JP2520392Y2 - 電子部品包装体 - Google Patents
電子部品包装体Info
- Publication number
- JP2520392Y2 JP2520392Y2 JP3545590U JP3545590U JP2520392Y2 JP 2520392 Y2 JP2520392 Y2 JP 2520392Y2 JP 3545590 U JP3545590 U JP 3545590U JP 3545590 U JP3545590 U JP 3545590U JP 2520392 Y2 JP2520392 Y2 JP 2520392Y2
- Authority
- JP
- Japan
- Prior art keywords
- film
- laminated
- cover tape
- electronic component
- resin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 4
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 13
- 229920013716 polyethylene resin Polymers 0.000 claims description 8
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 claims description 7
- 229920001225 polyester resin Polymers 0.000 claims description 7
- 239000004645 polyester resin Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229920006267 polyester film Polymers 0.000 claims description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 5
- 229920001903 high density polyethylene Polymers 0.000 claims description 4
- 239000004700 high-density polyethylene Substances 0.000 claims description 4
- 229920006284 nylon film Polymers 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000012775 heat-sealing material Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 239000004677 Nylon Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 229920003355 Novatec® Polymers 0.000 description 1
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012793 heat-sealing layer Substances 0.000 description 1
- 229920006262 high density polyethylene film Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- RLAWWYSOJDYHDC-BZSNNMDCSA-N lisinopril Chemical compound C([C@H](N[C@@H](CCCCN)C(=O)N1[C@@H](CCC1)C(O)=O)C(O)=O)CC1=CC=CC=C1 RLAWWYSOJDYHDC-BZSNNMDCSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3545590U JP2520392Y2 (ja) | 1990-04-03 | 1990-04-03 | 電子部品包装体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3545590U JP2520392Y2 (ja) | 1990-04-03 | 1990-04-03 | 電子部品包装体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03126870U JPH03126870U (enrdf_load_stackoverflow) | 1991-12-20 |
| JP2520392Y2 true JP2520392Y2 (ja) | 1996-12-18 |
Family
ID=31540833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3545590U Expired - Lifetime JP2520392Y2 (ja) | 1990-04-03 | 1990-04-03 | 電子部品包装体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2520392Y2 (enrdf_load_stackoverflow) |
-
1990
- 1990-04-03 JP JP3545590U patent/JP2520392Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03126870U (enrdf_load_stackoverflow) | 1991-12-20 |
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