561813B2 (ja) 1994-03-23 1994-12-27 エラストマ部材をボンディングしたフレキシブル回路を備える回路構造及びその製作方法

Country Status (5)

Country Link
US (3) US5468917A (enExample)
EP (1) EP0675569A1 (enExample)
JP (1) JP2561813B2 (enExample)
KR (1) KR0144997B1 (enExample)
TW (1) TW259899B (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5478779A (en) 1994-03-07 1995-12-26 Micron Technology, Inc. Electrically conductive projections and semiconductor processing method of forming same
US5326428A (en) 1993-09-03 1994-07-05 Micron Semiconductor, Inc. Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
US5468917A (en) * 1994-03-23 1995-11-21 International Business Machines Corporation Circuitized structure including flexible circuit with elastomeric member bonded thereto
EP0675673A3 (en) * 1994-03-30 1997-03-05 Nitto Denko Corp Reinforcement for flexible printed circuit board and reinforced flexible printed circuit board.
US5557503A (en) * 1995-05-12 1996-09-17 International Business Machines Corporation Circuit card having a large module strain relief and heat sink support
JP3420391B2 (ja) * 1995-06-20 2003-06-23 キヤノン株式会社 電気回路基板におけるアライメントマーク構造
US6143989A (en) * 1995-07-20 2000-11-07 The Regents Of The University Of California Active alignment/contact verification system
US5856636A (en) * 1997-03-03 1999-01-05 Sanso; David W. Electronic circuit prototype wiring board with visually distinctive contact pads
US6081988A (en) * 1998-04-30 2000-07-04 Lockheed Martin Corp. Fabrication of a circuit module with a coaxial transmission line
US5945897A (en) * 1998-04-30 1999-08-31 Lockheed Martin Corporation Compliant RF coaxial interconnect
US6031188A (en) * 1998-04-30 2000-02-29 Lockheed Martin Corp. Multi-circuit RF connections using molded and compliant RF coaxial interconnects
US6271481B1 (en) * 1998-09-03 2001-08-07 Visteon Global Technologies, Inc. Pad configurations for improved etching of multilayer circuit assemblies
GB2352315B (en) * 1999-07-19 2003-12-03 Nokia Mobile Phones Ltd Sim card reader
JP3205548B2 (ja) * 1999-10-01 2001-09-04 ソニーケミカル株式会社 多層フレキシブル配線板
US6399896B1 (en) 2000-03-15 2002-06-04 International Business Machines Corporation Circuit package having low modulus, conformal mounting pads
US6395998B1 (en) * 2000-09-13 2002-05-28 International Business Machines Corporation Electronic package having an adhesive retaining cavity
US6514088B1 (en) * 2000-11-03 2003-02-04 Cray Inc. Uniform pressure pad for electrical contacts
US6425768B1 (en) 2000-11-17 2002-07-30 Intercon Systems, Inc. Clamp connector assembly
US6595784B2 (en) 2001-05-15 2003-07-22 International Business Machines Corporation Interposer member having apertures for relieving stress and increasing contact compliancy
JP2003332483A (ja) * 2002-05-16 2003-11-21 Hitachi Ltd 配線基板とそれを用いた電子装置
US6994918B2 (en) * 2003-08-12 2006-02-07 Johnson Morgan T Selective application of conductive material to circuit boards by pick and place
JP2006140052A (ja) * 2004-11-12 2006-06-01 Three M Innovative Properties Co 熱硬化性接着フィルム付きコネクタ及びそれを用いた接続方法
JP4902248B2 (ja) * 2006-04-07 2012-03-21 株式会社日本マイクロニクス 電気的接続装置
JP4841298B2 (ja) * 2006-04-14 2011-12-21 株式会社日本マイクロニクス プローブシートの製造方法
JP4884821B2 (ja) * 2006-04-14 2012-02-29 株式会社日本マイクロニクス プローブシートおよび電気的接続装置
JP2008082912A (ja) * 2006-09-28 2008-04-10 Micronics Japan Co Ltd 電気的接続装置
US7425134B1 (en) 2007-05-21 2008-09-16 Amphenol Corporation Compression mat for an electrical connector
KR101542478B1 (ko) * 2007-08-15 2015-08-06 테세라, 인코포레이티드 도전성 포스트를 갖는 상호접속 소자의 제조 방법
US9575560B2 (en) 2014-06-03 2017-02-21 Google Inc. Radar-based gesture-recognition through a wearable device
US9811164B2 (en) 2014-08-07 2017-11-07 Google Inc. Radar-based gesture sensing and data transmission
US9921660B2 (en) 2014-08-07 2018-03-20 Google Llc Radar-based gesture recognition
US10268321B2 (en) 2014-08-15 2019-04-23 Google Llc Interactive textiles within hard objects
US9588625B2 (en) 2014-08-15 2017-03-07 Google Inc. Interactive textiles
US9778749B2 (en) 2014-08-22 2017-10-03 Google Inc. Occluded gesture recognition
US11169988B2 (en) 2014-08-22 2021-11-09 Google Llc Radar recognition-aided search
US9600080B2 (en) 2014-10-02 2017-03-21 Google Inc. Non-line-of-sight radar-based gesture recognition
US10016162B1 (en) 2015-03-23 2018-07-10 Google Llc In-ear health monitoring
US9983747B2 (en) 2015-03-26 2018-05-29 Google Llc Two-layer interactive textiles
CN111880650B (zh) 2015-04-30 2024-07-05 谷歌有限责任公司 基于宽场雷达的手势识别
WO2016176606A1 (en) 2015-04-30 2016-11-03 Google Inc. Type-agnostic rf signal representations
KR102236958B1 (ko) 2015-04-30 2021-04-05 구글 엘엘씨 제스처 추적 및 인식을 위한 rf―기반 마이크로―모션 추적
US9693592B2 (en) 2015-05-27 2017-07-04 Google Inc. Attaching electronic components to interactive textiles
US10088908B1 (en) 2015-05-27 2018-10-02 Google Llc Gesture detection and interactions
US10817065B1 (en) 2015-10-06 2020-10-27 Google Llc Gesture recognition using multiple antenna
US9837760B2 (en) * 2015-11-04 2017-12-05 Google Inc. Connectors for connecting electronics embedded in garments to external devices
US10492302B2 (en) 2016-05-03 2019-11-26 Google Llc Connecting an electronic component to an interactive textile
WO2017200570A1 (en) 2016-05-16 2017-11-23 Google Llc Interactive object with multiple electronics modules
US10579150B2 (en) 2016-12-05 2020-03-03 Google Llc Concurrent detection of absolute distance and relative movement for sensing action gestures

