JPWO2024071069A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2024071069A5 JPWO2024071069A5 JP2024549390A JP2024549390A JPWO2024071069A5 JP WO2024071069 A5 JPWO2024071069 A5 JP WO2024071069A5 JP 2024549390 A JP2024549390 A JP 2024549390A JP 2024549390 A JP2024549390 A JP 2024549390A JP WO2024071069 A5 JPWO2024071069 A5 JP WO2024071069A5
- Authority
- JP
- Japan
- Prior art keywords
- periphery
- insulating substrate
- region
- wiring board
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022155322 | 2022-09-28 | ||
| PCT/JP2023/034821 WO2024071069A1 (ja) | 2022-09-28 | 2023-09-26 | 配線基板およびそれを用いた実装構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024071069A1 JPWO2024071069A1 (enExample) | 2024-04-04 |
| JPWO2024071069A5 true JPWO2024071069A5 (enExample) | 2025-05-30 |
Family
ID=90477855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024549390A Pending JPWO2024071069A1 (enExample) | 2022-09-28 | 2023-09-26 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4598286A1 (enExample) |
| JP (1) | JPWO2024071069A1 (enExample) |
| CN (1) | CN119856576A (enExample) |
| WO (1) | WO2024071069A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025244106A1 (ja) * | 2024-05-24 | 2025-11-27 | 京セラ株式会社 | 配線基板および実装構造体 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3367886B2 (ja) * | 1998-01-20 | 2003-01-20 | 株式会社村田製作所 | 電子回路装置 |
| JP2005277023A (ja) * | 2004-03-24 | 2005-10-06 | Nec Corp | プリント回路基板、およびプリント配線基板とコネクタとの接着方法 |
| JP4138689B2 (ja) | 2004-03-30 | 2008-08-27 | 株式会社東芝 | インターフェイスモジュール付ｌｓｉパッケージ及びｌｓｉパッケージ |
| CA2685971C (en) | 2006-05-05 | 2017-02-07 | Reflex Photonics Inc. | Optically-enabled integrated circuit package |
| JP4589428B2 (ja) * | 2008-08-19 | 2010-12-01 | アルプス電気株式会社 | 半導体チップモジュール |
| JP5502139B2 (ja) * | 2012-05-16 | 2014-05-28 | 日本特殊陶業株式会社 | 配線基板 |
-
2023
- 2023-09-26 JP JP2024549390A patent/JPWO2024071069A1/ja active Pending
- 2023-09-26 WO PCT/JP2023/034821 patent/WO2024071069A1/ja not_active Ceased
- 2023-09-26 EP EP23872292.0A patent/EP4598286A1/en active Pending
- 2023-09-26 CN CN202380068057.2A patent/CN119856576A/zh active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR960018636A (ko) | 가요성구조를 지닌 광모듈용 회로기판 | |
| JP2024036569A5 (enExample) | ||
| JP7032942B2 (ja) | 光導波路および光回路基板 | |
| JPWO2024071069A5 (enExample) | ||
| CN218513447U (zh) | 模块 | |
| TWI399145B (zh) | 配線電路基板及其製造方法 | |
| JP2010278133A (ja) | 回路基板 | |
| JPWO2023162964A5 (enExample) | ||
| JP4083142B2 (ja) | 半導体装置 | |
| KR100300624B1 (ko) | 전자부품탑재용기판및그의제조방법 | |
| KR102605794B1 (ko) | 배선 회로 기판, 및 촬상 장치 | |
| CN212812140U (zh) | 感应芯片、线路板及电子设备 | |
| TWI267972B (en) | Substrate with slot | |
| JP2017174841A (ja) | フレキシブル配線板及び表示装置 | |
| JP4072415B2 (ja) | フレキシブル回路基板 | |
| JP2906756B2 (ja) | 電子部品搭載用基板 | |
| JP7124078B2 (ja) | 配線基板 | |
| CN112638054A (zh) | 线路板的制作方法 | |
| KR102720811B1 (ko) | 전자 부품, 전자 부품의 제조 방법, 전자 장치 | |
| CN110600446B (zh) | 带状配线基板以及半导体装置 | |
| JPWO2022239718A5 (enExample) | ||
| JPWO2024135849A5 (enExample) | ||
| CN119031577A (zh) | 印刷电路板组件 | |
| TWI551201B (zh) | 光源裝置 | |
| TW202505948A (zh) | 電路板及其製造方法 |