JP2021153164A5 - - Google Patents

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Publication number
JP2021153164A5
JP2021153164A5 JP2020131420A JP2020131420A JP2021153164A5 JP 2021153164 A5 JP2021153164 A5 JP 2021153164A5 JP 2020131420 A JP2020131420 A JP 2020131420A JP 2020131420 A JP2020131420 A JP 2020131420A JP 2021153164 A5 JP2021153164 A5 JP 2021153164A5
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JP
Japan
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perspective
film
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JP2020131420A
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English (en)
Japanese (ja)
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JP7591886B2 (ja
JP2021153164A (ja
Filing date
Publication date
Application filed filed Critical
Priority to TW110100938A priority Critical patent/TWI774184B/zh
Priority to CN202110072581.XA priority patent/CN113496964B/zh
Priority to US17/152,877 priority patent/US11469150B2/en
Priority to EP21152624.9A priority patent/EP3882014B1/en
Priority to KR1020210008812A priority patent/KR102495771B1/ko
Publication of JP2021153164A publication Critical patent/JP2021153164A/ja
Publication of JP2021153164A5 publication Critical patent/JP2021153164A5/ja
Application granted granted Critical
Publication of JP7591886B2 publication Critical patent/JP7591886B2/ja
Active legal-status Critical Current
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JP2020131420A 2020-03-18 2020-08-03 デバイス Active JP7591886B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW110100938A TWI774184B (zh) 2020-03-18 2021-01-11 可薄型化半導體裝置及其製造方法
CN202110072581.XA CN113496964B (zh) 2020-03-18 2021-01-20 器件及器件的形成方法
US17/152,877 US11469150B2 (en) 2020-03-18 2021-01-20 Device and forming method of device
EP21152624.9A EP3882014B1 (en) 2020-03-18 2021-01-20 Device and forming method of device
KR1020210008812A KR102495771B1 (ko) 2020-03-18 2021-01-21 디바이스 및 디바이스의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020047177 2020-03-18
JP2020047177 2020-03-18

Publications (3)

Publication Number Publication Date
JP2021153164A JP2021153164A (ja) 2021-09-30
JP2021153164A5 true JP2021153164A5 (https=) 2023-08-02
JP7591886B2 JP7591886B2 (ja) 2024-11-29

Family

ID=77886729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020131420A Active JP7591886B2 (ja) 2020-03-18 2020-08-03 デバイス

Country Status (3)

Country Link
JP (1) JP7591886B2 (https=)
KR (1) KR102495771B1 (https=)
CN (1) CN113496964B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023113372A (ja) * 2022-02-03 2023-08-16 日本航空電子工業株式会社 デバイス

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52168744U (https=) * 1976-06-14 1977-12-21
US4933042A (en) * 1986-09-26 1990-06-12 General Electric Company Method for packaging integrated circuit chips employing a polymer film overlay layer
JPS6429196U (https=) * 1987-08-18 1989-02-21
JPH052475Y2 (https=) * 1987-10-01 1993-01-21
JPH01309343A (ja) * 1988-06-08 1989-12-13 Fuji Electric Co Ltd 半導体装置の実装方法
JPH04294770A (ja) * 1991-03-20 1992-10-19 Toshiba Corp 帯電防止性梱包材
US5776278A (en) * 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
JP3378338B2 (ja) * 1994-03-01 2003-02-17 新光電気工業株式会社 半導体集積回路装置
JP3537400B2 (ja) 2000-03-17 2004-06-14 松下電器産業株式会社 半導体内蔵モジュール及びその製造方法
JP2006216758A (ja) * 2005-02-03 2006-08-17 Three M Innovative Properties Co プリント回路基板の接続方法
JP4226614B2 (ja) * 2006-05-12 2009-02-18 パナソニック株式会社 電子回路形成品の製造方法
JP4581011B2 (ja) * 2008-01-25 2010-11-17 株式会社東芝 電気部品とその製造方法
JP5303963B2 (ja) * 2008-02-29 2013-10-02 凸版印刷株式会社 剥離フィルムを有する包装体およびその製造方法
KR101306190B1 (ko) * 2010-12-02 2013-09-09 주식회사 엘지화학 절연성이 향상된 이차전지
JP2013110492A (ja) * 2011-11-18 2013-06-06 Seiko Epson Corp 電子デバイス用パッケージ、電子デバイス、電子機器及び電子デバイスの製造方法
WO2015041049A1 (ja) * 2013-09-20 2015-03-26 株式会社村田製作所 圧電センサ
TWI779077B (zh) * 2017-09-08 2022-10-01 日商杜邦東麗特殊材料股份有限公司 密封光半導體元件的製造方法

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