JP7420315B2 - アンテナ素子、電子機器及びアンテナ素子の製造方法 - Google Patents

アンテナ素子、電子機器及びアンテナ素子の製造方法 Download PDF

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Publication number
JP7420315B2
JP7420315B2 JP2023518641A JP2023518641A JP7420315B2 JP 7420315 B2 JP7420315 B2 JP 7420315B2 JP 2023518641 A JP2023518641 A JP 2023518641A JP 2023518641 A JP2023518641 A JP 2023518641A JP 7420315 B2 JP7420315 B2 JP 7420315B2
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Japan
Prior art keywords
base material
insulating base
antenna element
conductor layer
dielectric constant
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JP2023518641A
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English (en)
Japanese (ja)
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JPWO2022234748A5 (https=
JPWO2022234748A1 (https=
Inventor
伸郎 池本
恒亮 西尾
薫 須藤
敬一 市川
信之 天野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Waveguide Aerials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023518641A 2021-05-07 2022-03-29 アンテナ素子、電子機器及びアンテナ素子の製造方法 Active JP7420315B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021079044 2021-05-07
JP2021079044 2021-05-07
PCT/JP2022/015284 WO2022234748A1 (ja) 2021-05-07 2022-03-29 アンテナ素子、電子機器及びアンテナ素子の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022234748A1 JPWO2022234748A1 (https=) 2022-11-10
JPWO2022234748A5 JPWO2022234748A5 (https=) 2023-12-04
JP7420315B2 true JP7420315B2 (ja) 2024-01-23

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ID=83932155

Family Applications (1)

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JP2023518641A Active JP7420315B2 (ja) 2021-05-07 2022-03-29 アンテナ素子、電子機器及びアンテナ素子の製造方法

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Country Link
US (1) US12438261B2 (https=)
JP (1) JP7420315B2 (https=)
CN (1) CN220856913U (https=)
WO (1) WO2022234748A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7803439B2 (ja) * 2023-01-11 2026-01-21 株式会社村田製作所 多層基板

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308470A (ja) 2000-04-26 2001-11-02 Matsushita Electric Ind Co Ltd 回路部品モジュール及びその製造方法
JP2006100450A (ja) 2004-09-28 2006-04-13 Toshiba Corp 多孔質配線基板
JP2006108702A (ja) 2000-03-31 2006-04-20 Toshiba Corp 複合部材の製造方法、感光性組成物、複合部材製造用の絶縁体、複合部材、多層配線基板及び電子パッケージ
JP2007068037A (ja) 2005-09-01 2007-03-15 Furukawa Electric Co Ltd:The 多周波共用アンテナ
JP2014011769A (ja) 2012-07-03 2014-01-20 Nitto Denko Corp 無線周波数モジュール用基板およびその製造方法
WO2015083216A1 (ja) 2013-12-02 2015-06-11 山一電機株式会社 多層基板、及び、その製造方法
US20190089053A1 (en) 2017-09-20 2019-03-21 Apple Inc. Antenna Arrays Having Surface Wave Interference Mitigation Structures
JP2021044475A (ja) 2019-09-13 2021-03-18 日東電工株式会社 配線回路基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6709806B2 (en) * 2000-03-31 2004-03-23 Kabushiki Kaisha Toshiba Method of forming composite member
JP2004096259A (ja) 2002-08-30 2004-03-25 Matsushita Electric Ind Co Ltd 多周波マイクロストリップアンテナ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108702A (ja) 2000-03-31 2006-04-20 Toshiba Corp 複合部材の製造方法、感光性組成物、複合部材製造用の絶縁体、複合部材、多層配線基板及び電子パッケージ
JP2001308470A (ja) 2000-04-26 2001-11-02 Matsushita Electric Ind Co Ltd 回路部品モジュール及びその製造方法
JP2006100450A (ja) 2004-09-28 2006-04-13 Toshiba Corp 多孔質配線基板
JP2007068037A (ja) 2005-09-01 2007-03-15 Furukawa Electric Co Ltd:The 多周波共用アンテナ
JP2014011769A (ja) 2012-07-03 2014-01-20 Nitto Denko Corp 無線周波数モジュール用基板およびその製造方法
WO2015083216A1 (ja) 2013-12-02 2015-06-11 山一電機株式会社 多層基板、及び、その製造方法
US20190089053A1 (en) 2017-09-20 2019-03-21 Apple Inc. Antenna Arrays Having Surface Wave Interference Mitigation Structures
JP2021044475A (ja) 2019-09-13 2021-03-18 日東電工株式会社 配線回路基板

Also Published As

Publication number Publication date
CN220856913U (zh) 2024-04-26
US20240047865A1 (en) 2024-02-08
WO2022234748A1 (ja) 2022-11-10
US12438261B2 (en) 2025-10-07
JPWO2022234748A1 (https=) 2022-11-10

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