JPWO2024024683A5 - - Google Patents

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Publication number
JPWO2024024683A5
JPWO2024024683A5 JP2024537681A JP2024537681A JPWO2024024683A5 JP WO2024024683 A5 JPWO2024024683 A5 JP WO2024024683A5 JP 2024537681 A JP2024537681 A JP 2024537681A JP 2024537681 A JP2024537681 A JP 2024537681A JP WO2024024683 A5 JPWO2024024683 A5 JP WO2024024683A5
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JP
Japan
Prior art keywords
ceramic wiring
wiring member
pair
frame
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024537681A
Other languages
English (en)
Japanese (ja)
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JP7833552B2 (ja
JPWO2024024683A1 (https=
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Priority claimed from PCT/JP2023/026861 external-priority patent/WO2024024683A1/ja
Publication of JPWO2024024683A1 publication Critical patent/JPWO2024024683A1/ja
Publication of JPWO2024024683A5 publication Critical patent/JPWO2024024683A5/ja
Application granted granted Critical
Publication of JP7833552B2 publication Critical patent/JP7833552B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024537681A 2022-07-29 2023-07-21 セラミック配線部材母基板およびセラミック配線部材 Active JP7833552B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2022/029313 2022-07-29
JP2022029313 2022-07-29
PCT/JP2023/026861 WO2024024683A1 (ja) 2022-07-29 2023-07-21 セラミック配線部材母基板およびセラミック配線部材

Publications (3)

Publication Number Publication Date
JPWO2024024683A1 JPWO2024024683A1 (https=) 2024-02-01
JPWO2024024683A5 true JPWO2024024683A5 (https=) 2025-02-14
JP7833552B2 JP7833552B2 (ja) 2026-03-19

Family

ID=89706453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024537681A Active JP7833552B2 (ja) 2022-07-29 2023-07-21 セラミック配線部材母基板およびセラミック配線部材

Country Status (4)

Country Link
JP (1) JP7833552B2 (https=)
CN (1) CN119366270A (https=)
TW (1) TWI871716B (https=)
WO (1) WO2024024683A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3699609B2 (ja) * 1999-04-28 2005-09-28 京セラ株式会社 電子部品搭載用基板
JP2000357604A (ja) * 1999-06-17 2000-12-26 Rohm Co Ltd 集合基板
JP4788663B2 (ja) * 2007-06-07 2011-10-05 株式会社デンソー セラミック基板の製造方法
JP5826113B2 (ja) * 2012-05-24 2015-12-02 京セラ株式会社 圧電振動素子収納用パッケージおよび圧電装置ならびに多数個取り配線基板
WO2019107298A1 (ja) * 2017-11-29 2019-06-06 Ngkエレクトロデバイス株式会社 シート基板およびシート基板の製造方法

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