JPWO2022234748A5 - - Google Patents

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Publication number
JPWO2022234748A5
JPWO2022234748A5 JP2023518641A JP2023518641A JPWO2022234748A5 JP WO2022234748 A5 JPWO2022234748 A5 JP WO2022234748A5 JP 2023518641 A JP2023518641 A JP 2023518641A JP 2023518641 A JP2023518641 A JP 2023518641A JP WO2022234748 A5 JPWO2022234748 A5 JP WO2022234748A5
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JP
Japan
Prior art keywords
base material
insulating base
vertical direction
forming regions
conductor layer
Prior art date
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Application number
JP2023518641A
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English (en)
Japanese (ja)
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JP7420315B2 (ja
JPWO2022234748A1 (https=
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Priority claimed from PCT/JP2022/015284 external-priority patent/WO2022234748A1/ja
Publication of JPWO2022234748A1 publication Critical patent/JPWO2022234748A1/ja
Publication of JPWO2022234748A5 publication Critical patent/JPWO2022234748A5/ja
Application granted granted Critical
Publication of JP7420315B2 publication Critical patent/JP7420315B2/ja
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JP2023518641A 2021-05-07 2022-03-29 アンテナ素子、電子機器及びアンテナ素子の製造方法 Active JP7420315B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021079044 2021-05-07
JP2021079044 2021-05-07
PCT/JP2022/015284 WO2022234748A1 (ja) 2021-05-07 2022-03-29 アンテナ素子、電子機器及びアンテナ素子の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022234748A1 JPWO2022234748A1 (https=) 2022-11-10
JPWO2022234748A5 true JPWO2022234748A5 (https=) 2023-12-04
JP7420315B2 JP7420315B2 (ja) 2024-01-23

Family

ID=83932155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023518641A Active JP7420315B2 (ja) 2021-05-07 2022-03-29 アンテナ素子、電子機器及びアンテナ素子の製造方法

Country Status (4)

Country Link
US (1) US12438261B2 (https=)
JP (1) JP7420315B2 (https=)
CN (1) CN220856913U (https=)
WO (1) WO2022234748A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7803439B2 (ja) * 2023-01-11 2026-01-21 株式会社村田製作所 多層基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6709806B2 (en) * 2000-03-31 2004-03-23 Kabushiki Kaisha Toshiba Method of forming composite member
JP4314236B2 (ja) * 2000-03-31 2009-08-12 株式会社東芝 複合部材の製造方法、感光性組成物、複合部材製造用の絶縁体、複合部材、多層配線基板及び電子パッケージ
JP2001308470A (ja) * 2000-04-26 2001-11-02 Matsushita Electric Ind Co Ltd 回路部品モジュール及びその製造方法
JP2004096259A (ja) 2002-08-30 2004-03-25 Matsushita Electric Ind Co Ltd 多周波マイクロストリップアンテナ
JP4282580B2 (ja) * 2004-09-28 2009-06-24 株式会社東芝 多孔質配線基板
JP4690834B2 (ja) * 2005-09-01 2011-06-01 古河電気工業株式会社 多周波共用アンテナ
JP6002477B2 (ja) * 2012-07-03 2016-10-05 日東電工株式会社 無線周波数モジュール用基板およびその製造方法
WO2015083216A1 (ja) * 2013-12-02 2015-06-11 山一電機株式会社 多層基板、及び、その製造方法
US10553945B2 (en) * 2017-09-20 2020-02-04 Apple Inc. Antenna arrays having surface wave interference mitigation structures
JP7454929B2 (ja) 2019-09-13 2024-03-25 日東電工株式会社 配線回路基板の製造方法

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