TWI871716B - 陶瓷配線構件母基板及陶瓷配線構件 - Google Patents

陶瓷配線構件母基板及陶瓷配線構件 Download PDF

Info

Publication number
TWI871716B
TWI871716B TW112128278A TW112128278A TWI871716B TW I871716 B TWI871716 B TW I871716B TW 112128278 A TW112128278 A TW 112128278A TW 112128278 A TW112128278 A TW 112128278A TW I871716 B TWI871716 B TW I871716B
Authority
TW
Taiwan
Prior art keywords
ceramic wiring
wiring component
pair
main body
notch
Prior art date
Application number
TW112128278A
Other languages
English (en)
Chinese (zh)
Other versions
TW202423204A (zh
Inventor
西島英孝
Original Assignee
日商Ｎｇｋ電子器件股份有限公司
日商日本碍子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｎｇｋ電子器件股份有限公司, 日商日本碍子股份有限公司 filed Critical 日商Ｎｇｋ電子器件股份有限公司
Publication of TW202423204A publication Critical patent/TW202423204A/zh
Application granted granted Critical
Publication of TWI871716B publication Critical patent/TWI871716B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW112128278A 2022-07-29 2023-07-28 陶瓷配線構件母基板及陶瓷配線構件 TWI871716B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
WOPCT/JP2022/029313 2022-07-29
JP2022029313 2022-07-29
WOPCT/JP2023/026861 2023-07-21
PCT/JP2023/026861 WO2024024683A1 (ja) 2022-07-29 2023-07-21 セラミック配線部材母基板およびセラミック配線部材

Publications (2)

Publication Number Publication Date
TW202423204A TW202423204A (zh) 2024-06-01
TWI871716B true TWI871716B (zh) 2025-02-01

Family

ID=89706453

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112128278A TWI871716B (zh) 2022-07-29 2023-07-28 陶瓷配線構件母基板及陶瓷配線構件

Country Status (4)

Country Link
JP (1) JP7833552B2 (https=)
CN (1) CN119366270A (https=)
TW (1) TWI871716B (https=)
WO (1) WO2024024683A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000312060A (ja) * 1999-04-28 2000-11-07 Kyocera Corp 電子部品搭載用基板
JP2013247449A (ja) * 2012-05-24 2013-12-09 Kyocera Corp 圧電振動素子収納用パッケージおよび圧電装置ならびに多数個取り配線基板
CN111133570A (zh) * 2017-11-29 2020-05-08 Ngk电子器件株式会社 片状基板及片状基板的制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000357604A (ja) * 1999-06-17 2000-12-26 Rohm Co Ltd 集合基板
JP4788663B2 (ja) * 2007-06-07 2011-10-05 株式会社デンソー セラミック基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000312060A (ja) * 1999-04-28 2000-11-07 Kyocera Corp 電子部品搭載用基板
JP2013247449A (ja) * 2012-05-24 2013-12-09 Kyocera Corp 圧電振動素子収納用パッケージおよび圧電装置ならびに多数個取り配線基板
CN111133570A (zh) * 2017-11-29 2020-05-08 Ngk电子器件株式会社 片状基板及片状基板的制造方法

Also Published As

Publication number Publication date
JP7833552B2 (ja) 2026-03-19
TW202423204A (zh) 2024-06-01
JPWO2024024683A1 (https=) 2024-02-01
CN119366270A (zh) 2025-01-24
WO2024024683A1 (ja) 2024-02-01

Similar Documents

Publication Publication Date Title
US11387016B2 (en) Transmission line substrate and electronic device
KR101506256B1 (ko) 칩 부품 구조체 및 제조방법
CN107039180A (zh) 电子部件
US20180324950A1 (en) Substrate apparatus and method of manufacturing the same
TWI871716B (zh) 陶瓷配線構件母基板及陶瓷配線構件
WO2021131776A1 (ja) モジュール
US20240074035A1 (en) Wiring base and electronic device
JP2018181972A (ja) セラミック基板
JP3426988B2 (ja) 多数個取り配線基板
WO2020071492A1 (ja) モジュール
JPWO2012060121A1 (ja) 多数個取り配線基板および配線基板ならびに電子装置
JP7634657B2 (ja) 半導体パッケージ及び半導体電子装置
KR102779679B1 (ko) 인쇄회로기판 및 이를 포함하는 반도체 모듈
KR102376698B1 (ko) 액분 함유 전해질 충진용 세라믹 패키지
CN115279021A (zh) 电路板与电子设备
CN104604341B (zh) 布线基板及其制造方法
CN211457878U (zh) 一种封装屏蔽结构及电子设备
JPH0832195A (ja) 複合プリント基板の接続構造
US20260088793A1 (en) Electronic component
CN223680101U (zh) 元器件贴装结构及封装器件
US20250336575A1 (en) Packaged electrical devices and related methods
JP2016136562A (ja) 積層コンデンサ
JPH07122831A (ja) 回路基板及びその製造方法
JP7826616B2 (ja) 電子機器用の接合体及び電子部品の接合方法
CN219042063U (zh) 信号传输线路