JP2022028180A5 - - Google Patents
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- JP2022028180A5 JP2022028180A5 JP2020131418A JP2020131418A JP2022028180A5 JP 2022028180 A5 JP2022028180 A5 JP 2022028180A5 JP 2020131418 A JP2020131418 A JP 2020131418A JP 2020131418 A JP2020131418 A JP 2020131418A JP 2022028180 A5 JP2022028180 A5 JP 2022028180A5
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- 238000007789 sealing Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020131418A JP7591885B2 (ja) | 2020-08-03 | 2020-08-03 | デバイス |
| TW110100939A TWI759064B (zh) | 2020-08-03 | 2021-01-11 | 密封裝置以及該裝置之製造方法 |
| US17/153,298 US11315809B2 (en) | 2020-08-03 | 2021-01-20 | Device and forming method of device |
| CN202110072582.4A CN114068441B (zh) | 2020-08-03 | 2021-01-20 | 器件及器件的形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020131418A JP7591885B2 (ja) | 2020-08-03 | 2020-08-03 | デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022028180A JP2022028180A (ja) | 2022-02-16 |
| JP2022028180A5 true JP2022028180A5 (https=) | 2023-08-02 |
| JP7591885B2 JP7591885B2 (ja) | 2024-11-29 |
Family
ID=80003271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020131418A Active JP7591885B2 (ja) | 2020-08-03 | 2020-08-03 | デバイス |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11315809B2 (https=) |
| JP (1) | JP7591885B2 (https=) |
| CN (1) | CN114068441B (https=) |
| TW (1) | TWI759064B (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI774184B (zh) * | 2020-03-18 | 2022-08-11 | 日商日本航空電子工業股份有限公司 | 可薄型化半導體裝置及其製造方法 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52168744U (https=) * | 1976-06-14 | 1977-12-21 | ||
| JPS6429196U (https=) * | 1987-08-18 | 1989-02-21 | ||
| JPH052475Y2 (https=) * | 1987-10-01 | 1993-01-21 | ||
| JPH01309343A (ja) * | 1988-06-08 | 1989-12-13 | Fuji Electric Co Ltd | 半導体装置の実装方法 |
| JPH04294770A (ja) * | 1991-03-20 | 1992-10-19 | Toshiba Corp | 帯電防止性梱包材 |
| US6045652A (en) * | 1992-06-17 | 2000-04-04 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
| US5776278A (en) | 1992-06-17 | 1998-07-07 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
| JP3378338B2 (ja) * | 1994-03-01 | 2003-02-17 | 新光電気工業株式会社 | 半導体集積回路装置 |
| JP3537400B2 (ja) | 2000-03-17 | 2004-06-14 | 松下電器産業株式会社 | 半導体内蔵モジュール及びその製造方法 |
| JP2004055860A (ja) * | 2002-07-22 | 2004-02-19 | Renesas Technology Corp | 半導体装置の製造方法 |
| US7261793B2 (en) * | 2004-08-13 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | System and method for low temperature plasma-enhanced bonding |
| JP2007287635A (ja) | 2006-04-20 | 2007-11-01 | Kuroi Electric Co Ltd | 位相制御回路 |
| JP4226614B2 (ja) * | 2006-05-12 | 2009-02-18 | パナソニック株式会社 | 電子回路形成品の製造方法 |
| JP5303963B2 (ja) * | 2008-02-29 | 2013-10-02 | 凸版印刷株式会社 | 剥離フィルムを有する包装体およびその製造方法 |
| DE102009012255A1 (de) * | 2009-03-07 | 2010-09-09 | Michalk, Manfred, Dr. | Schaltungsanordnung |
| JP2010287635A (ja) | 2009-06-09 | 2010-12-24 | Tamura Seisakusho Co Ltd | リフロー装置 |
| JP5081267B2 (ja) * | 2010-03-25 | 2012-11-28 | パナソニック株式会社 | 回路部品内蔵モジュールおよび回路部品内蔵モジュールの製造方法 |
| JP5414627B2 (ja) * | 2010-06-07 | 2014-02-12 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
| US9412717B2 (en) * | 2011-11-04 | 2016-08-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and methods for molded underfills in flip chip packaging |
| KR101347541B1 (ko) * | 2012-03-02 | 2014-01-06 | 삼성디스플레이 주식회사 | 유기 발광 장치의 제조 방법 |
| CN102956675A (zh) * | 2012-10-18 | 2013-03-06 | 京东方科技集团股份有限公司 | 干燥剂层制备方法、有机发光二极管显示屏及其封装方法 |
| TWI509858B (zh) * | 2013-03-29 | 2015-11-21 | Ta Jo Liu | 有機半導體裝置 |
| AT514074B1 (de) * | 2013-04-02 | 2014-10-15 | Austria Tech & System Tech | Verfahren zum Herstellen eines Leiterplattenelements |
| KR20150016876A (ko) | 2013-08-05 | 2015-02-13 | 주식회사 엘지화학 | 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법 |
| WO2015041049A1 (ja) * | 2013-09-20 | 2015-03-26 | 株式会社村田製作所 | 圧電センサ |
| TW201818581A (zh) * | 2016-11-08 | 2018-05-16 | 智晶光電股份有限公司 | 可圖形化封裝之柔性有機發光二極體 |
| EP3591741B1 (en) | 2017-03-03 | 2021-01-13 | Nissan Motor Co., Ltd. | Secondary battery and secondary battery control method |
| JP6454766B2 (ja) | 2017-04-27 | 2019-01-16 | 株式会社Jmt | 異方導電性シートおよび異方導電性シートを用いた電気的接続装置 |
| KR20200002883A (ko) | 2017-04-28 | 2020-01-08 | 히타치가세이가부시끼가이샤 | 중공 봉지 구조체 |
| US20180358770A1 (en) * | 2017-06-10 | 2018-12-13 | Neoconix, Inc. | Electrical Connector with Electrical Contacts Protected by a Layer of Compressible Material and Method of Making It |
| TWI779077B (zh) | 2017-09-08 | 2022-10-01 | 日商杜邦東麗特殊材料股份有限公司 | 密封光半導體元件的製造方法 |
-
2020
- 2020-08-03 JP JP2020131418A patent/JP7591885B2/ja active Active
-
2021
- 2021-01-11 TW TW110100939A patent/TWI759064B/zh active
- 2021-01-20 US US17/153,298 patent/US11315809B2/en active Active
- 2021-01-20 CN CN202110072582.4A patent/CN114068441B/zh active Active
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