JPWO2024171659A5 - - Google Patents

Info

Publication number
JPWO2024171659A5
JPWO2024171659A5 JP2025500714A JP2025500714A JPWO2024171659A5 JP WO2024171659 A5 JPWO2024171659 A5 JP WO2024171659A5 JP 2025500714 A JP2025500714 A JP 2025500714A JP 2025500714 A JP2025500714 A JP 2025500714A JP WO2024171659 A5 JPWO2024171659 A5 JP WO2024171659A5
Authority
JP
Japan
Prior art keywords
layer
axis
insulator layer
hole
multilayer substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025500714A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024171659A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/000392 external-priority patent/WO2024171659A1/ja
Publication of JPWO2024171659A1 publication Critical patent/JPWO2024171659A1/ja
Publication of JPWO2024171659A5 publication Critical patent/JPWO2024171659A5/ja
Pending legal-status Critical Current

Links

JP2025500714A 2023-02-16 2024-01-11 Pending JPWO2024171659A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023022143 2023-02-16
PCT/JP2024/000392 WO2024171659A1 (ja) 2023-02-16 2024-01-11 多層基板、電子機器及び多層基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024171659A1 JPWO2024171659A1 (https=) 2024-08-22
JPWO2024171659A5 true JPWO2024171659A5 (https=) 2025-09-17

Family

ID=92421531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025500714A Pending JPWO2024171659A1 (https=) 2023-02-16 2024-01-11

Country Status (3)

Country Link
US (1) US20250365857A1 (https=)
JP (1) JPWO2024171659A1 (https=)
WO (1) WO2024171659A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227588A (en) * 1991-03-25 1993-07-13 Hughes Aircraft Company Interconnection of opposite sides of a circuit board
KR20080107933A (ko) * 2007-06-08 2008-12-11 삼성전기주식회사 도전성 페이스트 조성물 및 저온동시소성 세라믹 기판
JP2011009694A (ja) * 2009-05-27 2011-01-13 Kyocera Corp 配線基板およびプローブカードならびに電子装置
JP7075785B2 (ja) * 2018-03-08 2022-05-26 スタンレー電気株式会社 回路基板、電子回路装置、および、回路基板の製造方法
US20200006233A1 (en) * 2018-07-02 2020-01-02 International Business Machines Corporation Pin assemblies for plated vias
JP7151784B2 (ja) * 2018-12-13 2022-10-12 株式会社村田製作所 樹脂多層基板および電子機器
JP7381323B2 (ja) * 2019-12-17 2023-11-15 日東電工株式会社 両面配線回路基板の製造方法および両面配線回路基板

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