JP2514858Y2 - 樹脂バリ除去装置 - Google Patents

樹脂バリ除去装置

Info

Publication number
JP2514858Y2
JP2514858Y2 JP1988156229U JP15622988U JP2514858Y2 JP 2514858 Y2 JP2514858 Y2 JP 2514858Y2 JP 1988156229 U JP1988156229 U JP 1988156229U JP 15622988 U JP15622988 U JP 15622988U JP 2514858 Y2 JP2514858 Y2 JP 2514858Y2
Authority
JP
Japan
Prior art keywords
resin burr
resin
pin
lead frame
burr
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988156229U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0276006U (enrdf_load_stackoverflow
Inventor
憲弘 羽諸
Original Assignee
日立エーアイシー 株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立エーアイシー 株式会社 filed Critical 日立エーアイシー 株式会社
Priority to JP1988156229U priority Critical patent/JP2514858Y2/ja
Publication of JPH0276006U publication Critical patent/JPH0276006U/ja
Application granted granted Critical
Publication of JP2514858Y2 publication Critical patent/JP2514858Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Nonmetal Cutting Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988156229U 1988-11-30 1988-11-30 樹脂バリ除去装置 Expired - Lifetime JP2514858Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988156229U JP2514858Y2 (ja) 1988-11-30 1988-11-30 樹脂バリ除去装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988156229U JP2514858Y2 (ja) 1988-11-30 1988-11-30 樹脂バリ除去装置

Publications (2)

Publication Number Publication Date
JPH0276006U JPH0276006U (enrdf_load_stackoverflow) 1990-06-11
JP2514858Y2 true JP2514858Y2 (ja) 1996-10-23

Family

ID=31434583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988156229U Expired - Lifetime JP2514858Y2 (ja) 1988-11-30 1988-11-30 樹脂バリ除去装置

Country Status (1)

Country Link
JP (1) JP2514858Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008001982A1 (en) * 2006-06-26 2008-01-03 M.I.Semiconductor Co., Ltd. Apparatus and method for eliminating molding compound of semi-conductor and electronic device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5167357A (ja) * 1974-12-07 1976-06-10 Toyoda Gosei Kk Tenzopurasuchitsukuhagurumano barijokyohoho
JPS58124255A (ja) * 1982-01-21 1983-07-23 Toshiba Corp 半導体装置のリ−ドフレ−ム
JPS63107521A (ja) * 1986-10-24 1988-05-12 Hitachi Ltd ばり取り装置
JPS6450454A (en) * 1987-08-21 1989-02-27 Hitachi Ltd Manufacture of lead frame and semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008001982A1 (en) * 2006-06-26 2008-01-03 M.I.Semiconductor Co., Ltd. Apparatus and method for eliminating molding compound of semi-conductor and electronic device

Also Published As

Publication number Publication date
JPH0276006U (enrdf_load_stackoverflow) 1990-06-11

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