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4116517A (en) * 1976-04-15 1978-09-26 International Telephone And Telegraph Corporation Flexible printed circuit and electrical connection therefor
JPS5951112B2 (ja) * 1979-02-08 1984-12-12 信越ポリマ−株式会社 コネクタ−の製造方法
GB2058652B (en) * 1979-09-18 1983-01-26 Shinetsu Polymer Co Method of making an electrical connector
US4403272A (en) * 1980-06-02 1983-09-06 Oak Industries Inc. Membrane switch interconnect tail and printed circuit board connection
US4548451A (en) * 1984-04-27 1985-10-22 International Business Machines Corporation Pinless connector interposer and method for making the same
US4980016A (en) * 1985-08-07 1990-12-25 Canon Kabushiki Kaisha Process for producing electric circuit board
US4944087A (en) * 1988-10-05 1990-07-31 Rogers Corporation Method of making a curved plastic body with circuit pattern
US4902234A (en) * 1988-11-03 1990-02-20 International Business Machines Corporation Electrical connector assembly including pressure exertion member
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
US5046953A (en) * 1990-05-25 1991-09-10 Hewlett-Packard Company Method and apparatus for mounting an integrated circuit on a printed circuit board
US5187020A (en) * 1990-07-31 1993-02-16 Texas Instruments Incorporated Compliant contact pad
US5197184A (en) * 1990-09-11 1993-03-30 Hughes Aircraft Company Method of forming three-dimensional circuitry
US5261158A (en) * 1991-01-22 1993-11-16 Hughes Aircraft Company Method of forming a resilient interconnection bridge
US5099393A (en) * 1991-03-25 1992-03-24 International Business Machines Corporation Electronic package for high density applications
US5059129A (en) * 1991-03-25 1991-10-22 International Business Machines Corporation Connector assembly including bilayered elastomeric member
US5155302A (en) * 1991-06-24 1992-10-13 At&T Bell Laboratories Electronic device interconnection techniques
US5147208A (en) * 1991-06-28 1992-09-15 Rogers Corporation Flexible printed circuit with raised contacts
JPH07105420B2 (ja) * 1991-08-26 1995-11-13 ヒューズ・エアクラフト・カンパニー 成形された接点をもった電気接続
US5427535A (en) * 1993-09-24 1995-06-27 Aries Electronics, Inc. Resilient electrically conductive terminal assemblies
US5468917A (en) * 1994-03-23 1995-11-21 International Business Machines Corporation Circuitized structure including flexible circuit with elastomeric member bonded thereto
US5579207A (en) * 1994-10-20 1996-11-26 Hughes Electronics Three-dimensional integrated circuit stacking

Also Published As

Publication number Publication date
EP0675569A1 (en) 1995-10-04
US5703331A (en) 1997-12-30
TW259899B (enExample) 1995-10-11
JPH07273446A (ja) 1995-10-20
KR950028225A (ko) 1995-10-18
US5932047A (en) 1999-08-03
KR0144997B1 (ko) 1998-08-17
US5468917A (en) 1995-11-21

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