JP2024050679A5 - - Google Patents

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Publication number
JP2024050679A5
JP2024050679A5 JP2024009105A JP2024009105A JP2024050679A5 JP 2024050679 A5 JP2024050679 A5 JP 2024050679A5 JP 2024009105 A JP2024009105 A JP 2024009105A JP 2024009105 A JP2024009105 A JP 2024009105A JP 2024050679 A5 JP2024050679 A5 JP 2024050679A5
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JP
Japan
Prior art keywords
conductor
substrate
openings
opening
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024009105A
Other languages
English (en)
Japanese (ja)
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JP2024050679A (ja
Filing date
Publication date
Priority claimed from PCT/JP2021/035477 external-priority patent/WO2022071256A1/ja
Application filed filed Critical
Publication of JP2024050679A publication Critical patent/JP2024050679A/ja
Publication of JP2024050679A5 publication Critical patent/JP2024050679A5/ja
Pending legal-status Critical Current

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JP2024009105A 2020-09-30 2024-01-25 配線基体および電子装置 Pending JP2024050679A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020165236 2020-09-30
JP2020165236 2020-09-30
PCT/JP2021/035477 WO2022071256A1 (ja) 2020-09-30 2021-09-28 配線基体および電子装置
JP2022553973A JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2022553973A Division JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置

Publications (2)

Publication Number Publication Date
JP2024050679A JP2024050679A (ja) 2024-04-10
JP2024050679A5 true JP2024050679A5 (enExample) 2025-03-31

Family

ID=80950381

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022553973A Active JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置
JP2024009105A Pending JP2024050679A (ja) 2020-09-30 2024-01-25 配線基体および電子装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2022553973A Active JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置

Country Status (5)

Country Link
US (1) US20240074035A1 (enExample)
EP (1) EP4224519A4 (enExample)
JP (2) JP7428821B2 (enExample)
CN (1) CN116235293A (enExample)
WO (1) WO2022071256A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115343812B (zh) * 2022-08-22 2023-10-17 德阳三环科技有限公司 输入输出构件和制备方法及封装基座和光器件

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3170030B2 (ja) * 1992-03-17 2001-05-28 新光電気工業株式会社 高周波用電子部品の信号線路
US6891731B1 (en) * 1999-11-01 2005-05-10 Advanced Micro Devices, Inc. Crosstalk cancellation for integrated circuit package configuration
US6624729B2 (en) * 2000-12-29 2003-09-23 Hewlett-Packard Development Company, L.P. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
JP2006086293A (ja) * 2004-09-15 2006-03-30 Canon Inc プリント配線基板及び該配線基板のグランドパターン設計方法
KR101454720B1 (ko) * 2010-12-03 2014-10-27 가부시키가이샤 무라타 세이사쿠쇼 고주파 신호선로 및 전자기기
JP5842850B2 (ja) * 2012-06-29 2016-01-13 株式会社村田製作所 フラットケーブルおよび電子機器
JP6272131B2 (ja) * 2014-05-02 2018-01-31 日本電信電話株式会社 光モジュール
CN205828619U (zh) * 2014-05-29 2016-12-21 株式会社村田制作所 高频信号线路以及包括该高频信号线路的电子设备
EP3300104A4 (en) * 2015-05-20 2019-01-09 Kyocera Corporation SEMICONDUCTOR ELEMENT HOUSING, SEMICONDUCTOR ELEMENT AND MOUNTING STRUCTURE
JP6441850B2 (ja) * 2016-03-31 2018-12-19 Ritaエレクトロニクス株式会社 多層プリント配線板
JP6724648B2 (ja) * 2016-08-16 2020-07-15 富士ゼロックス株式会社 配線基板
JP6825986B2 (ja) * 2017-05-26 2021-02-03 京セラ株式会社 配線基板、電子部品収納用パッケージおよび電子装置
JP6939603B2 (ja) 2018-01-26 2021-09-22 住友電気工業株式会社 光受信モジュール用パッケージ
JP7100487B2 (ja) * 2018-04-27 2022-07-13 京セラ株式会社 印刷配線板
CN113519048B (zh) * 2019-03-07 2024-09-24 京瓷株式会社 布线基板、电子部件用封装体以及电子装置

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