JPWO2024024683A1 - - Google Patents
Info
- Publication number
- JPWO2024024683A1 JPWO2024024683A1 JP2024537681A JP2024537681A JPWO2024024683A1 JP WO2024024683 A1 JPWO2024024683 A1 JP WO2024024683A1 JP 2024537681 A JP2024537681 A JP 2024537681A JP 2024537681 A JP2024537681 A JP 2024537681A JP WO2024024683 A1 JPWO2024024683 A1 JP WO2024024683A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPPCT/JP2022/029313 | 2022-07-29 | ||
| JP2022029313 | 2022-07-29 | ||
| PCT/JP2023/026861 WO2024024683A1 (ja) | 2022-07-29 | 2023-07-21 | セラミック配線部材母基板およびセラミック配線部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024024683A1 true JPWO2024024683A1 (https=) | 2024-02-01 |
| JPWO2024024683A5 JPWO2024024683A5 (https=) | 2025-02-14 |
| JP7833552B2 JP7833552B2 (ja) | 2026-03-19 |
Family
ID=89706453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024537681A Active JP7833552B2 (ja) | 2022-07-29 | 2023-07-21 | セラミック配線部材母基板およびセラミック配線部材 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7833552B2 (https=) |
| CN (1) | CN119366270A (https=) |
| TW (1) | TWI871716B (https=) |
| WO (1) | WO2024024683A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000357604A (ja) * | 1999-06-17 | 2000-12-26 | Rohm Co Ltd | 集合基板 |
| JP2008302571A (ja) * | 2007-06-07 | 2008-12-18 | Denso Corp | セラミック基板の製造方法 |
| JP2013247449A (ja) * | 2012-05-24 | 2013-12-09 | Kyocera Corp | 圧電振動素子収納用パッケージおよび圧電装置ならびに多数個取り配線基板 |
| WO2019107298A1 (ja) * | 2017-11-29 | 2019-06-06 | Ｎｇｋエレクトロデバイス株式会社 | シート基板およびシート基板の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3699609B2 (ja) * | 1999-04-28 | 2005-09-28 | 京セラ株式会社 | 電子部品搭載用基板 |
-
2023
- 2023-07-21 CN CN202380047285.1A patent/CN119366270A/zh active Pending
- 2023-07-21 JP JP2024537681A patent/JP7833552B2/ja active Active
- 2023-07-21 WO PCT/JP2023/026861 patent/WO2024024683A1/ja not_active Ceased
- 2023-07-28 TW TW112128278A patent/TWI871716B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000357604A (ja) * | 1999-06-17 | 2000-12-26 | Rohm Co Ltd | 集合基板 |
| JP2008302571A (ja) * | 2007-06-07 | 2008-12-18 | Denso Corp | セラミック基板の製造方法 |
| JP2013247449A (ja) * | 2012-05-24 | 2013-12-09 | Kyocera Corp | 圧電振動素子収納用パッケージおよび圧電装置ならびに多数個取り配線基板 |
| WO2019107298A1 (ja) * | 2017-11-29 | 2019-06-06 | Ｎｇｋエレクトロデバイス株式会社 | シート基板およびシート基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7833552B2 (ja) | 2026-03-19 |
| TW202423204A (zh) | 2024-06-01 |
| TWI871716B (zh) | 2025-02-01 |
| CN119366270A (zh) | 2025-01-24 |
| WO2024024683A1 (ja) | 2024-02-01 |
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