KR102495771B1 - 디바이스 및 디바이스의 제조 방법 - Google Patents

디바이스 및 디바이스의 제조 방법 Download PDF

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Publication number
KR102495771B1
KR102495771B1 KR1020210008812A KR20210008812A KR102495771B1 KR 102495771 B1 KR102495771 B1 KR 102495771B1 KR 1020210008812 A KR1020210008812 A KR 1020210008812A KR 20210008812 A KR20210008812 A KR 20210008812A KR 102495771 B1 KR102495771 B1 KR 102495771B1
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KR
South Korea
Prior art keywords
film
contact
circuit member
circuit
seal
Prior art date
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KR1020210008812A
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English (en)
Korean (ko)
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KR20210117143A (ko
Inventor
신지 우에다
Original Assignee
니혼 고꾸 덴시 고교 가부시끼가이샤
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Publication of KR20210117143A publication Critical patent/KR20210117143A/ko
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    • H01L23/3135—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A61B5/024—Measuring pulse rate or heart rate
    • H01L21/56—
    • H01L23/345—
    • H01L23/367—
    • H01L23/485—
    • H01L24/26—
    • H01L24/83—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cardiology (AREA)
  • Medical Informatics (AREA)
  • Surgery (AREA)
  • Biophysics (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Physiology (AREA)
  • Molecular Biology (AREA)
  • Physics & Mathematics (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Push-Button Switches (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Bag Frames (AREA)
KR1020210008812A 2020-03-18 2021-01-21 디바이스 및 디바이스의 제조 방법 Active KR102495771B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020047177 2020-03-18
JPJP-P-2020-047177 2020-03-18
JPJP-P-2020-131420 2020-08-03
JP2020131420A JP7591886B2 (ja) 2020-03-18 2020-08-03 デバイス

Publications (2)

Publication Number Publication Date
KR20210117143A KR20210117143A (ko) 2021-09-28
KR102495771B1 true KR102495771B1 (ko) 2023-02-06

Family

ID=77886729

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210008812A Active KR102495771B1 (ko) 2020-03-18 2021-01-21 디바이스 및 디바이스의 제조 방법

Country Status (3)

Country Link
JP (1) JP7591886B2 (https=)
KR (1) KR102495771B1 (https=)
CN (1) CN113496964B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023113372A (ja) * 2022-02-03 2023-08-16 日本航空電子工業株式会社 デバイス

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010007335A1 (en) * 1992-06-17 2001-07-12 Tuttle Mark E. Method of manufacturing an enclosed transceiver
KR101306190B1 (ko) * 2010-12-02 2013-09-09 주식회사 엘지화학 절연성이 향상된 이차전지

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52168744U (https=) * 1976-06-14 1977-12-21
US4933042A (en) * 1986-09-26 1990-06-12 General Electric Company Method for packaging integrated circuit chips employing a polymer film overlay layer
JPS6429196U (https=) * 1987-08-18 1989-02-21
JPH052475Y2 (https=) * 1987-10-01 1993-01-21
JPH01309343A (ja) * 1988-06-08 1989-12-13 Fuji Electric Co Ltd 半導体装置の実装方法
JPH04294770A (ja) * 1991-03-20 1992-10-19 Toshiba Corp 帯電防止性梱包材
JP3378338B2 (ja) * 1994-03-01 2003-02-17 新光電気工業株式会社 半導体集積回路装置
JP3537400B2 (ja) 2000-03-17 2004-06-14 松下電器産業株式会社 半導体内蔵モジュール及びその製造方法
JP2006216758A (ja) * 2005-02-03 2006-08-17 Three M Innovative Properties Co プリント回路基板の接続方法
JP4226614B2 (ja) * 2006-05-12 2009-02-18 パナソニック株式会社 電子回路形成品の製造方法
JP4581011B2 (ja) * 2008-01-25 2010-11-17 株式会社東芝 電気部品とその製造方法
JP5303963B2 (ja) * 2008-02-29 2013-10-02 凸版印刷株式会社 剥離フィルムを有する包装体およびその製造方法
JP2013110492A (ja) * 2011-11-18 2013-06-06 Seiko Epson Corp 電子デバイス用パッケージ、電子デバイス、電子機器及び電子デバイスの製造方法
WO2015041049A1 (ja) * 2013-09-20 2015-03-26 株式会社村田製作所 圧電センサ
TWI779077B (zh) * 2017-09-08 2022-10-01 日商杜邦東麗特殊材料股份有限公司 密封光半導體元件的製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010007335A1 (en) * 1992-06-17 2001-07-12 Tuttle Mark E. Method of manufacturing an enclosed transceiver
KR101306190B1 (ko) * 2010-12-02 2013-09-09 주식회사 엘지화학 절연성이 향상된 이차전지

Also Published As

Publication number Publication date
KR20210117143A (ko) 2021-09-28
CN113496964A (zh) 2021-10-12
JP7591886B2 (ja) 2024-11-29
JP2021153164A (ja) 2021-09-30
CN113496964B (zh) 2024-12-10

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