JPWO2024101089A5 - - Google Patents

Info

Publication number
JPWO2024101089A5
JPWO2024101089A5 JP2024557270A JP2024557270A JPWO2024101089A5 JP WO2024101089 A5 JPWO2024101089 A5 JP WO2024101089A5 JP 2024557270 A JP2024557270 A JP 2024557270A JP 2024557270 A JP2024557270 A JP 2024557270A JP WO2024101089 A5 JPWO2024101089 A5 JP WO2024101089A5
Authority
JP
Japan
Prior art keywords
bumps
pseudo
bump
rejects
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024557270A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024101089A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/037552 external-priority patent/WO2024101089A1/ja
Publication of JPWO2024101089A1 publication Critical patent/JPWO2024101089A1/ja
Publication of JPWO2024101089A5 publication Critical patent/JPWO2024101089A5/ja
Pending legal-status Critical Current

Links

JP2024557270A 2022-11-07 2023-10-17 Pending JPWO2024101089A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022178205 2022-11-07
PCT/JP2023/037552 WO2024101089A1 (ja) 2022-11-07 2023-10-17 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024101089A1 JPWO2024101089A1 (https=) 2024-05-16
JPWO2024101089A5 true JPWO2024101089A5 (https=) 2025-07-17

Family

ID=91032775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024557270A Pending JPWO2024101089A1 (https=) 2022-11-07 2023-10-17

Country Status (3)

Country Link
US (1) US20250266388A1 (https=)
JP (1) JPWO2024101089A1 (https=)
WO (1) WO2024101089A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023171042A (ja) * 2022-05-20 2023-12-01 ローム株式会社 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0562978A (ja) * 1991-08-30 1993-03-12 Fujitsu Ltd フリツプチツプ
JPH08250628A (ja) * 1995-03-07 1996-09-27 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP2000236024A (ja) * 1999-02-15 2000-08-29 Matsushita Electric Ind Co Ltd チップサイズ半導体
TW484172B (en) * 2001-02-15 2002-04-21 Au Optronics Corp Metal bump
JP2004079559A (ja) * 2002-08-09 2004-03-11 Hitachi Maxell Ltd 半導体チップ

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