JP2006108702A - 複合部材の製造方法、感光性組成物、複合部材製造用の絶縁体、複合部材、多層配線基板及び電子パッケージ - Google Patents
複合部材の製造方法、感光性組成物、複合部材製造用の絶縁体、複合部材、多層配線基板及び電子パッケージ Download PDFInfo
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Abstract
【解決手段】 多孔質の絶縁体表面あるいは内部の少なくとも一方に導電部が有機化合物を介して形成されてなる複合部材である。前記絶縁体と導電部との間に存在する前記有機化合物の、前記絶縁体表面における単位表面積当たりの含有量が、前記絶縁体と導電部との間以外に存在する前記有機化合物の、前記絶縁体表面における単位表面積当りの含有量よりも多いことを特徴とする。
【選択図】 図2
Description
工程(1):まず、露光によりイオン交換性基を生成するかあるいは消失する化合物を含有する感光性組成物層2を、図1(a)に示すように絶縁体1に形成する。なお、図1においては、露光によりイオン交換性基を生成する化合物を含有する感光性組成物を使用した例を示している。
このように、ポリカルボジイミド誘導体が脂肪族系の骨格で構成されていると、組成物を低粘度に設定できる。そこで、スピンコート法やディップコート法等による溶剤での塗布の場合において、有機感光性組成物の薄膜化のためには、特に望ましく用いられる。
次に、工程(1)によって絶縁体1に形成された感光性組成物層2に対して、図1(b)に示すように所望の導電性パターンにパターン露光して、感光性組成物層2の露光部4にイオン交換性基を生成あるいは消失させる。
次に、形成されたイオン交換性基に、選択的に金属イオンまたは金属微粒子を結合させて、図1(c)に示すように導電部を形成する。図1(c)においては、露光部4が導電部となる。
イオン交換により形成された導電部4の導電性を向上させるために、図1(d)に示すように、イオン交換性基に結合した金属イオンを還元剤と接触させて金属化させる。
導電部4に対し導電性を向上させるために、図1(e)に示すように無電解めっき5を施す。これにより、導電部4の空孔内を金属である程度充填することができる。
多孔質体の空孔を、含浸樹脂または無機物質で充填する。含浸樹脂としては、エポキシ樹脂やポリイミド、BT樹脂、ベンゾシクロブテン樹脂、架橋ポリブタジエン樹脂などの硬化性樹脂からなるものが挙げられ、無機物質としては、シリカゾル、シルセスキオキサンやポリシラザンなどから生成されるシリカなどを用いることができる。
絶縁体として、ビスマレイミド−トリアジン樹脂シートを用意した。一方、ナフトキノンジアジド含有フェノール樹脂(ナフトキノンジアジド含有率;33当量mol%)をアセトンに溶解して、1wt%の濃度の感光性組成物溶液を調製した。ここで用いたフェノール樹脂の分子量は、2500である。得られた溶液を、前述の樹脂シート上に厚み0.1μmとなるようスピンコートして塗膜を得た。さらに、室温で30min乾燥させて、感光性組成物層を形成した。
絶縁体として、PTFE多孔質フィルム(空孔径500nm、膜厚20μm)を用い、実施例1で用いた感光性組成物溶液を、ディップ法にてフィルム全表面にコーティングした。この操作により、多孔質フィルムの内部空孔表面がナフトキノンジアジド含有フェノール樹脂で被覆された。その後、ドット径50μm、スペース50μmのマスクを用いて、実施例1と同様の操作を行なって複合部材(導電パターン形成シート)を製造した。得られた複合部材においては、ドット径50μm、スペース50μmの導電部が、絶縁体の内部にわたって形成されていた。
実施例2で得られた導電パターン形成シートを、無電解銅めっき液PS−503に30min浸漬し、導電部に銅めっきを施して配線パターンを形成した。フィルム裏面についても同様のパターン形状が形成されていた。
下記式で表わされるポリアミド酸とポリエチレンオキシドとのグラフトコポリマー、およびビス(4−マレイミドフェニルメタン)の混合物を含有するNMP溶液を調製した。ただし、ポリエチレン鎖の分子量は約2万、ポリアミド酸成分とポリエチレンオキシド成分との重量比は2:5とし、グラフトコポリマーとビス(4−マレイミドフェニルメタン)との混合比は重量比で7:1とした。
前述の実施例4と同様の手法により、厚さ10μmのポリイミド多孔質体シートを作製した。このポリイミド多孔質体シートには、孔径約0.2μmの連続な空孔が三次元的に形成されていた。
前述の実施例4と同様の手法により、厚さ40μmのポリイミド多孔質体シートを作製した。このポリイミド多孔質体シートには、孔径約0.2μmの連続な空孔が三次元的に形成されていた。
実施例2および3で作製された導電パターン形成PTFE多孔質シートに対し、銅カラムの端面にCu/Ni系共晶めっきをして高さ2〜3μmの剣山状の構造を形成した。この銅カラムが形成されたPTFE多孔質体シートに含浸する樹脂組成物を、以下のように調製した。
