JP7591886B2 - デバイス - Google Patents

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Publication number
JP7591886B2
JP7591886B2 JP2020131420A JP2020131420A JP7591886B2 JP 7591886 B2 JP7591886 B2 JP 7591886B2 JP 2020131420 A JP2020131420 A JP 2020131420A JP 2020131420 A JP2020131420 A JP 2020131420A JP 7591886 B2 JP7591886 B2 JP 7591886B2
Authority
JP
Japan
Prior art keywords
film
contact
circuit member
seal
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020131420A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021153164A (ja
JP2021153164A5 (https=
Inventor
真慈 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Aviation Electronics Industry Ltd
Original Assignee
Japan Aviation Electronics Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electronics Industry Ltd filed Critical Japan Aviation Electronics Industry Ltd
Priority to TW110100938A priority Critical patent/TWI774184B/zh
Priority to CN202110072581.XA priority patent/CN113496964B/zh
Priority to US17/152,877 priority patent/US11469150B2/en
Priority to EP21152624.9A priority patent/EP3882014B1/en
Priority to KR1020210008812A priority patent/KR102495771B1/ko
Publication of JP2021153164A publication Critical patent/JP2021153164A/ja
Publication of JP2021153164A5 publication Critical patent/JP2021153164A5/ja
Application granted granted Critical
Publication of JP7591886B2 publication Critical patent/JP7591886B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A61B5/024—Measuring pulse rate or heart rate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cardiology (AREA)
  • Medical Informatics (AREA)
  • Surgery (AREA)
  • Biophysics (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Physiology (AREA)
  • Molecular Biology (AREA)
  • Physics & Mathematics (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Push-Button Switches (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Bag Frames (AREA)
JP2020131420A 2020-03-18 2020-08-03 デバイス Active JP7591886B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW110100938A TWI774184B (zh) 2020-03-18 2021-01-11 可薄型化半導體裝置及其製造方法
CN202110072581.XA CN113496964B (zh) 2020-03-18 2021-01-20 器件及器件的形成方法
US17/152,877 US11469150B2 (en) 2020-03-18 2021-01-20 Device and forming method of device
EP21152624.9A EP3882014B1 (en) 2020-03-18 2021-01-20 Device and forming method of device
KR1020210008812A KR102495771B1 (ko) 2020-03-18 2021-01-21 디바이스 및 디바이스의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020047177 2020-03-18
JP2020047177 2020-03-18

Publications (3)

Publication Number Publication Date
JP2021153164A JP2021153164A (ja) 2021-09-30
JP2021153164A5 JP2021153164A5 (https=) 2023-08-02
JP7591886B2 true JP7591886B2 (ja) 2024-11-29

Family

ID=77886729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020131420A Active JP7591886B2 (ja) 2020-03-18 2020-08-03 デバイス

Country Status (3)

Country Link
JP (1) JP7591886B2 (https=)
KR (1) KR102495771B1 (https=)
CN (1) CN113496964B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023113372A (ja) * 2022-02-03 2023-08-16 日本航空電子工業株式会社 デバイス

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310870A (ja) 2006-05-12 2006-11-09 Matsushita Electric Ind Co Ltd 電子回路形成品の製造方法
JP2009202929A (ja) 2008-02-29 2009-09-10 Toppan Printing Co Ltd 剥離フィルムを有する包装体およびその製造方法
WO2015041049A1 (ja) 2013-09-20 2015-03-26 株式会社村田製作所 圧電センサ

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52168744U (https=) * 1976-06-14 1977-12-21
US4933042A (en) * 1986-09-26 1990-06-12 General Electric Company Method for packaging integrated circuit chips employing a polymer film overlay layer
JPS6429196U (https=) * 1987-08-18 1989-02-21
JPH052475Y2 (https=) * 1987-10-01 1993-01-21
JPH01309343A (ja) * 1988-06-08 1989-12-13 Fuji Electric Co Ltd 半導体装置の実装方法
JPH04294770A (ja) * 1991-03-20 1992-10-19 Toshiba Corp 帯電防止性梱包材
US5776278A (en) * 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
JP3378338B2 (ja) * 1994-03-01 2003-02-17 新光電気工業株式会社 半導体集積回路装置
JP3537400B2 (ja) 2000-03-17 2004-06-14 松下電器産業株式会社 半導体内蔵モジュール及びその製造方法
JP2006216758A (ja) * 2005-02-03 2006-08-17 Three M Innovative Properties Co プリント回路基板の接続方法
JP4581011B2 (ja) * 2008-01-25 2010-11-17 株式会社東芝 電気部品とその製造方法
KR101306190B1 (ko) * 2010-12-02 2013-09-09 주식회사 엘지화학 절연성이 향상된 이차전지
JP2013110492A (ja) * 2011-11-18 2013-06-06 Seiko Epson Corp 電子デバイス用パッケージ、電子デバイス、電子機器及び電子デバイスの製造方法
TWI779077B (zh) * 2017-09-08 2022-10-01 日商杜邦東麗特殊材料股份有限公司 密封光半導體元件的製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310870A (ja) 2006-05-12 2006-11-09 Matsushita Electric Ind Co Ltd 電子回路形成品の製造方法
JP2009202929A (ja) 2008-02-29 2009-09-10 Toppan Printing Co Ltd 剥離フィルムを有する包装体およびその製造方法
WO2015041049A1 (ja) 2013-09-20 2015-03-26 株式会社村田製作所 圧電センサ

Also Published As

Publication number Publication date
KR20210117143A (ko) 2021-09-28
CN113496964A (zh) 2021-10-12
KR102495771B1 (ko) 2023-02-06
JP2021153164A (ja) 2021-09-30
CN113496964B (zh) 2024-12-10

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