JP2024050679A5 - - Google Patents

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Publication number
JP2024050679A5
JP2024050679A5 JP2024009105A JP2024009105A JP2024050679A5 JP 2024050679 A5 JP2024050679 A5 JP 2024050679A5 JP 2024009105 A JP2024009105 A JP 2024009105A JP 2024009105 A JP2024009105 A JP 2024009105A JP 2024050679 A5 JP2024050679 A5 JP 2024050679A5
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JP
Japan
Prior art keywords
conductor
substrate
openings
opening
wiring board
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Application number
JP2024009105A
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English (en)
Japanese (ja)
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JP7813823B2 (ja
JP2024050679A (ja
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Priority claimed from JP2022553973A external-priority patent/JP7428821B2/ja
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Publication of JP2024050679A5 publication Critical patent/JP2024050679A5/ja
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Publication of JP7813823B2 publication Critical patent/JP7813823B2/ja
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JP2024009105A 2020-09-30 2024-01-25 配線基体および電子装置 Active JP7813823B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020165236 2020-09-30
JP2020165236 2020-09-30
JP2022553973A JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置
PCT/JP2021/035477 WO2022071256A1 (ja) 2020-09-30 2021-09-28 配線基体および電子装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2022553973A Division JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置

Publications (3)

Publication Number Publication Date
JP2024050679A JP2024050679A (ja) 2024-04-10
JP2024050679A5 true JP2024050679A5 (https=) 2025-03-31
JP7813823B2 JP7813823B2 (ja) 2026-02-13

Family

ID=80950381

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022553973A Active JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置
JP2024009105A Active JP7813823B2 (ja) 2020-09-30 2024-01-25 配線基体および電子装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2022553973A Active JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置

Country Status (5)

Country Link
US (1) US20240074035A1 (https=)
EP (1) EP4224519A4 (https=)
JP (2) JP7428821B2 (https=)
CN (1) CN116235293A (https=)
WO (1) WO2022071256A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115343812B (zh) * 2022-08-22 2023-10-17 德阳三环科技有限公司 输入输出构件和制备方法及封装基座和光器件
WO2026048794A1 (ja) * 2024-08-29 2026-03-05 京セラ株式会社 配線基板、電子部品収納用パッケージ及び電子モジュール

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3170030B2 (ja) * 1992-03-17 2001-05-28 新光電気工業株式会社 高周波用電子部品の信号線路
US6891731B1 (en) * 1999-11-01 2005-05-10 Advanced Micro Devices, Inc. Crosstalk cancellation for integrated circuit package configuration
US6624729B2 (en) * 2000-12-29 2003-09-23 Hewlett-Packard Development Company, L.P. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
JP2006086293A (ja) 2004-09-15 2006-03-30 Canon Inc プリント配線基板及び該配線基板のグランドパターン設計方法
KR101454720B1 (ko) * 2010-12-03 2014-10-27 가부시키가이샤 무라타 세이사쿠쇼 고주파 신호선로 및 전자기기
JP5842850B2 (ja) * 2012-06-29 2016-01-13 株式会社村田製作所 フラットケーブルおよび電子機器
JP6272131B2 (ja) * 2014-05-02 2018-01-31 日本電信電話株式会社 光モジュール
WO2015182348A1 (ja) * 2014-05-29 2015-12-03 株式会社村田製作所 高周波信号線路及びこれを備えた電子機器
WO2016186128A1 (ja) * 2015-05-20 2016-11-24 京セラ株式会社 半導体素子パッケージ、半導体装置および実装構造体
JP6441850B2 (ja) * 2016-03-31 2018-12-19 Ritaエレクトロニクス株式会社 多層プリント配線板
JP6724648B2 (ja) * 2016-08-16 2020-07-15 富士ゼロックス株式会社 配線基板
JP6825986B2 (ja) * 2017-05-26 2021-02-03 京セラ株式会社 配線基板、電子部品収納用パッケージおよび電子装置
JP6939603B2 (ja) 2018-01-26 2021-09-22 住友電気工業株式会社 光受信モジュール用パッケージ
JP7100487B2 (ja) * 2018-04-27 2022-07-13 京セラ株式会社 印刷配線板
JP7145311B2 (ja) * 2019-03-07 2022-09-30 京セラ株式会社 配線基板、電子部品用パッケージおよび電子装置

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