JPWO2022234748A1 - - Google Patents
Info
- Publication number
- JPWO2022234748A1 JPWO2022234748A1 JP2023518641A JP2023518641A JPWO2022234748A1 JP WO2022234748 A1 JPWO2022234748 A1 JP WO2022234748A1 JP 2023518641 A JP2023518641 A JP 2023518641A JP 2023518641 A JP2023518641 A JP 2023518641A JP WO2022234748 A1 JPWO2022234748 A1 JP WO2022234748A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
- Waveguide Aerials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021079044 | 2021-05-07 | ||
| JP2021079044 | 2021-05-07 | ||
| PCT/JP2022/015284 WO2022234748A1 (ja) | 2021-05-07 | 2022-03-29 | アンテナ素子、電子機器及びアンテナ素子の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022234748A1 true JPWO2022234748A1 (https=) | 2022-11-10 |
| JPWO2022234748A5 JPWO2022234748A5 (https=) | 2023-12-04 |
| JP7420315B2 JP7420315B2 (ja) | 2024-01-23 |
Family
ID=83932155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023518641A Active JP7420315B2 (ja) | 2021-05-07 | 2022-03-29 | アンテナ素子、電子機器及びアンテナ素子の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12438261B2 (https=) |
| JP (1) | JP7420315B2 (https=) |
| CN (1) | CN220856913U (https=) |
| WO (1) | WO2022234748A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7803439B2 (ja) * | 2023-01-11 | 2026-01-21 | 株式会社村田製作所 | 多層基板 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308470A (ja) * | 2000-04-26 | 2001-11-02 | Matsushita Electric Ind Co Ltd | 回路部品モジュール及びその製造方法 |
| JP2006100450A (ja) * | 2004-09-28 | 2006-04-13 | Toshiba Corp | 多孔質配線基板 |
| JP2006108702A (ja) * | 2000-03-31 | 2006-04-20 | Toshiba Corp | 複合部材の製造方法、感光性組成物、複合部材製造用の絶縁体、複合部材、多層配線基板及び電子パッケージ |
| JP2007068037A (ja) * | 2005-09-01 | 2007-03-15 | Furukawa Electric Co Ltd:The | 多周波共用アンテナ |
| JP2014011769A (ja) * | 2012-07-03 | 2014-01-20 | Nitto Denko Corp | 無線周波数モジュール用基板およびその製造方法 |
| WO2015083216A1 (ja) * | 2013-12-02 | 2015-06-11 | 山一電機株式会社 | 多層基板、及び、その製造方法 |
| US20190089053A1 (en) * | 2017-09-20 | 2019-03-21 | Apple Inc. | Antenna Arrays Having Surface Wave Interference Mitigation Structures |
| JP2021044475A (ja) * | 2019-09-13 | 2021-03-18 | 日東電工株式会社 | 配線回路基板 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6709806B2 (en) * | 2000-03-31 | 2004-03-23 | Kabushiki Kaisha Toshiba | Method of forming composite member |
| JP2004096259A (ja) | 2002-08-30 | 2004-03-25 | Matsushita Electric Ind Co Ltd | 多周波マイクロストリップアンテナ |
-
2022
- 2022-03-29 WO PCT/JP2022/015284 patent/WO2022234748A1/ja not_active Ceased
- 2022-03-29 CN CN202290000382.6U patent/CN220856913U/zh active Active
- 2022-03-29 JP JP2023518641A patent/JP7420315B2/ja active Active
-
2023
- 2023-10-19 US US18/381,671 patent/US12438261B2/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006108702A (ja) * | 2000-03-31 | 2006-04-20 | Toshiba Corp | 複合部材の製造方法、感光性組成物、複合部材製造用の絶縁体、複合部材、多層配線基板及び電子パッケージ |
| JP2001308470A (ja) * | 2000-04-26 | 2001-11-02 | Matsushita Electric Ind Co Ltd | 回路部品モジュール及びその製造方法 |
| JP2006100450A (ja) * | 2004-09-28 | 2006-04-13 | Toshiba Corp | 多孔質配線基板 |
| JP2007068037A (ja) * | 2005-09-01 | 2007-03-15 | Furukawa Electric Co Ltd:The | 多周波共用アンテナ |
| JP2014011769A (ja) * | 2012-07-03 | 2014-01-20 | Nitto Denko Corp | 無線周波数モジュール用基板およびその製造方法 |
| WO2015083216A1 (ja) * | 2013-12-02 | 2015-06-11 | 山一電機株式会社 | 多層基板、及び、その製造方法 |
| US20190089053A1 (en) * | 2017-09-20 | 2019-03-21 | Apple Inc. | Antenna Arrays Having Surface Wave Interference Mitigation Structures |
| JP2021044475A (ja) * | 2019-09-13 | 2021-03-18 | 日東電工株式会社 | 配線回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN220856913U (zh) | 2024-04-26 |
| JP7420315B2 (ja) | 2024-01-23 |
| US20240047865A1 (en) | 2024-02-08 |
| WO2022234748A1 (ja) | 2022-11-10 |
| US12438261B2 (en) | 2025-10-07 |
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