パターンの形成式(II)で表わされる化合物(分子量10,000)5gと、酸発生剤としてN−ヒドロキシナフチルイミドトリフルオロメタンスルホネート0.1gおよびシクロヘキシルアミン0.04gとを、メトキシメチルプロピオネート100gに溶解して、有機感光性組成物溶液を調製した。
有機感光性組成物溶液として、ナフトキノンジアジド含有フェノール樹脂(ナフトキノンジアジド含有率;33当量mol%)0.9gとポリ(エチレン−カルボジイミド)樹脂0.5gとをアセトン100mlに溶解して溶液を調製した。ここで用いたフェノール樹脂の分子量は2500である。この溶液を用いて、実施例1と同様の手法により複合部材を製造した。得られた複合部材には、実施例1と同様に良好なパターンが形成されていた。
有機感光性組成物溶液として、ポリ(p−ニトロベンジル−p−ビニルベンゼンカルボネート−co−スチレン)をトルエンに溶解して、1重量%の濃度の溶液を調製した。用いた樹脂の分子量は、15,000である。この溶液を用いた以外は実施例2と同様の手法により、PTFE多孔質フィルムに配線パターンを形成した。その結果、マスクどおりに良好な導電パターンが得られた。
まず、ポリ(ビニルスチレン)とポリメチルメタクリレートとのジブロックコポリマーを、リビングアニオン重合法により合成した。重量平均分子量Mw=287000(ポリ(ビニルエチレン)分子量=91000、ポリメチルメタクリレート分子量=196000)、Mw/Mn=1.10であった。このジブロックコポリマーに、ラジカル発生剤としての3,3’,4,4’−テトラ−(t−ブチルぺルオキシカルボニル)ベンゾフェノンを1.7重量%添加して混合物を得、この混合物をシクロヘキサノンに溶解して、10重量%の濃度の溶液を調製した。
前述の実施例4と同様の手法により、厚さ20μmのポリイミド多孔質体シートを作製した。このポリイミド多孔質体シートには、孔径約0.2μmの連続な空孔が三次元的に形成されていた。
2…感光性組成物層
3…マスク
4…感光部
5…無電解めっき
Claims (2)
- 多孔質の絶縁体表面あるいは内部の少なくとも一方に導電部が有機化合物を介して形成されてなる複合部材であって、
前記絶縁体と導電部との間に存在する前記有機化合物の、前記絶縁体表面における単位表面積当たりの含有量が、前記絶縁体と導電部との間以外に存在する前記有機化合物の、前記絶縁体表面における単位表面積当りの含有量よりも多いことを特徴とする複合部材。 - 請求項1記載の複合部材からなる配線基板上に少なくとも1つ以上の電子部品が電気的に接続されてなることを特徴とする電子パッケージ。
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JP2005329173A JP4314236B2 (ja) | 2000-03-31 | 2005-11-14 | 複合部材の製造方法、感光性組成物、複合部材製造用の絶縁体、複合部材、多層配線基板及び電子パッケージ |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010027818A (ja) * | 2008-07-18 | 2010-02-04 | Semiconductor Energy Lab Co Ltd | 配線基板及びその作製方法、並びに、半導体装置及びその作製方法 |
JP2011210968A (ja) * | 2010-03-30 | 2011-10-20 | Fujifilm Corp | 多層配線基板 |
CN112166653A (zh) * | 2018-03-15 | 2021-01-01 | 以色列商普林特电路板有限公司 | 双组分可印刷导电组合物 |
WO2022234748A1 (ja) * | 2021-05-07 | 2022-11-10 | 株式会社村田製作所 | アンテナ素子、電子機器及びアンテナ素子の製造方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010027818A (ja) * | 2008-07-18 | 2010-02-04 | Semiconductor Energy Lab Co Ltd | 配線基板及びその作製方法、並びに、半導体装置及びその作製方法 |
JP2011210968A (ja) * | 2010-03-30 | 2011-10-20 | Fujifilm Corp | 多層配線基板 |
CN112166653A (zh) * | 2018-03-15 | 2021-01-01 | 以色列商普林特电路板有限公司 | 双组分可印刷导电组合物 |
WO2022234748A1 (ja) * | 2021-05-07 | 2022-11-10 | 株式会社村田製作所 | アンテナ素子、電子機器及びアンテナ素子の製造方法 |
JP7420315B2 (ja) | 2021-05-07 | 2024-01-23 | 株式会社村田製作所 | アンテナ素子、電子機器及びアンテナ素子の製造方法 |
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