JP2024021481A5 - - Google Patents
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- Publication number
- JP2024021481A5 JP2024021481A5 JP2022124328A JP2022124328A JP2024021481A5 JP 2024021481 A5 JP2024021481 A5 JP 2024021481A5 JP 2022124328 A JP2022124328 A JP 2022124328A JP 2022124328 A JP2022124328 A JP 2022124328A JP 2024021481 A5 JP2024021481 A5 JP 2024021481A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- outermost insulating
- wiring
- wiring structure
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022124328A JP2024021481A (ja) | 2022-08-03 | 2022-08-03 | 配線基板集合体、配線基板及び配線基板の製造方法 |
| US18/356,413 US12463101B2 (en) | 2022-08-03 | 2023-07-21 | Wiring board assembly, wiring board, and wiring board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022124328A JP2024021481A (ja) | 2022-08-03 | 2022-08-03 | 配線基板集合体、配線基板及び配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024021481A JP2024021481A (ja) | 2024-02-16 |
| JP2024021481A5 true JP2024021481A5 (https=) | 2025-04-02 |
Family
ID=89769502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022124328A Pending JP2024021481A (ja) | 2022-08-03 | 2022-08-03 | 配線基板集合体、配線基板及び配線基板の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US12463101B2 (https=) |
| JP (1) | JP2024021481A (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0573977U (ja) * | 1992-03-12 | 1993-10-08 | 株式会社富士通ゼネラル | 多面取り基板 |
| JP2001160597A (ja) | 1999-11-30 | 2001-06-12 | Nec Corp | 半導体装置、配線基板及び半導体装置の製造方法 |
| WO2008059571A1 (en) * | 2006-11-15 | 2008-05-22 | Panasonic Corporation | Circuit board connection structure and circuit board |
| JP2011253979A (ja) * | 2010-06-03 | 2011-12-15 | Sumitomo Electric Printed Circuit Inc | プリント配線板の接続構造、配線板接続体及び電子機器 |
| US20130025914A1 (en) * | 2011-07-25 | 2013-01-31 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
| JP2013098410A (ja) * | 2011-11-02 | 2013-05-20 | Ibiden Co Ltd | 多数個取り基板 |
-
2022
- 2022-08-03 JP JP2022124328A patent/JP2024021481A/ja active Pending
-
2023
- 2023-07-21 US US18/356,413 patent/US12463101B2/en active Active
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