JP2023183389A5 - - Google Patents

Download PDF

Info

Publication number
JP2023183389A5
JP2023183389A5 JP2023093369A JP2023093369A JP2023183389A5 JP 2023183389 A5 JP2023183389 A5 JP 2023183389A5 JP 2023093369 A JP2023093369 A JP 2023093369A JP 2023093369 A JP2023093369 A JP 2023093369A JP 2023183389 A5 JP2023183389 A5 JP 2023183389A5
Authority
JP
Japan
Prior art keywords
protective member
circuit board
board according
region
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023093369A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023183389A (ja
Filing date
Publication date
Priority claimed from KR1020220072782A external-priority patent/KR102587161B1/ko
Application filed filed Critical
Publication of JP2023183389A publication Critical patent/JP2023183389A/ja
Publication of JP2023183389A5 publication Critical patent/JP2023183389A5/ja
Pending legal-status Critical Current

Links

JP2023093369A 2022-06-15 2023-06-06 半導体パッケージ Pending JP2023183389A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2022-0072782 2022-06-15
KR1020220072782A KR102587161B1 (ko) 2022-06-15 2022-06-15 반도체 패키지

Publications (2)

Publication Number Publication Date
JP2023183389A JP2023183389A (ja) 2023-12-27
JP2023183389A5 true JP2023183389A5 (https=) 2024-07-16

Family

ID=88294992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023093369A Pending JP2023183389A (ja) 2022-06-15 2023-06-06 半導体パッケージ

Country Status (5)

Country Link
US (1) US20230411268A1 (https=)
JP (1) JP2023183389A (https=)
KR (3) KR102587161B1 (https=)
CN (1) CN117238859A (https=)
TW (1) TW202406041A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230420357A1 (en) * 2022-06-24 2023-12-28 Intel Corporation Silicon nitride layer under a copper pad
KR20250053452A (ko) * 2023-10-13 2025-04-22 주성엔지니어링(주) 기판 처리 방법, 기판 처리 장치 및 반도체 장치
WO2025150970A1 (ko) * 2024-01-10 2025-07-17 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지
TWI888014B (zh) * 2024-02-17 2025-06-21 威鋒電子股份有限公司 電路板及電子總成

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6169713B2 (ja) * 2013-09-27 2017-07-26 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN107646141A (zh) * 2015-06-25 2018-01-30 英特尔公司 用于堆叠封装的具有凹陷导电接触部的集成电路结构
KR102566996B1 (ko) * 2016-09-09 2023-08-14 삼성전자주식회사 FOWLP 형태의 반도체 패키지 및 이를 가지는 PoP 형태의 반도체 패키지
US11004819B2 (en) * 2019-09-27 2021-05-11 International Business Machines Corporation Prevention of bridging between solder joints
KR102714897B1 (ko) * 2019-10-11 2024-10-07 삼성전자주식회사 반도체 패키지

Similar Documents

Publication Publication Date Title
JP2023183389A5 (https=)
KR101815754B1 (ko) 반도체 디바이스
KR102161776B1 (ko) 적층 패키지
CN102111957B (zh) 用于增加每pcb层的布线通道数目的bga印迹图案
US10582615B2 (en) Printed wiring board, printed circuit board, and electronic device
JP2010093109A5 (https=)
JP2009070965A5 (https=)
TWI429985B (zh) 引線結構以及具有此引線結構的顯示面板
JP2010272681A5 (https=)
CN101359642A (zh) 半导体芯片封装及其设计方法
JP2018200377A5 (https=)
TWI654722B (zh) 半導體裝置
JP2018107267A5 (https=)
JP2015072942A (ja) 半導体装置
KR20080073739A (ko) 적층형 마이크로전자 패키지
CN205621726U (zh) 半导体封装
JP2001015643A5 (https=)
JP2011003584A5 (ja) 半導体装置および多層配線基板
JP4116055B2 (ja) 半導体装置
TWI566352B (zh) 封裝基板及封裝件
US10090263B2 (en) Semiconductor package, printed circuit board substrate and semiconductor device
JP2020008742A5 (https=)
JPH01298731A (ja) 半導体装置
JPWO2024101089A5 (https=)
JP2009188328A5 (https=)