JPWO2023003024A5 - - Google Patents

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Publication number
JPWO2023003024A5
JPWO2023003024A5 JP2023536782A JP2023536782A JPWO2023003024A5 JP WO2023003024 A5 JPWO2023003024 A5 JP WO2023003024A5 JP 2023536782 A JP2023536782 A JP 2023536782A JP 2023536782 A JP2023536782 A JP 2023536782A JP WO2023003024 A5 JPWO2023003024 A5 JP WO2023003024A5
Authority
JP
Japan
Prior art keywords
substrate
interlayer connection
region
connection conductor
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2023536782A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023003024A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/028241 external-priority patent/WO2023003024A1/ja
Publication of JPWO2023003024A1 publication Critical patent/JPWO2023003024A1/ja
Publication of JPWO2023003024A5 publication Critical patent/JPWO2023003024A5/ja
Ceased legal-status Critical Current

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JP2023536782A 2021-07-20 2022-07-20 Ceased JPWO2023003024A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021119921 2021-07-20
PCT/JP2022/028241 WO2023003024A1 (ja) 2021-07-20 2022-07-20 配線基板

Publications (2)

Publication Number Publication Date
JPWO2023003024A1 JPWO2023003024A1 (https=) 2023-01-26
JPWO2023003024A5 true JPWO2023003024A5 (https=) 2024-04-08

Family

ID=84980032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023536782A Ceased JPWO2023003024A1 (https=) 2021-07-20 2022-07-20

Country Status (5)

Country Link
US (1) US20240389226A1 (https=)
EP (1) EP4376562A4 (https=)
JP (1) JPWO2023003024A1 (https=)
CN (1) CN117643183A (https=)
WO (1) WO2023003024A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2587593B2 (ja) * 1993-09-22 1997-03-05 松下電器産業株式会社 プリント配線板及びその製造方法
JP2003008233A (ja) * 2001-06-19 2003-01-10 Nitto Denko Corp 多層配線基板
JP3887337B2 (ja) * 2003-03-25 2007-02-28 株式会社東芝 配線部材およびその製造方法
JP2005285802A (ja) * 2004-03-26 2005-10-13 Kyocera Corp 配線基板及びその製造方法
JP5099272B1 (ja) * 2011-12-26 2012-12-19 パナソニック株式会社 多層配線基板とその製造方法
JP2017174997A (ja) * 2016-03-24 2017-09-28 株式会社村田製作所 多層基板、および、多層基板の製造方法
JP7207867B2 (ja) 2018-05-30 2023-01-18 京セラ株式会社 配線基板
JP7238548B2 (ja) * 2019-03-29 2023-03-14 Tdk株式会社 多層基板用絶縁シート、多層基板および多層基板の製造方法

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