JPWO2024204590A5 - - Google Patents

Info

Publication number
JPWO2024204590A5
JPWO2024204590A5 JP2025511187A JP2025511187A JPWO2024204590A5 JP WO2024204590 A5 JPWO2024204590 A5 JP WO2024204590A5 JP 2025511187 A JP2025511187 A JP 2025511187A JP 2025511187 A JP2025511187 A JP 2025511187A JP WO2024204590 A5 JPWO2024204590 A5 JP WO2024204590A5
Authority
JP
Japan
Prior art keywords
wiring
pad
lead
wirings
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025511187A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024204590A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/012749 external-priority patent/WO2024204590A1/ja
Publication of JPWO2024204590A1 publication Critical patent/JPWO2024204590A1/ja
Publication of JPWO2024204590A5 publication Critical patent/JPWO2024204590A5/ja
Pending legal-status Critical Current

Links

JP2025511187A 2023-03-30 2024-03-28 Pending JPWO2024204590A1 (https=)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2023056613 2023-03-30
JP2023056611 2023-03-30
JP2023056612 2023-03-30
JP2023056610 2023-03-30
PCT/JP2024/012749 WO2024204590A1 (ja) 2023-03-30 2024-03-28 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024204590A1 JPWO2024204590A1 (https=) 2024-10-03
JPWO2024204590A5 true JPWO2024204590A5 (https=) 2026-01-08

Family

ID=92906770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025511187A Pending JPWO2024204590A1 (https=) 2023-03-30 2024-03-28

Country Status (4)

Country Link
US (1) US20260026329A1 (https=)
JP (1) JPWO2024204590A1 (https=)
CN (1) CN120898535A (https=)
WO (1) WO2024204590A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014097524A1 (ja) * 2012-12-21 2014-06-26 パナソニック株式会社 半導体装置
JP7490449B2 (ja) * 2020-05-15 2024-05-27 ローム株式会社 半導体集積回路、モータドライバ、およびモータ駆動システム
JPWO2022224847A1 (https=) * 2021-04-22 2022-10-27

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