JP2500561Y2 - 多ピンリ―ドフレ―ム - Google Patents
多ピンリ―ドフレ―ムInfo
- Publication number
- JP2500561Y2 JP2500561Y2 JP1990104360U JP10436090U JP2500561Y2 JP 2500561 Y2 JP2500561 Y2 JP 2500561Y2 JP 1990104360 U JP1990104360 U JP 1990104360U JP 10436090 U JP10436090 U JP 10436090U JP 2500561 Y2 JP2500561 Y2 JP 2500561Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- metal foil
- strips
- lead frame
- insulating sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000011888 foil Substances 0.000 claims description 28
- 239000010409 thin film Substances 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- -1 and the like Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- QUCZBHXJAUTYHE-UHFFFAOYSA-N gold Chemical compound [Au].[Au] QUCZBHXJAUTYHE-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990104360U JP2500561Y2 (ja) | 1990-10-03 | 1990-10-03 | 多ピンリ―ドフレ―ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990104360U JP2500561Y2 (ja) | 1990-10-03 | 1990-10-03 | 多ピンリ―ドフレ―ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0463154U JPH0463154U (enrdf_load_stackoverflow) | 1992-05-29 |
| JP2500561Y2 true JP2500561Y2 (ja) | 1996-06-05 |
Family
ID=31849603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990104360U Expired - Fee Related JP2500561Y2 (ja) | 1990-10-03 | 1990-10-03 | 多ピンリ―ドフレ―ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2500561Y2 (enrdf_load_stackoverflow) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5895657U (ja) * | 1981-12-23 | 1983-06-29 | 日本電気株式会社 | 集積回路用リ−ドフレ−ム |
-
1990
- 1990-10-03 JP JP1990104360U patent/JP2500561Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0463154U (enrdf_load_stackoverflow) | 1992-05-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |